Electronic Packaging Science And Technology

Author : King-Ning Tu,Chih Chen,Hung-Ming Chen
Publisher : John Wiley & Sons
Page : 340 pages
File Size : 54,9 Mb
Release : 2021-12-29
Category : Science
ISBN : 9781119418313

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Electronic Packaging Science and Technology by King-Ning Tu,Chih Chen,Hung-Ming Chen Pdf

Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

Author : Gerald L. Ginsberg
Publisher : Springer Science & Business Media
Page : 285 pages
File Size : 48,7 Mb
Release : 2013-11-27
Category : Science
ISBN : 9781461535423

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Electronic Equipment Packaging Technology by Gerald L. Ginsberg Pdf

The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.

Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 53,6 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988

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Materials for Advanced Packaging by Daniel Lu,C.P. Wong Pdf

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Author : John H. Lau,John Prince,C. P. Wong,Wataru Nakayama
Publisher : McGraw-Hill Professional Publishing
Page : 0 pages
File Size : 41,5 Mb
Release : 1998
Category : Electronic packaging
ISBN : 0070371350

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Electronic Packaging by John H. Lau,John Prince,C. P. Wong,Wataru Nakayama Pdf

Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Author : Beth Keser,Steffen Kröhnert
Publisher : John Wiley & Sons
Page : 576 pages
File Size : 41,8 Mb
Release : 2019-02-20
Category : Technology & Engineering
ISBN : 9781119313977

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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by Beth Keser,Steffen Kröhnert Pdf

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Author : YongAn Huang,Zhouping Yin,Xiaodong Wan
Publisher : Springer
Page : 287 pages
File Size : 55,8 Mb
Release : 2019-04-23
Category : Technology & Engineering
ISBN : 9789811336270

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Modeling and Application of Flexible Electronics Packaging by YongAn Huang,Zhouping Yin,Xiaodong Wan Pdf

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
Publisher : Woodhead Publishing
Page : 436 pages
File Size : 48,8 Mb
Release : 2019-11-14
Category : Technology & Engineering
ISBN : 9780081025338

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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore by Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao Pdf

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

Author : Deborah Chung
Publisher : Elsevier
Page : 368 pages
File Size : 52,9 Mb
Release : 1995-03-31
Category : Technology & Engineering
ISBN : 0080511171

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Materials for Electronic Packaging by Deborah Chung Pdf

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems

Author : Steven K. Groothuis
Publisher : Unknown
Page : 344 pages
File Size : 54,9 Mb
Release : 1997-10-20
Category : Technology & Engineering
ISBN : UCSD:31822025650185

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Electronic Packaging Materials Science IX: Volume 445 by Steven K. Groothuis Pdf

While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.

Author : William D. Brown
Publisher : Wiley-IEEE Press
Page : 0 pages
File Size : 48,7 Mb
Release : 1998-10-27
Category : Technology & Engineering
ISBN : 0780347005

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Advanced Electronic Packaging by William D. Brown Pdf

Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Author : Xingcun Colin Tong
Publisher : Springer Science & Business Media
Page : 633 pages
File Size : 48,6 Mb
Release : 2011-01-05
Category : Technology & Engineering
ISBN : 9781441977595

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Advanced Materials for Thermal Management of Electronic Packaging by Xingcun Colin Tong Pdf

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Author : Yufeng Jin,Zhiping Wang,Jing Chen
Publisher : CRC Press
Page : 233 pages
File Size : 45,9 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781351832977

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Introduction to Microsystem Packaging Technology by Yufeng Jin,Zhiping Wang,Jing Chen Pdf

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

Author : Keyun Bi,Sheng Liu,Shengjun Zhou
Publisher : Unknown
Page : 128 pages
File Size : 48,9 Mb
Release : 2016
Category : Electronic packaging
ISBN : 1509013962

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The 17th International Conference on Electronic Packaging Technology by Keyun Bi,Sheng Liu,Shengjun Zhou Pdf

Author : Glenn R. Blackwell
Publisher : CRC Press
Page : 638 pages
File Size : 48,8 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781420049848

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The Electronic Packaging Handbook by Glenn R. Blackwell Pdf

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Author : Kazuhiro Nogita,Mohd Arif Anuar Mohd Salleh,Mohd Mustafa Al Bakri Abdullah,Liyana Jamaludin,Muhammad Faheem Mohd Tahir
Publisher : Trans Tech Publications Ltd
Page : 210 pages
File Size : 54,7 Mb
Release : 2018-04-13
Category : Technology & Engineering
ISBN : 9783035733242

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Electronic Packaging Interconnect Technology by Kazuhiro Nogita,Mohd Arif Anuar Mohd Salleh,Mohd Mustafa Al Bakri Abdullah,Liyana Jamaludin,Muhammad Faheem Mohd Tahir Pdf

This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.