Power Integrity Analysis And Management For Integrated Circuits
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Power Integrity Analysis and Management for Integrated Circuits by Raj Nair,Donald Bennett Pdf
As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on problem solving. --
Signal and Power Integrity - Simplified by Eric Bogatin Pdf
The #1 Practical Guide to Signal Integrity Design—Now Updated with Extensive New Coverage! This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition’s extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design—topics at the forefront of contemporary electronics design. Coverage includes A fully up-to-date introduction to signal integrity and physical design How design and technology selection can make or break the performance of the power distribution network Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance Practical techniques for analyzing resistance, capacitance, inductance, and impedance Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement Understanding how interconnect physical design impacts signal integrity Managing differential pairs and losses Harnessing the full power of S-parameters in high-speed serial link applications Ensuring power integrity throughout the entire power distribution path Realistic design guidelines for improving signal integrity, and much more Unlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.
Power Integrity Modeling and Design for Semiconductors and Systems by Madhavan Swaminathan,Ege Engin Pdf
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Power Integrity for Nanoscale Integrated Systems by Masanori Hashimoto,Raj Nair Pdf
Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery
Electrical Modeling and Design for 3D System Integration by Er-Ping Li Pdf
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Power Management Techniques for Integrated Circuit Design by Ke-Horng Chen Pdf
This book begins with the premise that energy demands are directing scientists towards ever-greener methods of power management, so highly integrated power control ICs (integrated chip/circuit) are increasingly in demand for further reducing power consumption. A timely and comprehensive reference guide for IC designers dealing with the increasingly widespread demand for integrated low power management Includes new topics such as LED lighting, fast transient response, DVS-tracking and design with advanced technology nodes Leading author (Chen) is an active and renowned contributor to the power management IC design field, and has extensive industry experience Accompanying website includes presentation files with book illustrations, lecture notes, simulation circuits, solution manuals, instructors’ manuals, and program downloads
Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs by Balsha R. Stanisic,Rob A. Rutenbar,L. Richard Carley Pdf
The move to higher levels of integration has increased the fraction of application-specific integrated circuit (ASIC) designs containing both analog and digital circuits. While the die area for the analog portion of these chips is modest, the design time is often significant. This has motivated the development of automated analog physical design tools for cell-level place-and-route and system-level signal-integrity-routing. To date, there is no tool that has specifically addressed the critical design task of synthesizing the power distribution for the analog portion of an analog or mixed-signal ASIC. Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs describes algorithms for analog power distribution synthesis and demonstrates their effectiveness. Existing digital power bus synthesis algorithms have failed to address critical concerns for analog circuitry, thus yielding unacceptable results. These tools synthesize only the bus component of power distribution networks and only consider simplified DC aspects of macros and busses. Readers of the companion book in this series, Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (Kluwer Academic Publishers), already recognize the inadequacy of this simplified view of the noise and power distribution problem in mixed-signal integrated circuits. Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs addresses power distribution synthesis for mixed-signal integrated circuits. Several key challenges in power distribution design are identified and automated methods to overcome them are described. This book presents a new formulation for the analog power distribution synthesis problem which synthesizes both the power busses power I/O cell assignment by evaluating DC, AC, and transient interaction between the macros, busses, chip substrate, and package. Furthermore, algorithms are introduced which simultaneously optimize power I/O cell assignment, macro cell substrate coupling, power bus topology selection and power bus sizing. Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs will be of interest to CAD designers and researchers specializing in physical design, modelling and circuit synthesis.
Understanding Signal Integrity by Stephen C. Thierauf Pdf
This unique book provides you with practical guidance on understanding and interpreting signal integrity (SI) performance to help you with your challenging circuit board design projects. You find high-level discussions of important SI concepts presented in a clear and easily accessible format, including question and answer sections and bulleted lists. This valuable resource features rules of thumb and simple equations to help you make estimates of critical signal integrity parameters without using circuit simulators of CAD (computer-aided design). The book is supported with over 120 illustrations, nearly 100 equations, and detailed reference lists at the end of each chapter.
Fundamentals of Power Integrity for Computer Platforms and Systems by Joseph T. DiBene, II Pdf
An all-encompassing text that focuses on the fundamentals of power integrity Power integrity is the study of power distribution from the source to the load and the system level issues that can occur across it. For computer systems, these issues can range from inside the silicon to across the board and may egress into other parts of the platform, including thermal, EMI, and mechanical. With a focus on computer systems and silicon level power delivery, this book sheds light on the fundamentals of power integrity, utilizing the author’s extensive background in the power integrity industry and unique experience in silicon power architecture, design, and development. Aimed at engineers interested in learning the essential and advanced topics of the field, this book offers important chapter coverage of fundamentals in power distribution, power integrity analysis basics, system-level power integrity considerations, power conversion in computer systems, chip-level power, and more. Fundamentals of Power Integrity for Computer Platforms and Systems: Introduces readers to both the field of power integrity and to platform power conversion Provides a unique focus on computer systems and silicon level power delivery unavailable elsewhere Offers detailed analysis of common problems in the industry Reviews electromagnetic field and circuit representation Includes a detailed bibliography of references at the end of each chapter Works out multiple example problems within each chapter Including additional appendixes of tables and formulas, Fundamentals of Power Integrity for Computer Platforms and Systems is an ideal introductory text for engineers of power integrity as well as those in the chip design industry, specifically physical design and packaging.
Power Integrity Modeling and Design for Semiconductors and Systems by Madhavan Swaminathan,A. Ege Engin Pdf
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by Sung Kyu Lim Pdf
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Power Management Integrated Circuits by Mona M. Hella,Patrick Mercier Pdf
Power Management Integrated Circuits and Technologies delivers a modern treatise on mixed-signal integrated circuit design for power management. Comprised of chapters authored by leading researchers from industry and academia, this definitive text: Describes circuit- and architectural-level innovations that meet advanced power and speed capabilities Explores hybrid inductive-capacitive converters for wide-range dynamic voltage scaling Presents innovative control techniques for single inductor dual output (SIDO) and single inductor multiple output (SIMO) converters Discusses cutting-edge design techniques including switching converters for analog/RF loads Compares the use of GaAs pHEMTs to CMOS devices for efficient high-frequency switching converters Thus, Power Management Integrated Circuits and Technologies provides comprehensive, state-of-the-art coverage of this exciting and emerging field of engineering.
High-Speed Circuit Board Signal Integrity, Second Edition by Stephen C. Thierauf Pdf
This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.
Power Integrity Analysis and Management for Integrated Circuits (paperback) by Raj Nair,Donald Bennett Pdf
New Techniques and Tools for Ensuring On-Chip Power Integrity—Down to Nanoscale As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on problem solving. Raj Nair and Dr. Donald Bennett first provide a complete foundational understanding of power integrity, including ULSI issues, practical aspects of power delivery, and the benefits of a total power integrity approach to optimizing chip physical designs. They introduce advanced power distribution network modeling, design, and analysis techniques that highlight abstraction and physics-based analysis, while also incorporating traditional circuit- and field-solver based approaches. They also present advanced techniques for floorplanning and power integrity management, and help designers anticipate emerging challenges associated with increased integration. Anasim RLCSim.exe, a new tool for power integrity aware floorplanning, is downloadable for free at anasim.com/category/software. The authors Systematically explore power integrity implications, analysis, and management for integrated circuits Present practical examples and industry best practices for a broad spectrum of chip design applications Discuss distributed and high-bandwidth voltage regulation, differential power path design, and the significance of on-chip inductance to power integrity Review both traditional and advanced modeling techniques for integrated circuit power integrity analysis, and introduce continuum modeling Explore chip, package, and board interactions for power integrity and EMI, and bring together industry best practices and examples Introduce advanced concepts for power integrity management, including non-linear capacitance devices, impedance modulation, and active noise regulation Power Integrity Analysis and Management for Integrated Circuits’ coverage of both fundamentals and advanced techniques will make this book indispensable to all engineers responsible for signal integrity, power integrity, hardware, or system design—especially those working at the nanoscale level.