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Author : Glsvlsi 13 Conference Committee
Publisher : Unknown
Page : 370 pages
File Size : 53,9 Mb
Release : 2013-07-01
Category : Computers
ISBN : 1450322794
Author : Anonim
Publisher : Unknown
Page : 404 pages
File Size : 43,9 Mb
Release : 2015
Category : Computer science
ISBN : 1450334741
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 44,7 Mb
Release : 2014
Category : Electronic
ISBN : 1450328164
Author : Anonim
Publisher : Unknown
Page : 644 pages
File Size : 40,8 Mb
Release : 2007
Category : Integrated circuits
ISBN : UOM:39015047306215
Author : Association for Computing Machinery,Glsvlsi 12 Conference Committee
Publisher : ACM Press
Page : 390 pages
File Size : 52,6 Mb
Release : 2012-11-01
Category : Computers
ISBN : 145031726X
Author : Anonim
Publisher : Unknown
Page : 636 pages
File Size : 52,7 Mb
Release : 2007
Category : Integrated circuits
ISBN : PSU:000061260054
Author : Glsvlsi
Publisher : Unknown
Page : 536 pages
File Size : 52,6 Mb
Release : 2018-10-29
Category : Computers
ISBN : 1450361498
Welcome to the 28th edition of the Great Lakes Symposium on VLSI (GLSVLSI) 2018, held at Chicago, IL. GLSVLSI is a premier venue for the dissemination of manuscripts of the highest quality in all areas related to VLSI, devices, and system-level design. The location of this year's GLSVLSI is Chicago, returning to the Great Lakes region of the USA. Conference will be held at Marriott Marquis Chicago located in downtown Chicago close to Lake Michigan and South Loop. Chicago is the home of Willis Tower, Cloud Gate and Millennium Park, Navy Pier, Art Institute of Chicago, Field Museum of Natural History, Magnificent Mile, and Wrigley Field. The conference this year will host a social event aboard Chicago's First Lady Cruises for Chicago Architecture Foundation River Cruise. This year's central theme for GLSVLSI is IoT Hardware and Heterogeneous Computing for Artificial Intelligence. The conference will showcase a program highlighted by five keynote speeches related to the central theme by the following academic, industrial, and governmental leaders: Matthew Casto, Chief, Air Force Research Lab, delivering the keynote entitled Hardware Assurance: Trojans, Counterfeits, and Security in an Interconnected World. Nikil Dutt, Chancellor's Professor, UC-Irvine, delivering the keynote entitled Self-Awareness for Heterogeneous MPSoCs: A Case Study using Adaptive, Reflective Middleware. Sharon Hu, Associate Dean, University of Notre Dame, delivering keynote entitled A Cross- Layer Perspective for Energy Efficient Processing -- From Beyond-CMOS Devices to Deep Learning. David Pellerin, Head of Global Business Development, Infotech/Semiconductor, Amazon Web Services, delivering keynote entitled Connected Devices, AI, and Scale -- Trends Driving Semiconductor Innovation. Wade Shen, Program Manager, DARPA, delivering keynote entitled DARPA's Data Driven Discovery of Models (D3M) and Software Defined Hardware (SDH) programs. Complementing the keynotes are six special sessions on: Powering Heterogeneous IoT Systems: Design for Efficiency, Security, and Sustainability. Emergence of Silicon Photonics in High-Performance Computing: How can the VLSI Community Contribute? Artificial Intelligence at the Edge. Implementing and Benchmarking Post-Quantum Cryptography in Hardware. Stochastic and Approximate Computing for Emerging Learning and Communication Systems. Circuits and Systems for Autonomous IoT Devices. For the first time in 2018, GLSVLSI program is featuring panels. Panel chairs Ioannis Savidis and Avesta Sasan will be moderating panels on the timely topics of security and machine learning, respectively Securing the Systems of the Future -- Techniques for a Shifting Attack Space. Low Power & Trusted Machine Learning. Most importantly, GLSVLSI 2018 will continue the strong tradition of featuring a stellar technical program focusing on VLSI, devices and systems. The technical program is shaped by the strong representation of high-quality papers in the standard tracks in VLSI Design; VLSI Circuits and Power Aware Design; Computer-Aided Design; Testing, Reliability, Fault Tolerance; Emerging Computing and Post-CMOS Technologies; and Hardware Security. GLSVLSI 2018 adds a new track in Machine Learning and Artificial Intelligence to capture the increasing interest and demonstrated competence of our community in the emerging field that also helps shape the central theme of GLSVLSI 2018. There were 161 papers submitted to GLSVLSI 2018 from 22 countries.
Author : Jose Ayala
Publisher : Unknown
Page : 128 pages
File Size : 53,9 Mb
Release : 2013-05-02
Category : Electronic
ISBN : 1450319025
GLSVLSI'13: Great Lakes Symposium on VLSI 2013 (part of ECRC) May 02, 2013-May 04, 2013 Paris, France. You can view more information about this proceeding and all of ACM�s other published conference proceedings from the ACM Digital Library: http://www.acm.org/dl.
Author : Hu, Wen-Chen
Publisher : IGI Global
Page : 496 pages
File Size : 53,8 Mb
Release : 2012-06-30
Category : Business & Economics
ISBN : 9781466618404
"This book focuses on information technology using sustainable green computing to reduce energy and resources used"--Provided by publisher.
Author : Aida Todri-Sanial,Chuan Seng Tan
Publisher : CRC Press
Page : 397 pages
File Size : 43,8 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781498710374
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author : Saraju P. Mohanty,Nagarajan Ranganathan,Elias Kougianos,Priyardarsan Patra
Publisher : Springer Science & Business Media
Page : 325 pages
File Size : 49,7 Mb
Release : 2008-05-31
Category : Technology & Engineering
ISBN : 9780387764740
This self-contained book addresses the need for analysis, characterization, estimation, and optimization of the various forms of power dissipation in the presence of process variations of nano-CMOS technologies. The authors show very large-scale integration (VLSI) researchers and engineers how to minimize the different types of power consumption of digital circuits. The material deals primarily with high-level (architectural or behavioral) energy dissipation.
Author : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
Publisher : Newnes
Page : 768 pages
File Size : 52,5 Mb
Release : 2017-07-04
Category : Technology & Engineering
ISBN : 9780124104846
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author : Management Association, Information Resources
Publisher : IGI Global
Page : 2090 pages
File Size : 51,8 Mb
Release : 2012-08-31
Category : Technology & Engineering
ISBN : 9781466619463
Industrial engineering affects all levels of society, with innovations in manufacturing and other forms of engineering oftentimes spawning cultural or educational shifts along with new technologies. Industrial Engineering: Concepts, Methodologies, Tools, and Applications serves as a vital compendium of research, detailing the latest research, theories, and case studies on industrial engineering. Bringing together contributions from authors around the world, this three-volume collection represents the most sophisticated research and developments from the field of industrial engineering and will prove a valuable resource for researchers, academics, and practitioners alike.
Author : Glsvlsi '19
Publisher : Unknown
Page : 564 pages
File Size : 49,7 Mb
Release : 2020-03-26
Category : Computers
ISBN : 1450370608
Welcome to the 29th edition of the Great Lakes Symposium on VLSI (GLSVLSI) 2019, held between May 9-11, 2019 at Tysons Corner, VA in the Washington, DC metropolitan area. GLSVLSI is a premier venue for the dissemination of manuscripts of the highest quality in all areas related to VLSI, devices, and system-level design. The location of this year's GLSVLSI is Washington, DC, visiting the east coast of the US, not too far from the "Great Lakes" region of the USA, especially given the global stretch of GLSVLSI host cities within the past decade. Conference will be held at Tysons Corner Marriott located in Tysons Corner, VA, a short ride from downtown Washington DC. ACM GLSVLSI 2019 is presented through the collaborative effort of a 15+ member organizing committee with 100+ technical program committee members. The Technical Program Committee Chairs, Tinoosh Mohsenin and Weisheng Zhao, have put together the 2019 installment of the traditionally strong ACM SIGDA GLSVLSI program. The program is structured around the following eight tracks, with GLSVLSI welcoming the International Conference on Microelectronic Systems Education (MSE) for GLSVLSI attendees as one of the tracks in 2019: 1. VLSI Design (Track Chairs Selcuk Kose, Inna Partin-Vaisband) 2. VLSI Circuits and Power Aware Design (Track Chairs Deliang Fan, Swaroop Ghosh) 3. Computer-Aided Design (Track Chairs Yanzhi Wang, Jianlei Yang) 4. Testing, Reliability, Fault Tolerance (Track Chairs Sandip Ray, Benjamin Schaefer) 5. Emerging Computing & Post-CMOS Technologies (Track Chairs Sorin Cotofana, Yue Zhang) 6. Hardware Security (Track Chairs JV Rajendran, Patrick Schaumont) 7. VLSI for Machine Learning and Artificial Intelligence (Track Chairs Philip Brisk, Amey Kulkarni) 8. Microelectronics Systems Education (Track Chairs Tina Hudson, Bradley Minch)
Author : Ivan S. Kourtev,Baris Taskin,Eby G. Friedman
Publisher : Springer Science & Business Media
Page : 274 pages
File Size : 48,7 Mb
Release : 2008-11-16
Category : Technology & Engineering
ISBN : 9780387710563
This book details timing analysis and optimization techniques for circuits with level-sensitive memory elements. It contains a linear programming formulation applicable to the timing analysis of large scale circuits and includes a delay insertion methodology that improves the efficiency of clock skew scheduling. Coverage also provides a framework for and results from implementing timing optimization algorithms in a parallel computing environment.
