Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture

Author : E-H Wong,Y.-W. Mai
Publisher : Woodhead Publishing
Page : 482 pages
File Size : 44,6 Mb
Release : 2015-05-23
Category : Technology & Engineering
ISBN : 9780857099112

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture by E-H Wong,Y.-W. Mai Pdf

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Author : Alla G. Kravets,Alexander A. Bolshakov,Maxim Shcherbakov
Publisher : Springer Nature
Page : 440 pages
File Size : 46,9 Mb
Release : 2021-03-25
Category : Technology & Engineering
ISBN : 9783030660819

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Cyber-Physical Systems: Design and Application for Industry 4.0 by Alla G. Kravets,Alexander A. Bolshakov,Maxim Shcherbakov Pdf

This book consists of chapters dedicated to the questions of cyber-physical system design and its usage for the chemical industry and new material design. Also, the contribution of the book covers scientific research and their results for cyber-physical systems design and application in the energy domain and solutions regarding engineering education for cyber-physical systems design. The book offers unique content for researchers and practitioners who are looking for new knowledge and skills in the framework of Industry 4.0 solutions. The book also benefits researchers and practitioners in chemistry and new material design and manufacturing to understand how cyber-physical systems can be applied to increase efficiency and performance. The target audience of the book are practitioners, enterprises representatives, scientists, Ph.D. and master students who perform scientific research or applications of cyber-physical systems in the concept of Industry 4.0.

Author : Deborah D L Chung
Publisher : World Scientific
Page : 238 pages
File Size : 53,9 Mb
Release : 2023-05-12
Category : Science
ISBN : 9789811247286

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Road To Scientific Success, The: Inspiring Life Stories Of Prominent Researchers (Volume 3) by Deborah D L Chung Pdf

The book is unique in its emphasis on the road to scientific success rather than the science itself. Scientists communicate much on their science through research publications, but they tend to talk much less, if at all, on the challenges encountered on the road to success. Information on the road to scientific success is helpful to people that are considering embarking on the journey on this road or are in the middle of the journey on this road. These people need inspiration and encouragement. Unless the information is recorded, it would be lost.The objectives of this book series are to:

Author : Anonim
Publisher : Unknown
Page : 740 pages
File Size : 47,5 Mb
Release : 1997
Category : Hybrid integrated circuits
ISBN : UOM:39015040325584

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Proceedings of the ... International Symposium on Microelectronics by Anonim Pdf

Author : Anonim
Publisher : International Society for Hybrid Microelectronics
Page : 738 pages
File Size : 50,8 Mb
Release : 1997
Category : Electronic packaging
ISBN : CORNELL:31924081323697

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1997 International Symposium on Microelectronics by Anonim Pdf

Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).

Author : KV Subramanian
Publisher : Springer Science & Business Media
Page : 378 pages
File Size : 45,9 Mb
Release : 2007-06-28
Category : Technology & Engineering
ISBN : 9780387484334

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Lead-Free Electronic Solders by KV Subramanian Pdf

Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.

Author : G.Q. Zhang,W.D. van Driel,X.J. Fan
Publisher : Springer Science & Business Media
Page : 566 pages
File Size : 50,6 Mb
Release : 2006-08-25
Category : Technology & Engineering
ISBN : 9781402049354

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Mechanics of Microelectronics by G.Q. Zhang,W.D. van Driel,X.J. Fan Pdf

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 43,9 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988

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Materials for Advanced Packaging by Daniel Lu,C.P. Wong Pdf

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Author : Louis T. Manzione
Publisher : Van Nostrand Reinhold Company
Page : 408 pages
File Size : 46,5 Mb
Release : 1990
Category : Technology & Engineering
ISBN : UOM:39015019554610

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Plastic Packaging of Microelectronic Devices by Louis T. Manzione Pdf

Author : Andrea Chen,Randy Hsiao-Yu Lo
Publisher : CRC Press
Page : 216 pages
File Size : 48,6 Mb
Release : 2016-04-19
Category : Technology & Engineering
ISBN : 9781439862070

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Semiconductor Packaging by Andrea Chen,Randy Hsiao-Yu Lo Pdf

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Author : F. Patrick McCluskey,Thomas Podlesak,Richard Grzybowski
Publisher : CRC Press
Page : 341 pages
File Size : 51,9 Mb
Release : 2018-05-04
Category : Technology & Engineering
ISBN : 9781351440813

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High Temperature Electronics by F. Patrick McCluskey,Thomas Podlesak,Richard Grzybowski Pdf

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

Author : Nitish V. Thakor
Publisher : Springer Nature
Page : 3686 pages
File Size : 54,7 Mb
Release : 2023-02-02
Category : Technology & Engineering
ISBN : 9789811655401

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Handbook of Neuroengineering by Nitish V. Thakor Pdf

This Handbook serves as an authoritative reference book in the field of Neuroengineering. Neuroengineering is a very exciting field that is rapidly getting established as core subject matter for research and education. The Neuroengineering field has also produced an impressive array of industry products and clinical applications. It also serves as a reference book for graduate students, research scholars and teachers. Selected sections or a compendium of chapters may be used as “reference book” for a one or two semester graduate course in Biomedical Engineering. Some academicians will construct a “textbook” out of selected sections or chapters. The Handbook is also meant as a state-of-the-art volume for researchers. Due to its comprehensive coverage, researchers in one field covered by a certain section of the Handbook would find other sections valuable sources of cross-reference for information and fertilization of interdisciplinary ideas. Industry researchers as well as clinicians using neurotechnologies will find the Handbook a single source for foundation and state-of-the-art applications in the field of Neuroengineering. Regulatory agencies, entrepreneurs, investors and legal experts can use the Handbook as a reference for their professional work as well.​

Author : Aydin Azizi
Publisher : BoD – Books on Demand
Page : 230 pages
File Size : 44,5 Mb
Release : 2020-01-15
Category : Technology & Engineering
ISBN : 9781789843194

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Emerging Trends in Mechatronics by Aydin Azizi Pdf

Mechatronics is a multidisciplinary branch of engineering combining mechanical, electrical and electronics, control and automation, and computer engineering fields. The main research task of mechatronics is design, control, and optimization of advanced devices, products, and hybrid systems utilizing the concepts found in all these fields. The purpose of this special issue is to help better understand how mechatronics will impact on the practice and research of developing advanced techniques to model, control, and optimize complex systems. The special issue presents recent advances in mechatronics and related technologies. The selected topics give an overview of the state of the art and present new research results and prospects for the future development of the interdisciplinary field of mechatronic systems.

Author : P. Singh,Puligandla Viswanadham
Publisher : Springer Science & Business Media
Page : 391 pages
File Size : 45,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461560296

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Failure Modes and Mechanisms in Electronic Packages by P. Singh,Puligandla Viswanadham Pdf

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

Author : Yong Chen
Publisher : Springer Nature
Page : 577 pages
File Size : 46,8 Mb
Release : 2020-07-30
Category : Technology & Engineering
ISBN : 9789811567032

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Automotive Transmissions by Yong Chen Pdf

This book introduces readers to the theory, design and applications of automotive transmissions. It covers multiple categories, e.g. AT, AMT, CVT, DCT and transmissions for electric vehicles, each of which has its own configuration and characteristics. In turn, the book addresses the effective design of transmission gear ratios, structures and control strategies, and other topics that will be of particular interest to graduate students, researchers and engineers. Moreover, it includes real-world solutions, simulation methods and testing procedures. Based on the author’s extensive first-hand experience in the field, the book allows readers to gain a deeper understanding of vehicle transmissions.