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Author : Anonim
Publisher : International Society for Hybrid Microelectronics
Page : 738 pages
File Size : 41,5 Mb
Release : 1997
Category : Technology & Engineering
ISBN : CORNELL:31924081323697
Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).
Author : Anonim
Publisher : Unknown
Page : 182 pages
File Size : 48,9 Mb
Release : 1997
Category : Integrated circuits
ISBN : OCLC:47885136
Author : Anonim
Publisher : Unknown
Page : 816 pages
File Size : 50,9 Mb
Release : 2001
Category : Hybrid integrated circuits
ISBN : UOM:39015051619198
Author : Electrochemical Society. Meeting
Publisher : The Electrochemical Society
Page : 332 pages
File Size : 54,7 Mb
Release : 2004
Category : Technology & Engineering
ISBN : 1566774128
Author : Anonim
Publisher : DIANE Publishing
Page : 203 pages
File Size : 54,9 Mb
Release : 2024-07-03
Category : Electronic
ISBN : 9781428918245
Author : Richard K. Ulrich,William D. Brown
Publisher : John Wiley & Sons
Page : 852 pages
File Size : 50,6 Mb
Release : 2006-02-24
Category : Technology & Engineering
ISBN : 9780471466093
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author : Anonim
Publisher : Universal-Publishers
Page : 500 pages
File Size : 50,8 Mb
Release : 2024-07-03
Category : Electronic
ISBN : 9781612336244
Author : Anonim
Publisher : Unknown
Page : 886 pages
File Size : 53,7 Mb
Release : 2000
Category : Electronic ceramics
ISBN : 0930815629
Author : IEEE Electron Devices Society
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 225 pages
File Size : 53,9 Mb
Release : 1997
Category : Technology & Engineering
ISBN : 0780332431
Author : Karl J. Puttlitz,Paul A. Totta
Publisher : Springer Science & Business Media
Page : 1250 pages
File Size : 43,7 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461513896
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author : International Symposium on Microelectronics
Publisher : Unknown
Page : 584 pages
File Size : 55,5 Mb
Release : 1995
Category : Microelectronics
ISBN : 0930815440
Author : Anonim
Publisher : John Wiley & Sons
Page : 656 pages
File Size : 46,7 Mb
Release : 2004-04-27
Category : Science
ISBN : 9780471454755
Written to educate readers about recent advances in the area of new materials used in making products. Materials and their properties usually limit the component designer. * Presents information about all of these advanced materials that enable products to be designed in a new way * Provides a cost effective way for the design engineer to become acquainted with new materials * The material expert benefits by being aware of the latest development in all these areas so he/she can focus on further improvements
Author : Fred D. Barlow, III,Aicha Elshabini
Publisher : CRC Press
Page : 373 pages
File Size : 49,5 Mb
Release : 2018-10-03
Category : Technology & Engineering
ISBN : 9781351837170
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author : Peter J. Hesketh
Publisher : The Electrochemical Society
Page : 268 pages
File Size : 46,6 Mb
Release : 2002
Category : Microelectromechanical systems
ISBN : 1566773725
Author : Anonim
Publisher : IEEE Computer Society
Page : 154 pages
File Size : 47,5 Mb
Release : 1997
Category : Technology & Engineering
ISBN : 0818679964
This volume on computer hardware, and design and test covers topics including: needs and capabilities of MSE needs and expectations of industry; practical issues and solutions; and infrastructure.