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Author : Anonim
Publisher : The Electrochemical Society
Page : 404 pages
File Size : 55,9 Mb
Release : 2003
Category : Technology & Engineering
ISBN : 1566774020
Author : Charles E. Hunt
Publisher : The Electrochemical Society
Page : 496 pages
File Size : 46,6 Mb
Release : 2001
Category : Technology & Engineering
ISBN : 1566772583
Author : Anonim
Publisher : The Electrochemical Society
Page : 588 pages
File Size : 40,5 Mb
Release : 2008-10
Category : Microelectromechanical systems
ISBN : 9781566776547
This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Author : C. Colinge
Publisher : The Electrochemical Society
Page : 656 pages
File Size : 42,6 Mb
Release : 2010-10
Category : Science
ISBN : 9781566778237
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Author : Anonim
Publisher : The Electrochemical Society
Page : 476 pages
File Size : 40,9 Mb
Release : 2005
Category : Microelectromechanical systems
ISBN : 1566774608
Author : Charles E. Hunt
Publisher : The Electrochemical Society
Page : 498 pages
File Size : 46,8 Mb
Release : 2001
Category : Technology & Engineering
ISBN : 1566772583
Author : Helmut Baumgart
Publisher : The Electrochemical Society
Page : 398 pages
File Size : 54,9 Mb
Release : 2006
Category : Microelectromechanical systems
ISBN : 9781566775069
This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Author : Tadatomo Suga,Electrochemical Society. Meeting,Denki Kagaku Kyōkai (Japan). Fall Meeting,Electrochemical Society. Electronics and Photonics Division
Publisher : Unknown
Page : 572 pages
File Size : 53,8 Mb
Release : 2008
Category : Microelectromechanical systems
ISBN : 1607680076
Author : R. Knechtel
Publisher : Unknown
Page : 225 pages
File Size : 50,7 Mb
Release : 2020
Category : Electronic
ISBN : 1713819368
Author : U. Gösele
Publisher : The Electrochemical Society
Page : 636 pages
File Size : 52,5 Mb
Release : 1998
Category : Technology & Engineering
ISBN : 1566771897
Author : Anonim
Publisher : Unknown
Page : 524 pages
File Size : 50,9 Mb
Release : 1991
Category : Semiconductor wafers
ISBN : UOM:39015038577287
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 43,5 Mb
Release : 2014
Category : Electronic
ISBN : 1607685426
Author : Marin Alexe,Ulrich Gösele
Publisher : Springer Science & Business Media
Page : 510 pages
File Size : 55,8 Mb
Release : 2013-03-09
Category : Science
ISBN : 9783662108277
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Author : Peter Ramm,James Jian-Qiang Lu,Maaike M. V. Taklo
Publisher : John Wiley & Sons
Page : 435 pages
File Size : 50,8 Mb
Release : 2012-02-13
Category : Technology & Engineering
ISBN : 9783527326464
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Author : Yoshio Nishi,Robert Doering
Publisher : CRC Press
Page : 1720 pages
File Size : 42,8 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781420017663
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.