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Author : Anonim
Publisher : Unknown
Page : 363 pages
File Size : 44,6 Mb
Release : 2024-07-01
Category : Integrated circuits
ISBN : 1607682133
Author : F. Roozeboom,H. Jagannathan,K. Kakushima,P. J. Timans,E. P. Gusev,Z. Karim,S. De Gendt
Publisher : The Electrochemical Society
Page : 279 pages
File Size : 49,7 Mb
Release : 2017
Category : Electronic
ISBN : 9781607688082
Author : Fred Roozeboom,Paul Timans,Evgeni Gusev,Vijay Narayanan,Kuniyuki Kakushima,Zia Karim,Stefan De Gendt
Publisher : The Electrochemical Society
Page : 356 pages
File Size : 52,9 Mb
Release : 2024-07-01
Category : Electronic
ISBN : 9781607687146
Author : F. Roozeboom,P.J. Timans,K. Kakushima,H. Jagannathan,Z. Karim,E. P. Gusev,S. De Gendt
Publisher : The Electrochemical Society
Page : 188 pages
File Size : 49,9 Mb
Release : 2018-05-04
Category : Science
ISBN : 9781607688341
Author : F. Roozeboom,V. Narayanan,K. Kakushima,P. J. Timans,E. P. Gusev
Publisher : The Electrochemical Society
Page : 338 pages
File Size : 52,7 Mb
Release : 2015
Category : Electronic
ISBN : 9781607685944
Author : F. Roozeboom,P. J. Timans,K. Kakushima,E. Gusev,Z. Karim,D. Misra,Y. S. Obeng,S. De Gendt,H. Jagannathan
Publisher : The Electrochemical Society
Page : 176 pages
File Size : 50,6 Mb
Release : 2019-05-17
Category : Science
ISBN : 9781607688686
This issue of ECS Transactions includes papers based on presentations from the symposium "Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9," originally held at the 235th ECS Meeting in Dallas, Texas, May 26-30, 2019.
Author : F. Roozeboom
Publisher : Unknown
Page : 128 pages
File Size : 50,5 Mb
Release : 2015
Category : Electronic
ISBN : 1623322375
Author : Vinit Kumar Gunjan,Vicente Garcia Diaz,Manuel Cardona,Vijender Kumar Solanki,K. V. N. Sunitha
Publisher : Springer
Page : 874 pages
File Size : 48,5 Mb
Release : 2019-06-27
Category : Technology & Engineering
ISBN : 9789811384615
This book discusses reliability applications for power systems, renewable energy and smart grids and highlights trends in reliable communication, fault-tolerant systems, VLSI system design and embedded systems. Further, it includes chapters on software reliability and other computer engineering and software management-related disciplines, and also examines areas such as big data analytics and ubiquitous computing. Outlining novel, innovative concepts in applied areas of reliability in electrical, electronics and computer engineering disciplines, it is a valuable resource for researchers and practitioners of reliability theory in circuit-based engineering domains.
Author : Ted Kamins
Publisher : Springer Science & Business Media
Page : 391 pages
File Size : 44,6 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461555773
Polycrystalline Silicon for Integrated Circuits and Displays, Second Edition presents much of the available knowledge about polysilicon. It represents an effort to interrelate the deposition, properties, and applications of polysilicon. By properly understanding the properties of polycrystalline silicon and their relation to the deposition conditions, polysilicon can be designed to ensure optimum device and integrated-circuit performance. Polycrystalline silicon has played an important role in integrated-circuit technology for two decades. It was first used in self-aligned, silicon-gate, MOS ICs to reduce capacitance and improve circuit speed. In addition to this dominant use, polysilicon is now also included in virtually all modern bipolar ICs, where it improves the basic physics of device operation. The compatibility of polycrystalline silicon with subsequent high-temperature processing allows its efficient integration into advanced IC processes. This compatibility also permits polysilicon to be used early in the fabrication process for trench isolation and dynamic random-access-memory (DRAM) storage capacitors. In addition to its integrated-circuit applications, polysilicon is becoming vital as the active layer in the channel of thin-film transistors in place of amorphous silicon. When polysilicon thin-film transistors are used in advanced active-matrix displays, the peripheral circuitry can be integrated into the same substrate as the pixel transistors. Recently, polysilicon has been used in the emerging field of microelectromechanical systems (MEMS), especially for microsensors and microactuators. In these devices, the mechanical properties, especially the stress in the polysilicon film, are critical to successful device fabrication. Polycrystalline Silicon for Integrated Circuits and Displays, Second Edition is an invaluable reference for professionals and technicians working with polycrystalline silicon in the integrated circuit and display industries.
Author : National Research Council,Division on Engineering and Physical Sciences,National Materials Advisory Board,Commission on Engineering and Technical Systems,Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems
Publisher : National Academies Press
Page : 76 pages
File Size : 55,7 Mb
Release : 1998-01-01
Category : Technology & Engineering
ISBN : 9780309059800
Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rivalâ€"perhaps surpassâ€"the societal impact of integrated circuits.
Author : North Atlantic Treaty Organization. Advisory Group for Aerospace Research and Development. Fluid Dynamics Panel. Symposium
Publisher : Unknown
Page : 444 pages
File Size : 55,7 Mb
Release : 1998
Category : Aerodynamics
ISBN : CORNELL:31924083859532
The demands for higher performance for modern aircraft have led the wind tunnel community, which is an integral link in the design process, to develop more refined and cost effective measuring techniques. These technologies have gradually matured from laboratory novelties into instruments regularly used in aerodynamic testing. The development of these modern measurement techniques has greatly extended the capability and accuracy of the classical methods for measurement techniques and provided better insight into flow physics. This Symposium provided a forum for active researchers to address the state-of-the-art, to exchange experiences and ideas, and for the practitioners to obtain an overview of the technology and learn how to appy it.
Author : Massimo Rudan,Rossella Brunetti,Susanna Reggiani
Publisher : Springer Nature
Page : 1680 pages
File Size : 40,8 Mb
Release : 2022-11-10
Category : Technology & Engineering
ISBN : 9783030798277
This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
Author : Frank Northen Magill
Publisher : Unknown
Page : 552 pages
File Size : 52,6 Mb
Release : 1993
Category : Engineering
ISBN : UVA:X002573571
Author : Colin Tong
Publisher : Springer Nature
Page : 641 pages
File Size : 46,5 Mb
Release : 2021-10-04
Category : Technology & Engineering
ISBN : 9783030798048
This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.
Author : Anonim
Publisher : Unknown
Page : 534 pages
File Size : 42,9 Mb
Release : 1991
Category : Rapid thermal processing
ISBN : UOM:39015022280880
