Structural Analysis In Microelectronic And Fiber Optic Systems

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Structural Analysis in Microelectronic and Fiber-Optic Systems

Ephraim Suhir
Structural Analysis in Microelectronic and Fiber Optic Systems Book PDF

Author : Ephraim Suhir
Publisher : Springer Science & Business Media
Page : 429 pages
File Size : 50,5 Mb
Release : 2012-12-06
Category : Science
ISBN : 9789401165358

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Structural Analysis in Microelectronic and Fiber-Optic Systems by Ephraim Suhir Pdf

This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in "high technology" engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.

Structural Analysis in Microelectronic and Fiber-Optic Systems

Ephraim Suhir
Structural Analysis in Microelectronic and Fiber Optic Systems Book PDF

Author : Ephraim Suhir
Publisher : Springer
Page : 440 pages
File Size : 43,5 Mb
Release : 1991-07-11
Category : Juvenile Nonfiction
ISBN : UOM:39015019471534

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Structural Analysis in Microelectronic and Fiber-Optic Systems by Ephraim Suhir Pdf

This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in "high technology" engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Ephraim Suhir
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices Book PDF

Author : Ephraim Suhir
Publisher : CRC Press
Page : 344 pages
File Size : 55,6 Mb
Release : 2021-01-28
Category : Technology & Engineering
ISBN : 9780429863820

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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices by Ephraim Suhir Pdf

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.

Structural Analysis in Microelectronics and Fiber Optics, 1996

Ephraim Suhir
Structural Analysis in Microelectronics and Fiber Optics 1996 Book PDF

Author : Ephraim Suhir
Publisher : Unknown
Page : 236 pages
File Size : 47,9 Mb
Release : 1996
Category : Science
ISBN : STANFORD:36105017795746

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Structural Analysis in Microelectronics and Fiber Optics, 1996 by Ephraim Suhir Pdf

Proceedings of the November 1996 symposium. Contains 18 papers arranged in sections on structural reliability and dynamics, structural analysis of IC packages, solder alloys and joints, and fiber-optic and optoelectronic structures. Specific topics include singular solutions of interfacial stresses

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Ephraim Suhir,Y.C. Lee,C.P. Wong
Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging Book PDF

Author : Ephraim Suhir,Y.C. Lee,C.P. Wong
Publisher : Springer Science & Business Media
Page : 1471 pages
File Size : 55,7 Mb
Release : 2007-05-26
Category : Technology & Engineering
ISBN : 9780387329895

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by Ephraim Suhir,Y.C. Lee,C.P. Wong Pdf

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Optical Fibers and Applications 1990-1994

Arthur Sheekey
Optical Fibers and Applications 1990 1994 Book PDF

Author : Arthur Sheekey
Publisher : Information Gatekeepers Inc
Page : 746 pages
File Size : 46,9 Mb
Release : 1997-07
Category : Education
ISBN : 156851106X

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Optical Fibers and Applications 1990-1994 by Arthur Sheekey Pdf

Structural Dynamics of Electronic and Photonic Systems

Ephraim Suhir,T. X. Yu,David S. Steinberg
Structural Dynamics of Electronic and Photonic Systems Book PDF

Author : Ephraim Suhir,T. X. Yu,David S. Steinberg
Publisher : John Wiley & Sons
Page : 610 pages
File Size : 54,8 Mb
Release : 2011-04-04
Category : Technology & Engineering
ISBN : 9780470886793

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Structural Dynamics of Electronic and Photonic Systems by Ephraim Suhir,T. X. Yu,David S. Steinberg Pdf

The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Juan Cepeda-Rizo,Jeremiah Gayle,Joshua Ravich
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments Book PDF

Author : Juan Cepeda-Rizo,Jeremiah Gayle,Joshua Ravich
Publisher : CRC Press
Page : 278 pages
File Size : 40,6 Mb
Release : 2021-12-29
Category : Technology & Engineering
ISBN : 9781000511086

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments by Juan Cepeda-Rizo,Jeremiah Gayle,Joshua Ravich Pdf

Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space.

Thermal Stress and Strain in Microelectronics Packaging

John Lau
Thermal Stress and Strain in Microelectronics Packaging Book PDF

Author : John Lau
Publisher : Springer Science & Business Media
Page : 904 pages
File Size : 49,6 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781468477672

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Thermal Stress and Strain in Microelectronics Packaging by John Lau Pdf

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

Nano-Bio- Electronic, Photonic and MEMS Packaging

C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi Li
Nano Bio Electronic Photonic and MEMS Packaging Book PDF

Author : C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi Li
Publisher : Springer Nature
Page : 582 pages
File Size : 49,9 Mb
Release : 2021-03-17
Category : Technology & Engineering
ISBN : 9783030499914

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Nano-Bio- Electronic, Photonic and MEMS Packaging by C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi Li Pdf

This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.

Applied Materials Science

Deborah D. L. Chung
Applied Materials Science Book PDF

Author : Deborah D. L. Chung
Publisher : CRC Press
Page : 253 pages
File Size : 49,7 Mb
Release : 2001-06-13
Category : Science
ISBN : 9781420040975

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Applied Materials Science by Deborah D. L. Chung Pdf

Materials are the foundation of technology. As such, most universities provide engineering undergraduates with the fundamental concepts of materials science, including crystal structures, imperfections, phase diagrams, materials processing, and materials properties. Few, however, offer the practical, applications-oriented background that their stud