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Author : Manfred Jordan
Publisher : Unknown
Page : 401 pages
File Size : 48,7 Mb
Release : 1995
Category : 3874801187
ISBN : 3874801187
Author : Abner Brenner
Publisher : Elsevier
Page : 735 pages
File Size : 46,5 Mb
Release : 2013-10-22
Category : Technology & Engineering
ISBN : 9781483223117
Electrodeposition of Alloys: Principles and Practice, Volume I covers the general and theoretical aspects of the electrodeposition of alloy containing silver and/or copper. This book is organized into three parts encompassing 21 chapters. The first part considers first the history of electrodeposition, the applications of electrodeposited alloys, and the practical considerations involved in electrodeposition. This part also deals with the effect of operating variables on composition of electrodeposited alloys, and the physico-chemical properties of the alloy. The second part focuses on the theoretical aspects of alloy electrodeposition. This part includes discussions on the role of cathode diffusion layer, the effects of complexing agents, and the concept of alloy plating. The third part discusses the practical aspects of the electrodeposition of alloys, focusing primarily on the electrodeposition of alloys from aqueous solutions. This part examines first brass and bronze plating, followed by the electrodeposition of copper-tin, silver, and iron containing alloys. This book is directed toward electrochemists and researchers.
Author : Ernest Sydney Hedges
Publisher : Unknown
Page : 440 pages
File Size : 41,8 Mb
Release : 1960
Category : Tin
ISBN : UCAL:B4125204
Author : Ernest Sydney Hedges
Publisher : Unknown
Page : 442 pages
File Size : 53,7 Mb
Release : 1960
Category : Tin
ISBN : UOM:39015006410255
Author : B. T. K. Barry,Colin John Thwaites
Publisher : Unknown
Page : 280 pages
File Size : 41,8 Mb
Release : 1983
Category : Technology & Engineering
ISBN : UOM:39015004561778
Author : Abner Brenner
Publisher : Elsevier
Page : 677 pages
File Size : 48,6 Mb
Release : 2013-10-22
Category : Technology & Engineering
ISBN : 9781483223100
Electrodeposition of Alloys: Principles and Practice, Volume II: Practical and Specific Information provides sufficient information for preparing and operating alloy plating baths. This book is organized into five sections encompassing 21 chapters that also consider the facts and theory of alloy plating. The five sections discuss the five types of alloy plating system with respect to the plating variables. Each section deals with the fundamental bases of alloy deposition, which have been summed up in six principles. This book further examines the role of diffusion in alloy deposition and the role of the density versus potential relations in alloy deposition, as well as certain misconceptions regarding their value in alloy deposition have been pointed out. This book will prove useful to electrochemists, researchers, and electrochemistry teachers and students.
Author : J. W. Price
Publisher : Unknown
Page : 168 pages
File Size : 42,6 Mb
Release : 1983
Category : Science
ISBN : STANFORD:36105024688124
Author : Günter Grossmann,Christian Zardini
Publisher : Springer Science & Business Media
Page : 313 pages
File Size : 52,6 Mb
Release : 2011-05-12
Category : Technology & Engineering
ISBN : 9780857292360
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.
Author : Mordechay Schlesinger,Milan Paunovic
Publisher : John Wiley & Sons
Page : 755 pages
File Size : 43,8 Mb
Release : 2014-12-22
Category : Science
ISBN : 9780470167786
The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes: Easily accessible, self-contained contributions by over thirty experts Five completely new chapters and hundreds of additional pages A cutting-edge look at applications in nanoelectronics Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM) An important discussion of the physical properties of metal thin films Chapters devoted to methods, tools, control, and environmental issues And much more A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.
Author : A.C. Tan
Publisher : Springer Science & Business Media
Page : 358 pages
File Size : 47,7 Mb
Release : 1992-11-30
Category : Technology & Engineering
ISBN : 0412482401
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Author : Abner Brenner
Publisher : Unknown
Page : 684 pages
File Size : 55,8 Mb
Release : 1963
Category : Alloy plating
ISBN : UIUC:30112025610491
Author : Samuel Jacob Rosenberg
Publisher : Unknown
Page : 164 pages
File Size : 53,6 Mb
Release : 1968
Category : Nickel
ISBN : UIUC:30112077983242
Author : M. N. Patten
Publisher : Walter de Gruyter GmbH & Co KG
Page : 432 pages
File Size : 53,9 Mb
Release : 2017-07-24
Category : Reference
ISBN : 9783110976847
The aim of each volume of this series Guides to Information Sources is to reduce the time which needs to be spent on patient searching and to recommend the best starting point and sources most likely to yield the desired information. The criteria for selection provide a way into a subject to those new to the field and assists in identifying major new or possibly unexplored sources to those who already have some acquaintance with it. The series attempts to achieve evaluation through a careful selection of sources and through the comments provided on those sources.
Author : Arvydas Survila
Publisher : John Wiley & Sons
Page : 304 pages
File Size : 52,5 Mb
Release : 2015-04-13
Category : Science
ISBN : 9783527691265
A systematic analysis of electrochemical processes involving metal complexes. Starting with general considerations on equilibria in solutions and at interfaces as well as on mass transport, the text acquaints readers with the theory and common experimental practice for studying electrochemical reactions of metals complexes. The core part of the book deals with all important aspects of electroplating, including a systematic discussion of co-deposition of metals and formation of alloys. It also discusses such related subjects as oxide layer formation and hydrogen evolution as a side reaction.
Author : Charles B. Kenahan,David Schlain,Edmond Chin
Publisher : Unknown
Page : 40 pages
File Size : 45,6 Mb
Release : 1967
Category : Copper alloys
ISBN : UOM:39015078512582