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Author : Constantine A. Neugebauer
Publisher : CRC Press
Page : 98 pages
File Size : 42,9 Mb
Release : 1986
Category : Science
ISBN : 2881241352
Author : Xingsheng Liu,Wei Zhao,Lingling Xiong,Hui Liu
Publisher : Springer
Page : 402 pages
File Size : 41,7 Mb
Release : 2014-07-14
Category : Technology & Engineering
ISBN : 9781461492634
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Author : Yong Liu
Publisher : Springer Science & Business Media
Page : 606 pages
File Size : 53,5 Mb
Release : 2012-02-15
Category : Technology & Engineering
ISBN : 9781461410539
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author : Katsuaki Suganuma
Publisher : Woodhead Publishing
Page : 240 pages
File Size : 42,9 Mb
Release : 2018-05-28
Category : Technology & Engineering
ISBN : 9780081020951
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates
Author : Yong Liu
Publisher : Springer Science & Business Media
Page : 606 pages
File Size : 40,8 Mb
Release : 2012-02-15
Category : Technology & Engineering
ISBN : 9781461410522
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author : Tanya Kirilova Gachovska,Jerry Hudgins,Bin Du,Enrico Santi
Publisher : Springer Nature
Page : 68 pages
File Size : 53,9 Mb
Release : 2022-06-01
Category : Technology & Engineering
ISBN : 9783031025068
This book presents physics-based electro-thermal models of bipolar power semiconductor devices including their packages, and describes their implementation in MATLAB and Simulink. It is a continuation of our first book Modeling of Bipolar Power Semiconductor Devices. The device electrical models are developed by subdividing the devices into different regions and the operations in each region, along with the interactions at the interfaces, are analyzed using the basic semiconductor physics equations that govern device behavior. The Fourier series solution is used to solve the ambipolar diffusion equation in the lightly doped drift region of the devices. In addition to the external electrical characteristics, internal physical and electrical information, such as junction voltages and carrier distribution in different regions of the device, can be obtained using the models. The instantaneous dissipated power, calculated using the electrical device models, serves as input to the thermal model (RC network with constant and nonconstant thermal resistance and thermal heat capacity, or Fourier thermal model) of the entire module or package, which computes the junction temperature of the device. Once an updated junction temperature is calculated, the temperature-dependent semiconductor material parameters are re-calculated and used with the device electrical model in the next time-step of the simulation. The physics-based electro-thermal models can be used for optimizing device and package design and also for validating extracted parameters of the devices. The thermal model can be used alone for monitoring the junction temperature of a power semiconductor device, and the resulting simulation results used as an indicator of the health and reliability of the semiconductor power device.
Author : Josef Lutz,Heinrich Schlangenotto,Uwe Scheuermann,Rik De Doncker
Publisher : Springer Science & Business Media
Page : 539 pages
File Size : 43,7 Mb
Release : 2011-01-15
Category : Technology & Engineering
ISBN : 9783642111259
Semiconductor power devices are the heart of power electronics. They determine the performance of power converters and allow topologies with high efficiency. Semiconductor properties, pn-junctions and the physical phenomena for understanding power devices are discussed in depth. Working principles of state-of-the-art power diodes, thyristors, MOSFETs and IGBTs are explained in detail, as well as key aspects of semiconductor device production technology. In practice, not only the semiconductor, but also the thermal and mechanical properties of packaging and interconnection technologies are essential to predict device behavior in circuits. Wear and aging mechanisms are identified and reliability analyses principles are developed. Unique information on destructive mechanisms, including typical failure pictures, allows assessment of the ruggedness of power devices. Also parasitic effects, such as device induced electromagnetic interference problems, are addressed. The book concludes with modern power electronic system integration techniques and trends.
Author : Shichun Qu,Yong Liu
Publisher : Springer
Page : 322 pages
File Size : 55,7 Mb
Release : 2014-09-10
Category : Technology & Engineering
ISBN : 9781493915569
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Author : Xiong Du,Jun Zhang,Gaoxian Li,Yaoyi Yu,Cheng Qian,Rui Du
Publisher : Springer Nature
Page : 184 pages
File Size : 48,7 Mb
Release : 2022-07-08
Category : Technology & Engineering
ISBN : 9789811931321
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
Author : Muhammad H. Rashid
Publisher : Elsevier
Page : 1192 pages
File Size : 51,8 Mb
Release : 2010-07-19
Category : Technology & Engineering
ISBN : 0080467652
Power electronics, which is a rapidly growing area in terms of research and applications, uses modern electronics technology to convert electric power from one form to another, such as ac-dc, dc-dc, dc-ac, and ac-ac with a variable output magnitude and frequency. Power electronics has many applications in our every day life such as air-conditioners, electric cars, sub-way trains, motor drives, renewable energy sources and power supplies for computers. This book covers all aspects of switching devices, converter circuit topologies, control techniques, analytical methods and some examples of their applications. * 25% new content * Reorganized and revised into 8 sections comprising 43 chapters * Coverage of numerous applications, including uninterruptable power supplies and automotive electrical systems * New content in power generation and distribution, including solar power, fuel cells, wind turbines, and flexible transmission
Author : Tanya Kirilova Gachovska,Jerry Hudgins,Bin Du,Enrico Santi
Publisher : Morgan & Claypool Publishers
Page : 85 pages
File Size : 41,9 Mb
Release : 2013-11-01
Category : Technology & Engineering
ISBN : 9781627051903
This book presents physics-based electro-thermal models of bipolar power semiconductor devices including their packages, and describes their implementation in MATLAB and Simulink. It is a continuation of our first book Modeling of Bipolar Power Semiconductor Devices. The device electrical models are developed by subdividing the devices into different regions and the operations in each region, along with the interactions at the interfaces, are analyzed using the basic semiconductor physics equations that govern device behavior. The Fourier series solution is used to solve the ambipolar diffusion equation in the lightly doped drift region of the devices. In addition to the external electrical characteristics, internal physical and electrical information, such as junction voltages and carrier distribution in different regions of the device, can be obtained using the models. The instantaneous dissipated power, calculated using the electrical device models, serves as input to the thermal model (RC network with constant and nonconstant thermal resistance and thermal heat capacity, or Fourier thermal model) of the entire module or package, which computes the junction temperature of the device. Once an updated junction temperature is calculated, the temperature-dependent semiconductor material parameters are re-calculated and used with the device electrical model in the next time-step of the simulation. The physics-based electro-thermal models can be used for optimizing device and package design and also for validating extracted parameters of the devices. The thermal model can be used alone for monitoring the junction temperature of a power semiconductor device, and the resulting simulation results used as an indicator of the health and reliability of the semiconductor power device.
Author : B. Jayant Baliga
Publisher : Springer Science & Business Media
Page : 1069 pages
File Size : 50,7 Mb
Release : 2010-04-02
Category : Technology & Engineering
ISBN : 9780387473147
Fundamentals of Power Semiconductor Devices provides an in-depth treatment of the physics of operation of power semiconductor devices that are commonly used by the power electronics industry. Analytical models for explaining the operation of all power semiconductor devices are shown. The treatment here focuses on silicon devices but includes the unique attributes and design requirements for emerging silicon carbide devices. The book will appeal to practicing engineers in the power semiconductor device community.
Author : Josef Lutz,Heinrich Schlangenotto,Uwe Scheuermann,Rik De Doncker
Publisher : Unknown
Page : 128 pages
File Size : 54,8 Mb
Release : 2018
Category : Electronic book
ISBN : 3319709186
This book discusses semiconductor properties, pn-junctions and the physical phenomena for understanding power devices in depth. Working principles of state-of-the-art power diodes, thyristors, MOSFETs and IGBTs are explained in detail, as well as key aspects of semiconductor device production technology. Special peculiarities of devices from the ascending semiconductor materials SiC and GaN are discussed. This book presents significant improvements compared to its first edition. It includes chapters on packaging and reliability. The chapter on semiconductor technology is written in a more in-depth way by considering 2D- and high concentration effects. The chapter on IGBTs is extended by new technologies and evaluation of its potential. An extended theory of cosmic ray failures is presented. The range of certain important physical relationships, doubted in recent papers for use in device simulation, is cleared and substantiated in this second edition.
Author : F. F. Mazda
Publisher : Elsevier
Page : 424 pages
File Size : 43,5 Mb
Release : 2016-06-06
Category : Technology & Engineering
ISBN : 9781483141602
Power Electronics Handbook: Components, Circuits and Applications is a compilation of materials that provides the theoretical information of component, circuits, and applications. The title is comprised of 14 chapters that are organized into three parts. The text first covers topics relevant to electronic components, such as thermal design, electromagnetic compatibility, and power semiconductor protection. Next, the book deals with circuitries, which include static switches, line control, and converters. The last part talks about power semiconductor circuit applications. The book will be of great use for students and practitioners of electronics related discipline, such as electronics engineering.
Author : Krishnan Ramu
Publisher : CRC Press
Page : 335 pages
File Size : 51,5 Mb
Release : 2020-12-07
Category : Technology & Engineering
ISBN : 9781000287868
Entrepreneurship in Power Semiconductor Devices, Power Electronics, and Electric Machines and Drive Systems introduces the basics of entrepreneurship and a methodology for the study of entrepreneurship in electrical engineering and other engineering fields. Entrepreneurship is considered here in three fields of electrical engineering, viz. power semiconductor devices, power electronics and electric machines and drive systems, and their current practice. It prepares the reader by providing a review of the subject matter in the three fields, their current status in research and development with analysis aspect as needed, thus allowing readers to gain self-sufficiency while reading the book. Each field’s emerging applications, current market and future market forecasts are introduced to understand the basis and need for emerging startups. Practical learning is introduced in: (i) power semiconductor devices entrepreneurship through the prism of 20 startups in detail, (ii) power electronics entrepreneurship through 28 startup companies arranged under various application fields and (iii) electric machines and drive systems entrepreneurship through 15 startups in electromagnetic and 1 in electrostatic machines and drive systems. The book: (i) demystifies entrepreneurship in a practical way to equip engineers and students with entrepreneurship as an option for their professional growth, pursuit and success; (ii) provides engineering managers and corporate-level executives a detailed view of entrepreneurship activities in the considered three fields that may potentially impact their businesses, (iii) provides entrepreneurship education in an electrical engineering environment and with direct connection and correlation to their fields of study and (iv) endows a methodology that can be effectively employed not only in the three illustrated fields of electrical engineering but in other fields as well. This book is for electrical engineering students and professionals. For use in undergraduate and graduate courses in electrical engineering, the book contains discussion questions, exercise problems, team and class projects, all from a practical point of view, to train students and assist professionals for future entrepreneurship endeavors.
