The Proceedings Of The International Conference On Semiconductor And Integrated Circuit Technology
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Electrostatic discharge (ESD) failure mechanisms continue to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a failure analysis and case-study approach. It provides a clear insight into the physics of failure from a generalist perspective, followed by investigation of failure mechanisms in specific technologies, circuits, and systems. The book is unique in covering both the failure mechanism and the practical solutions to fix the problem from either a technology or circuit methodology. Look inside for extensive coverage on: failure analysis tools, EOS and ESD failure sources and failure models of semiconductor technology, and how to use failure analysis to design more robust semiconductor components and systems; electro-thermal models and technologies; the state-of-the-art technologies discussed include CMOS, BiCMOS, silicon on insulator (SOI), bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, gallium arsenide (GaAs), gallium nitride (GaN), magneto-resistive (MR) , giant magneto-resistors (GMR), tunneling magneto-resistor (TMR), devices; micro electro-mechanical (MEM) systems, and photo-masks and reticles; practical methods to use failure analysis for the understanding of ESD circuit operation, temperature analysis, power distribution, ground rule development, internal bus distribution, current path analysis, quality metrics, (connecting the theoretical to the practical analysis); the failure of each key element of a technology from passives, active elements to the circuit, sub-system to package, highlighted by case studies of the elements, circuits and system-on-chip (SOC) in today’s products. ESD: Failure Mechanisms and Models is a continuation of the author’s series of books on ESD protection. It is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic era.
A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.
2009 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors by Yue Kuo Pdf
This issue of ECS Transactions includes 33 papers that were presented at the Second International Conference on Semiconductor Technology for Ultra Large Integrated Circuits and Thin Film Transistors (ULSIC vs. TFT II), held in the Xi¿an Garden Hotel, Xian, China, July 5-10, 2009. This symposium was sponsored by the Engineering Conferences International.
Author : United States. National Bureau of Standards Publisher : Unknown Page : 404 pages File Size : 44,9 Mb Release : 1987 Category : Electronic ISBN : OSU:32435028396323
2011 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors (ULSIC vs. TFT) by Anonim Pdf
Manufacturability Aware Routing in Nanometer VLSI by David Z. Pan,Minsik Cho,Kun Yuan Pdf
This paper surveys key research challenges and recent results of manufacturability aware routing in nanometer VLSI designs. The manufacturing challenges have their root causes from various integrated circuit (IC) manufacturing processes and steps, e.g., deep sub-wavelength lithography, random defects, via voids, chemical-mechanical polishing, and antenna-effects. They may result in both functional and parametric yield losses. The manufacturability aware routing can be performed at different routing stages including global routing, track routing, and detail routing, guided by both manufacturing process models and manufacturing-friendly rules. The manufacturability/yield optimization can be performed through both correct-by-construction (i.e., optimization during routing) as well as construct-by-correction (i.e., post-routing optimization). This paper will provide a holistic view of key design for manufacturability issues in nanometer VLSI routing.
2018 14th IEEE International Conference on Solid State and Integrated Circuit Technology (ICSICT) by IEEE Staff Pdf
Process & Device Technologies 1 Channel Engineering 2 High k Metal gate Technology 3 Advanced Source Drain Technology 4 Interconnect Technology 5 Advanced 3D Integration 6 Novel Process Technologies 7 Ultra Thin Body Transistors and Device Variability 8 Advanced High k Metal Gate SoC and High Performance CMOS Platforms 9 CMOS Performance Enhancing and Novel Devices 10 Advanced FinFETs and Nanowire FETs 11 CNT, MTJ Devices and Nanowire Photodiodes 12 Low Power and Steep Slope Switching Devices 13 Graphene Devices 14 Advanced Technologies for Ge MOSFETs 15 Organic semiconductor devices and technologies 16 Compound semiconductor devices and Technology 17 Ultra High Speed Transistors, HEMT HBT etc 18 Advanced Power Devices and Reliability 19 Flash Memory 20 IT Magnetic RAM 21 Resistive RAM
