Twenty First Ieee Cpmt International Electronics Manufacturing Technology Symposium October 13 15 1997 Austin Tx Usa
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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA by Don Millard,Semiconductor Equipment and Materials International,Components, Packaging & Manufacturing Technology Society Pdf
The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Design and Modeling of Mechanical Systems by Mohamed Haddar,Lotfi Romdhane,Jamel Louati,Abdelmajid Ben Amara Pdf
The 5th International Congress on Design and Modeling of Mechanical Systems (CMSM) was held in Djerba, Tunisia on March 25-27, 2013 and followed four previous successful editions, which brought together international experts in the fields of design and modeling of mechanical systems, thus contributing to the exchange of information and skills and leading to a considerable progress in research among the participating teams. The fifth edition of the congress (CMSM ́2013), organized by the Unit of Mechanics, Modeling and Manufacturing (U2MP) of the National School of Engineers of Sfax, Tunisia, the Mechanical Engineering Laboratory (MBL) of the National School of Engineers of Monastir, Tunisia and the Mechanics Laboratory of Sousse (LMS) of the National School of Engineers of Sousse, Tunisia, saw a significant increase of the international participation. This edition brought together nearly 300 attendees who exposed their work on the following topics: mechatronics and robotics, dynamics of mechanical systems, fluid structure interaction and vibroacoustics, modeling and analysis of materials and structures, design and manufacturing of mechanical systems. This book is the proceedings of CMSM ́2013 and contains a careful selection of high quality contributions, which were exposed during various sessions of the congress. The original articles presented here provide an overview of recent research advancements accomplished in the field mechanical engineering.
Moisture Sensitivity of Plastic Packages of IC Devices by X.J. Fan,E. Suhir Pdf
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Interfacial Compatibility in Microelectronics by Tomi Laurila,Vesa Vuorinen,Mervi Paulasto-Kröckel,Markus Turunen,Toni T. Mattila,Jorma Kivilahti Pdf
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
