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Author : Hisham Z. Massoud
Publisher : The Electrochemical Society
Page : 686 pages
File Size : 55,5 Mb
Release : 1997
Category : Computers
ISBN : 1566771307
Author : C. M. Osburn,John M. Andrews
Publisher : Unknown
Page : 804 pages
File Size : 41,9 Mb
Release : 1989
Category : Integrated circuits
ISBN : CORNELL:31924072149259
Author : Howard R. Huff,U. Gösele,H. Tsuya
Publisher : The Electrochemical Society
Page : 894 pages
File Size : 48,9 Mb
Release : 1998
Category : Technology & Engineering
ISBN : 1566771935
Author : Anonim
Publisher : The Electrochemical Society
Page : 894 pages
File Size : 41,6 Mb
Release : 1998
Category : Semiconductors
ISBN : STANFORD:36105005262857
Author : Howard R. Huff,László Fábry,Seigo Kishino
Publisher : The Electrochemical Society
Page : 650 pages
File Size : 41,9 Mb
Release : 2002
Category : Semiconductors
ISBN : 1566773741
Author : Tadahiro Ohmi
Publisher : CRC Press
Page : 400 pages
File Size : 49,6 Mb
Release : 2018-10-03
Category : Science
ISBN : 9781420026863
As science pushes closer toward the atomic size scale, new challenges arise to slow the pace of the miniaturization that has transformed our society and fueled the information age. New technologies are necessary to surpass these obstacles and realize the tremendous growth predicted by Moore's law. Assembled from the works of pioneering researchers, Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing presents new developments and technologies for producing the next generation of electronic circuits and displays. This book introduces radical-reaction-based semiconductor manufacturing technologies that overcome the limitations of the existing molecule-reaction-based technologies. It systematically details the procedures and underlying concepts involved in wet process technologies and applications. Following an introduction to semiconductor surface chemical electronics, expert contributors discuss the principles and technology of high-performance wet cleaning; etching technologies and processes; antistatic technology; wet vapor resist stripping technology; and process and safety technologies including waste reclamation, chemical composition control, and ultrapure water and liquid chemical supply systems and materials for fluctuation-free facilities. Currently, large production runs are needed to balance the costs of acquiring and tuning equipment for specialized operating conditions. Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing explains the technologies and processes used to meet the demand for variety and low volumes that exists in today's digital electronics marketplace.
Author : W. Eccleston,M. Uren
Publisher : CRC Press
Page : 368 pages
File Size : 46,5 Mb
Release : 1991-09-01
Category : Technology & Engineering
ISBN : 0750301686
Insulating Films on Semiconductors 1991 covers the fundamental aspects of the properties of dielectrics/semiconductor structures, the study of high field/hot electron/radiation induced phenomena, and the developments in measurement techniques for looking at interfaces and surfaces on semiconductor materials. The volume is written for researchers in physics, materials science, electronics, and electrical engineering.
Author : B.E. Deal,C.R. Helms
Publisher : Springer Science & Business Media
Page : 505 pages
File Size : 52,8 Mb
Release : 2013-11-09
Category : Science
ISBN : 9781489915887
The first international symposium on the subject "The Physics and Chemistry of Si02 and the Si-Si02 Interface," organized in association with the Electrochemical Society, Inc. , was held in Atlanta, Georgia on May 15- 20, 1988. This symposium contained sixty papers and was so successful that the sponsoring divisions decided to schedule it on a regular basis every four years. Thus, the second symposium on "The Physics and Chemistry of Si02 and the Si02 Interface was held May 18-21, 1992 in St. Louis, Missouri, again sponsored by the Electronics and Dielectrics Science and Technology Divisions of The Electrochemical Society. This volume contains manuscripts of most of the fifty nine papers presented at the 1992 symposium, and is divided into eight chapters - approximating the organization of the symposium. Each chapter is preceded with an introduction by the session organizers. It is appropriate to provide a general assessment of the current status and understanding of the physics and chemistry of Si02 and the Si02 interface before proceeding with a brief overview of the individual chapters. Semiconductor devices have continued to scale down in both horizontal and vertical dimensions. This has resulted in thinner gate and field oxides as well as much closer spacing of individual device features. As a result, surface condition, native oxide composition, and cleaning and impurity effects now provide a much more significant contribution to the properties of oxides and their interfaces.
Author : Geraldine Cogin Shwartz
Publisher : CRC Press
Page : 533 pages
File Size : 46,8 Mb
Release : 2006-02-22
Category : Technology & Engineering
ISBN : 9781420017656
First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed
Author : Abraham Landzberg
Publisher : Springer Science & Business Media
Page : 663 pages
File Size : 42,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461520290
The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Author : Richard B. Fair
Publisher : Academic Press
Page : 441 pages
File Size : 53,8 Mb
Release : 2012-12-02
Category : Technology & Engineering
ISBN : 9780323139809
This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.
Author : 国立国会図書館 (Japan)
Publisher : Unknown
Page : 1528 pages
File Size : 54,9 Mb
Release : 1972
Category : Science
ISBN : UCLA:L0088319777
Author : A.J. van Roosmalen,J.A.G. Baggerman,S.J.H. Brader
Publisher : Springer Science & Business Media
Page : 247 pages
File Size : 51,5 Mb
Release : 2013-06-29
Category : Science
ISBN : 9781489925664
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.
Author : G. R. Srinivasan,J. Plummer,Sokrates T. Pantelides
Publisher : Unknown
Page : 826 pages
File Size : 53,7 Mb
Release : 1991
Category : Semiconductors
ISBN : UCAL:B3102912
Author : Anonim
Publisher : Unknown
Page : 126 pages
File Size : 50,7 Mb
Release : 1992
Category : Research
ISBN : UIUC:30112105167875