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Author : Electrochemical Society. Meeting
Publisher : The Electrochemical Society
Page : 332 pages
File Size : 52,7 Mb
Release : 2004
Category : Technology & Engineering
ISBN : 1566774128
Author : Yoshihiko Imanaka
Publisher : Springer Science & Business Media
Page : 252 pages
File Size : 52,7 Mb
Release : 2006-05-28
Category : Technology & Engineering
ISBN : 9780387233147
The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Author : Edmundo A. Gutierrez-D.,M. Jamal Deen,Cor L. Claeys
Publisher : Academic Press
Page : 985 pages
File Size : 49,8 Mb
Release : 2001
Category : Cryoelectronics
ISBN : 9780123106759
Summarizes the advances in cryoelectronics starting from the fundamentals in physics and semiconductor devices to electronic systems, hybrid superconductor-semiconductor technologies, photonic devices, cryocoolers and thermal management. This book provides an exploration of the theory, research, and technologies related to cryoelectronics.
Author : Edmundo Gutierrez
Publisher : Unknown
Page : 800 pages
File Size : 46,7 Mb
Release : 2000
Category : Technology & Engineering
ISBN : 0780347218
Author : Fred D. Barlow, III,Aicha Elshabini
Publisher : CRC Press
Page : 373 pages
File Size : 43,6 Mb
Release : 2018-10-03
Category : Technology & Engineering
ISBN : 9781351837170
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 418 pages
File Size : 54,9 Mb
Release : 1997
Category : Technology & Engineering
ISBN : 1566771293
Author : Randall K. Kirschman
Publisher : Unknown
Page : 512 pages
File Size : 42,5 Mb
Release : 1986
Category : Technology & Engineering
ISBN : STANFORD:36105030431535
Author : K. M. Nair,Ruyan Guo,Amar S. Bhalla,D. Suvorov,S.-I. Hirano
Publisher : John Wiley & Sons
Page : 323 pages
File Size : 49,6 Mb
Release : 2012-04-11
Category : Technology & Engineering
ISBN : 9781118408179
This proceedings contains papers presented at the Advanced Dielectric Materials: Design, Preparation, Processing and Applications; and Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing-microstructure-property relationship, multilayer device materials, thin and thick films, device applications, low temperature co-fired ceramics (LTCC)for multilayer devices, microwave dielectric materials and much more.
Author : Wei Wu
Publisher : Royal Society of Chemistry
Page : 685 pages
File Size : 46,9 Mb
Release : 2022-07-20
Category : Technology & Engineering
ISBN : 9781839167188
Modern printing technology has paved the way for the fabrication of thin inexpensive electronics and is now established as a topic taught on advanced level courses across materials science and engineering. The properties of printed electronics, such as thin-form factor, flexibility, stretchability, portability, and rollability mean that they have a wide range of applications, including in wearable devices, smart packaging, healthcare, and the automotive industry. This book describes the key printing technologies for printed electronics. Chapters cover principles and mechanisms, techniques, inorganic and organic materials, substrates, post-treatment and applications of printed electronics technologies. Written by a leader in the field, this title will be essential reading for students on courses across materials science, electronics science, manufacturing and engineering, as well as those with an interest in printed electronics.
Author : Guosheng Jiang,Liyong Diao,Ken Kuang
Publisher : Springer Science & Business Media
Page : 163 pages
File Size : 53,5 Mb
Release : 2012-09-13
Category : Technology & Engineering
ISBN : 9781461419631
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
Author : K. M. Nair,Ruyan Guo,Amar S. Bhalla,S.-I. Hirano,D. Suvorov
Publisher : John Wiley & Sons
Page : 416 pages
File Size : 50,9 Mb
Release : 2012-04-11
Category : Technology & Engineering
ISBN : 9781118408193
Papers in this volume include topics such as materials synthesis and processing; relaxors; novel compositions; material design; materials for multilayer electronic devices; processing-microstructure-property relationship; applications; environmental issues; and economic/cost analysis of tomorrow's electronic devices. Includes 38 papers.
Author : Ahmed Sharif
Publisher : John Wiley & Sons
Page : 398 pages
File Size : 51,7 Mb
Release : 2019-08-05
Category : Technology & Engineering
ISBN : 9783527344192
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Author : Relva C. Buchanan
Publisher : CRC Press
Page : 692 pages
File Size : 52,9 Mb
Release : 2018-10-08
Category : Technology & Engineering
ISBN : 9781482293043
The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.
Author : Mailadil T. Sebastian,Rick Ubic,Heli Jantunen
Publisher : John Wiley & Sons
Page : 1000 pages
File Size : 49,7 Mb
Release : 2017-03-02
Category : Technology & Engineering
ISBN : 9781119208563
The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.
Author : Mahmoud Rasras,Ibrahim (Abe) M. Elfadel,Ha Duong Ngo
Publisher : MDPI
Page : 252 pages
File Size : 43,7 Mb
Release : 2019-05-27
Category : Technology & Engineering
ISBN : 9783038974147
Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
