Download Full eBooks in PDF
2013 Ieee 15th International Symposium And Exhibition On Advanced Packaging Materials Apm Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of 2013 Ieee 15th International Symposium And Exhibition On Advanced Packaging Materials Apm book. This book definitely worth reading, it is an incredibly well-written.
Author : Anonim
Publisher : Unknown
Page : 300 pages
File Size : 45,5 Mb
Release : 2013
Category : Electronic
ISBN : 1467360910
Author : Tupei Chen,Yang Liu
Publisher : CRC Press
Page : 732 pages
File Size : 49,6 Mb
Release : 2016-10-14
Category : Technology & Engineering
ISBN : 9781315357003
Semiconductor nanocrystals and metal nanoparticles are the building blocks of the next generation of electronic, optoelectronic, and photonic devices. Covering this rapidly developing and interdisciplinary field, the book examines in detail the physical properties and device applications of semiconductor nanocrystals and metal nanoparticles. It begins with a review of the synthesis and characterization of various semiconductor nanocrystals and metal nanoparticles and goes on to discuss in detail their optical, light emission, and electrical properties. It then illustrates some exciting applications of nanoelectronic devices (memristors and single-electron devices) and optoelectronic devices (UV detectors, quantum dot lasers, and solar cells), as well as other applications (gas sensors and metallic nanopastes for power electronics packaging). Focuses on a new class of materials that exhibit fascinating physical properties and have many exciting device applications. Presents an overview of synthesis strategies and characterization techniques for various semiconductor nanocrystal and metal nanoparticles. Examines in detail the optical/optoelectronic properties, light emission properties, and electrical properties of semiconductor nanocrystals and metal nanoparticles. Reviews applications in nanoelectronic devices, optoelectronic devices, and photonic devices.
Author : Components, Packaging, and Manufacturing Technology Society,Semiconductor Equipment and Materials International,Components, Packaging & Manufacturing Technology Society. Santa Clara Valley Chapter,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 132 pages
File Size : 43,9 Mb
Release : 2007
Category : Electronic packaging
ISBN : 1424413389
Author : Anonim
Publisher : Unknown
Page : 488 pages
File Size : 41,9 Mb
Release : 2011
Category : Electronic packaging
ISBN : OCLC:775357733
Author : Yixiong Huang,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 488 pages
File Size : 41,6 Mb
Release : 2011
Category : Electronic
ISBN : 1467301477
Author : Andrey Ronzhin,Gerhard Rigoll,Roman Meshcheryakov
Publisher : Springer
Page : 342 pages
File Size : 45,5 Mb
Release : 2019-08-12
Category : Computers
ISBN : 9783030261184
This book constitutes the refereed proceedings of the 4th International Conference on Interactive Collaborative Robotics, ICR 2019, held in Istanbul, Turkey, in August 2019. The 32 papers presented in this volume were carefully reviewed and selected from 46 submissions. They deal with challenges of human-robot interaction; robot control and behavior in social robotics and collaborative robotics; and applied robotic and cyber-physical systems.
Author : Hongyu Yu,Tianli Duan
Publisher : CRC Press
Page : 292 pages
File Size : 49,5 Mb
Release : 2017-07-06
Category : Science
ISBN : 9781351767606
GaN is considered the most promising material candidate in next-generation power device applications, owing to its unique material properties, for example, bandgap, high breakdown field, and high electron mobility. Therefore, GaN power device technologies are listed as the top priority to be developed in many countries, including the United States, the European Union, Japan, and China. This book presents a comprehensive overview of GaN power device technologies, for example, material growth, property analysis, device structure design, fabrication process, reliability, failure analysis, and packaging. It provides useful information to both students and researchers in academic and related industries working on GaN power devices. GaN wafer growth technology is from Enkris Semiconductor, currently one of the leading players in commercial GaN wafers. Chapters 3 and 7, on the GaN transistor fabrication process and GaN vertical power devices, are edited by Dr. Zhihong Liu, who has been working on GaN devices for more than ten years. Chapters 2 and 5, on the characteristics of polarization effects and the original demonstration of AlGaN/GaN heterojunction field-effect transistors, are written by researchers from Southwest Jiaotong University. Chapters 6, 8, and 9, on surface passivation, reliability, and package technologies, are edited by a group of researchers from the Southern University of Science and Technology of China.
Author : Kim Guldstrand Larsen
Publisher : MDPI
Page : 286 pages
File Size : 43,5 Mb
Release : 2020-01-21
Category : Technology & Engineering
ISBN : 9783039280469
Energy systems worldwide are undergoing major transformation as a consequence of the transition towards the widespread use of clean and sustainable energy sources. Basically, this involves massive changes in technical and organizational levels together with tremendous technological upgrades in different sectors ranging from energy generation and transmission systems down to distribution systems. These actions generate huge science and engineering challenges and demands for expert knowledge in the field to create solutions for a sustainable energy system that is economically, environmentally, and socially viable while meeting high security requirements. This book covers these promising and dynamic areas of research and development, and presents contributions in sustainable energy systems planning, integration, and management. Moreover, the book elaborates on a variety of topics, ranging from design and planning of small- to large-scale energy systems to the operation and control of energy networks in different sectors, namely electricity, heat, and transport.
Author : Ashish Khanna,Deepak Gupta,Siddhartha Bhattacharyya,Vaclav Snasel,Jan Platos,Aboul Ella Hassanien
Publisher : Springer Nature
Page : 599 pages
File Size : 53,9 Mb
Release : 2019-11-16
Category : Technology & Engineering
ISBN : 9789811503245
This book gathers high-quality research papers presented at the Second International Conference on Innovative Computing and Communication (ICICC 2019), which was held at the VSB - Technical University of Ostrava, Czech Republic, on 21–22 March 2019. Highlighting innovative papers by scientists, scholars, students, and industry experts in the fields of computing and communication, the book promotes the transformation of fundamental research into institutional and industrialized research, and the translation of applied research into real-world applications.
Author : Mark Stamp,Mamoun Alazab,Andrii Shalaginov
Publisher : Springer Nature
Page : 651 pages
File Size : 43,8 Mb
Release : 2020-12-20
Category : Computers
ISBN : 9783030625825
This book is focused on the use of deep learning (DL) and artificial intelligence (AI) as tools to advance the fields of malware detection and analysis. The individual chapters of the book deal with a wide variety of state-of-the-art AI and DL techniques, which are applied to a number of challenging malware-related problems. DL and AI based approaches to malware detection and analysis are largely data driven and hence minimal expert domain knowledge of malware is needed. This book fills a gap between the emerging fields of DL/AI and malware analysis. It covers a broad range of modern and practical DL and AI techniques, including frameworks and development tools enabling the audience to innovate with cutting-edge research advancements in a multitude of malware (and closely related) use cases.
Author : Mirko Meboldt,Christoph Klahn
Publisher : Springer
Page : 362 pages
File Size : 50,7 Mb
Release : 2017-09-05
Category : Technology & Engineering
ISBN : 9783319668666
These proceedings exchange ideas and knowledge among engineers, designers and managers on how to support real-world value chains by developing additive manufactured series products. The papers from the conference show a holistic, multidisciplinary view.
Author : Ochoa Ortiz-Zezzatti, Alberto,Rivera, Gilberto,Gómez-Santillán, Claudia,SánchezLara, Benito
Publisher : IGI Global
Page : 498 pages
File Size : 41,9 Mb
Release : 2019-04-05
Category : Business & Economics
ISBN : 9781522581321
Building accurate algorithms for the optimization of picking orders is a difficult task, especially when one considers the delays of real-world situations. In warehouse environments, diverse algorithms must be developed to enhance the global performance relating to combining customer orders into picking orders to reduce wait times. The Handbook of Research on Metaheuristics for Order Picking Optimization in Warehouses to Smart Cities is a pivotal reference source that addresses strategies for developing able algorithms in order to build better picking orders and the impact of these strategies on the picking systems in which diverse algorithms are implemented. While highlighting topics such ABC optimization, environmental intelligence, and order batching, this publication examines common picking aspects in warehouse environments ranging from manual order picking systems to automated retrieval systems. This book is intended for researchers, teachers, engineers, managers, and practitioners seeking research on algorithms to enhance the order picking performance.
Author : Ian Baker
Publisher : Springer
Page : 271 pages
File Size : 53,9 Mb
Release : 2018-06-21
Category : Technology & Engineering
ISBN : 9783319787664
This book introduces materials and how advances in materials result in advances in technology and our daily lives. Each chapter covers a particular material, how the material was discovered or invented, when it was first used, how this material has impacted the world, what makes the material important, how it is used today, and future applications. The list of materials covered in this book includes stone, wood, natural fibers, metals, clay, lead, iron, steel, silicon, glass, rubber, composites, polyethylene, rare earth magnet, and alloys.
Author : Slimane Hammoudi,Leszek A. Maciaszek,Michele M. Missikoff,Olivier Camp,José Cordeiro
Publisher : Springer
Page : 552 pages
File Size : 46,5 Mb
Release : 2017-06-29
Category : Computers
ISBN : 3319623850
This book constitutes revised selected papers from the 18th International Conference on Enterprise Information Systems, ICEIS 2016, held in Rome, Italy, in April 2016. The 23 papers presented in this volume were carefully reviewed and selected from a total of 257 submissions to ICEIS 2016. The volume also contains one invited talk in full paper length. The papers selected to be included in this book contribute to the understanding of relevant trends of current research on enterprise information systems, including issues with regard to enterprise engineering, heterogeneous systems, security, software engineering, systems integration, business process management, human factors and affective computing, ubiquitous computing, social computing, knowledge management, and artificial intelligence.
Author : Avram Bar-Cohen
Publisher : World Scientific
Page : 1582 pages
File Size : 43,8 Mb
Release : 2012-02-01
Category : Technology & Engineering
ISBN : 9789814313780
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
