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2011 International Symposium On Advanced Packaging Materials Apm Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of 2011 International Symposium On Advanced Packaging Materials Apm book. This book definitely worth reading, it is an incredibly well-written.
Author : Anonim
Publisher : Unknown
Page : 488 pages
File Size : 44,6 Mb
Release : 2011
Category : Electronic packaging
ISBN : OCLC:775357733
Author : Yixiong Huang,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 488 pages
File Size : 47,6 Mb
Release : 2011
Category : Electronic
ISBN : 1467301477
Author : Components, Packaging, and Manufacturing Technology Society,Semiconductor Equipment and Materials International,Components, Packaging & Manufacturing Technology Society. Santa Clara Valley Chapter,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 132 pages
File Size : 53,7 Mb
Release : 2007
Category : Electronic packaging
ISBN : 1424413389
Author : Components, Packaging & Manufacturing Technology Society,IEEE Electrical Insulation Society Staff,Yixiong Huang,ieee,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 488 pages
File Size : 44,5 Mb
Release : 2011-11
Category : Electronic
ISBN : 1467301485
Author : Anonim
Publisher : Unknown
Page : 300 pages
File Size : 48,9 Mb
Release : 2013
Category : Electronic
ISBN : 1467360910
Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 54,5 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 48,5 Mb
Release : 2010
Category : Electronic packaging
ISBN : 142446756X
Author : Dongkai Shangguan
Publisher : CRC Press
Page : 463 pages
File Size : 54,9 Mb
Release : 2024-06-28
Category : Technology & Engineering
ISBN : 9781040028643
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Author : Cher Ming Tan,Preetpal Singh
Publisher : Woodhead Publishing
Page : 190 pages
File Size : 42,6 Mb
Release : 2022-09-24
Category : Technology & Engineering
ISBN : 9780128224076
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Author : Tolga Tekin,Nikos Pleros,Richard Pitwon,Andreas Hakansson
Publisher : Woodhead Publishing
Page : 428 pages
File Size : 41,9 Mb
Release : 2016-11-01
Category : Computers
ISBN : 9780081005132
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic
Author : Anonim
Publisher : Unknown
Page : 322 pages
File Size : 53,8 Mb
Release : 2005
Category : Electronic packaging
ISBN : UOM:39015058301485
Author : Mohd Arif Anuar Mohd Salleh,Mohd Sharizal Abdul Aziz,Azman Jalar,Mohd Izrul Izwan Ramli
Publisher : Springer Nature
Page : 332 pages
File Size : 54,7 Mb
Release : 2022-03-01
Category : Technology & Engineering
ISBN : 9783030934415
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Author : George Youssef
Publisher : Elsevier
Page : 320 pages
File Size : 54,5 Mb
Release : 2021-12-02
Category : Technology & Engineering
ISBN : 9780128210796
Applied Mechanics of Polymers: Properties, Processing, and Behavior provides readers with an overview of the properties, mechanical behaviors and modeling techniques for accurately predicting the behaviors of polymeric materials. The book starts with an introduction to polymers, covering their history, chemistry, physics, and various types and applications. In addition, it covers the general properties of polymers and the common processing and manufacturing processes involved with them. Subsequent chapters delve into specific mechanical behaviors of polymers such as linear elasticity, hyperelasticity, creep, viscoelasticity, failure, and fracture. The book concludes with chapters discussing electroactive polymers, hydrogels, and the mechanical characterization of polymers. This is a useful reference text that will benefit graduate students, postdocs, researchers, and engineers in the mechanics of materials, polymer science, mechanical engineering and material science. Additional resources related to the book can be found at polymersmechanics.com. Provides examples of real-world applications that demonstrate the use of models in designing polymer-based components Includes access to a companion site from where readers can download FEA and MATLAB code, FEA simulation files, videos and other supplemental material Features end-of-chapter summaries with design and analysis guidelines, practice problem sets based on real-life situations, and both analytical and computational examples to bridge academic and industrial applications
Author : K. L. Mittal,Tanweer Ahsan
Publisher : John Wiley & Sons
Page : 357 pages
File Size : 51,6 Mb
Release : 2014-08-25
Category : Technology & Engineering
ISBN : 9781118831342
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Author : Jürgen Wittmann
Publisher : Springer Nature
Page : 184 pages
File Size : 42,7 Mb
Release : 2019-09-03
Category : Technology & Engineering
ISBN : 9783030252571
This book provides readers with guidelines for designing integrated multi-MHz-switching converters for input voltages/system supplies up to 50V or higher. Coverage includes converter theory, converter architectures, circuit design, efficiency, sizing of passives, technology aspects, etc. The author discusses new circuit designs, new architectures and new switching concepts, including dead-time control and soft-switching techniques that overcome current limitations of these converters. The discussion includes technology related issues and helps readers to choose the right technology for fast-switching converters. This book discusses benefits and drawbacks in terms of integration, size and cost, efficiency and complexity, and enables readers to make trade-offs in design, given different converter parameters. Describes a study for increasing switching frequencies up to 30 MHz at input voltages up to 50V or higher in the scaling of the size of switching converter passives; Analyzes various buck converter implementations and shows that a preference due to higher efficiency depends on the operating point, on the available switch technologies, and on the implementation of the high-side supply generation; Describes an efficiency model based on a four-phase model, which enables separation of loss causes and loss locations.
