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2013 Ieee International Symposium On Advanced Packaging Materials Apm 2013 Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of 2013 Ieee International Symposium On Advanced Packaging Materials Apm 2013 book. This book definitely worth reading, it is an incredibly well-written.
Author : Anonim
Publisher : Unknown
Page : 300 pages
File Size : 47,7 Mb
Release : 2013
Category : Electronic
ISBN : 1467360910
Author : Tolga Tekin,Nikos Pleros,Richard Pitwon,Andreas Hakansson
Publisher : Woodhead Publishing
Page : 428 pages
File Size : 54,5 Mb
Release : 2016-11-01
Category : Computers
ISBN : 9780081005132
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic
Author : Kwang Y. Lee,Damian Flynn,Hui Xie,Li Sun
Publisher : MDPI
Page : 228 pages
File Size : 52,9 Mb
Release : 2020-11-03
Category : Technology & Engineering
ISBN : 9783039433605
Faced with an ever-growing resource scarcity and environmental regulations, the last 30 years have witnessed the rapid development of various renewable power sources, such as wind, tidal, and solar power generation. The variable and uncertain nature of these resources is well-known, while the utilization of power electronic converters presents new challenges for the stability of the power grid. Consequently, various control and operational strategies have been proposed and implemented by the industry and research community, with a growing requirement for flexibility and load regulation placed on conventional thermal power generation. Against this background, the modelling and control of conventional thermal engines, such as those based on diesel and gasoline, are experiencing serious obstacles when facing increasing environmental concerns. Efficient control that can fulfill the requirements of high efficiency, low pollution, and long durability is an emerging requirement. The modelling, simulation, and control of thermal energy systems are key to providing innovative and effective solutions. Through applying detailed dynamic modelling, a thorough understanding of the thermal conversion mechanism(s) can be achieved, based on which advanced control strategies can be designed to improve the performance of the thermal energy system, both in economic and environmental terms. Simulation studies and test beds are also of great significance for these research activities prior to proceeding to field tests. This Special Issue will contribute a practical and comprehensive forum for exchanging novel research ideas or empirical practices that bridge the modelling, simulation, and control of thermal energy systems. Papers that analyze particular aspects of thermal energy systems, involving, for example, conventional power plants, innovative thermal power generation, various thermal engines, thermal energy storage, and fundamental heat transfer management, on the basis of one or more of the following topics, are invited in this Special Issue: • Power plant modelling, simulation, and control; • Thermal engines; • Thermal energy control in building energy systems; • Combined heat and power (CHP) generation; • Thermal energy storage systems; • Improving thermal comfort technologies; • Optimization of complex thermal systems; • Modelling and control of thermal networks; • Thermal management of fuel cell systems; • Thermal control of solar utilization; • Heat pump control; • Heat exchanger control.
Author : Tupei Chen,Yang Liu
Publisher : CRC Press
Page : 732 pages
File Size : 43,5 Mb
Release : 2016-10-14
Category : Technology & Engineering
ISBN : 9781315357003
Semiconductor nanocrystals and metal nanoparticles are the building blocks of the next generation of electronic, optoelectronic, and photonic devices. Covering this rapidly developing and interdisciplinary field, the book examines in detail the physical properties and device applications of semiconductor nanocrystals and metal nanoparticles. It begins with a review of the synthesis and characterization of various semiconductor nanocrystals and metal nanoparticles and goes on to discuss in detail their optical, light emission, and electrical properties. It then illustrates some exciting applications of nanoelectronic devices (memristors and single-electron devices) and optoelectronic devices (UV detectors, quantum dot lasers, and solar cells), as well as other applications (gas sensors and metallic nanopastes for power electronics packaging). Focuses on a new class of materials that exhibit fascinating physical properties and have many exciting device applications. Presents an overview of synthesis strategies and characterization techniques for various semiconductor nanocrystal and metal nanoparticles. Examines in detail the optical/optoelectronic properties, light emission properties, and electrical properties of semiconductor nanocrystals and metal nanoparticles. Reviews applications in nanoelectronic devices, optoelectronic devices, and photonic devices.
Author : Components, Packaging, and Manufacturing Technology Society,Semiconductor Equipment and Materials International,Components, Packaging & Manufacturing Technology Society. Santa Clara Valley Chapter,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 132 pages
File Size : 43,8 Mb
Release : 2007
Category : Electronic packaging
ISBN : 1424413389
Author : James E. Morris
Publisher : Springer
Page : 996 pages
File Size : 47,9 Mb
Release : 2018-09-22
Category : Technology & Engineering
ISBN : 9783319903620
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author : Anonim
Publisher : Unknown
Page : 488 pages
File Size : 46,6 Mb
Release : 2011
Category : Electronic packaging
ISBN : OCLC:775357733
Author : IEEE Staff
Publisher : Unknown
Page : 128 pages
File Size : 52,9 Mb
Release : 2013-12-12
Category : Electronic
ISBN : 147993741X
The EDAPS 2013 is the premier symposium in Asian area to discuss IC design, SiP SoP packaging, EMI EMC, and EDA tools for advanced 3 D IC and packaging design
Author : Cher Ming Tan,Preetpal Singh
Publisher : Woodhead Publishing
Page : 190 pages
File Size : 43,5 Mb
Release : 2022-09-24
Category : Technology & Engineering
ISBN : 9780128224076
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Author : Yixiong Huang,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 488 pages
File Size : 40,7 Mb
Release : 2011
Category : Electronic
ISBN : 1467301477
Author : Anonim
Publisher : Unknown
Page : 273 pages
File Size : 44,9 Mb
Release : 2013
Category : Electronic
ISBN : 1479923133
Author : Mohd Arif Anuar Mohd Salleh,Mohd Sharizal Abdul Aziz,Azman Jalar,Mohd Izrul Izwan Ramli
Publisher : Springer Nature
Page : 332 pages
File Size : 41,5 Mb
Release : 2022-03-01
Category : Technology & Engineering
ISBN : 9783030934415
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Author : K. L. Mittal,Tanweer Ahsan
Publisher : John Wiley & Sons
Page : 357 pages
File Size : 44,7 Mb
Release : 2014-08-25
Category : Technology & Engineering
ISBN : 9781118831342
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 40,8 Mb
Release : 2010
Category : Electronic packaging
ISBN : 142446756X
Author : Aida Todri-Sanial,Jean Dijon,Antonio Maffucci
Publisher : Springer
Page : 333 pages
File Size : 43,9 Mb
Release : 2016-07-09
Category : Technology & Engineering
ISBN : 9783319297460
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
