Adaptive Cooling Of Integrated Circuits Using Digital Microfluidics
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Adaptive Cooling of Integrated Circuits Using Digital Microfluidics by Philip Y. Paik,Krishnendu Chakrabarty,Vamsee Krishna Pamula Pdf
Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.
Highly Integrated Microfluidics Design by Dan E. Angelescu Pdf
The recent development of microfluidics has lead to the concept of lab-on-a-chip, where several functional blocks are combined into a single device that can perform complex manipulations and characterizations on the microscopic fluid sample. However, integration of multiple functionalities on a single device can be complicated. This a cutting-edge resource focuses on the crucial aspects of integration in microfluidic systems. It serves as a one-stop guide to designing microfluidic systems that are highly integrated and scalable. This practical book covers a wide range of critical topics, from fabrication techniques and simulation tools, to actuation and sensing functional blocks and their inter-compatibility. This unique reference outlines the benefits and drawbacks of different approaches to microfluidic integration and provides a number of clear examples of highly integrated microfluidic systems.
Design and Testing of Digital Microfluidic Biochips by Yang Zhao,Krishnendu Chakrabarty Pdf
This book provides a comprehensive methodology for automated design, test and diagnosis, and use of robust, low-cost, and manufacturable digital microfluidic systems. It focuses on the development of a comprehensive CAD optimization framework for digital microfluidic biochips that unifies different design problems. With the increase in system complexity and integration levels, biochip designers can utilize the design methods described in this book to evaluate different design alternatives, and carry out design-space exploration to obtain the best design point.
Heat Transfer by Hafiz Muhammad Ali,T. M. Indra Mahlia Pdf
Heat Transfer - Advances in Fundamentals and Applications explores new knowledge in the domain of fundamental and applied advances in heat transfer. This book specifically emphasizes advanced topics of heat transfer. Professionals, researchers, and academics working in various areas of heat transfer will find this a useful reference for finding new solutions to heat transfer problems. The book is organized into two sections on the fundamental advances in heat transfer and advances in applications of heat transfer. Chapters address inverse conduction problems, heat transfer enhancement during internal flows, shell-and-tube heat exchangers, heat transfer mechanisms in petroleum and geothermal wellbores, and other topics in the field.
Droplet and Spray Transport: Paradigms and Applications by Saptarshi Basu,Avinash Kumar Agarwal,Achintya Mukhopadhyay,Chetan Patel Pdf
This book focuses on droplets and sprays and their applications. It discusses how droplet level transport is central to a multitude of applications and how droplet level manipulation and control can enhance the efficiency and design of multiphase systems. Droplets and sprays are ubiquitous in a variety of multiphase and multiscale applications in surface patterning, oil recovery, combustion, atomization, spray drying, thermal barrier coating, renewable energy, and electronic cooling, to name but a few. This book provides two levels of details pertaining to such applications. Each chapter delves into a specific application and provides not only an overview but also detailed physical insights into the application mechanism from the point of view of droplets and sprays. All chapters provide a mix of cutting-edge applications, new diagnostic techniques and modern computational methodologies, as well as the fundamental physical mechanism involved in each application. Taken together, the chapters provide a translational perspective on these applications, from basic transport processes to optimization, and from design to implementation using droplets or sprays as fundamental building blocks. Given its breadth of coverage, the book will be of interest to students, researchers, and industry professionals alike.
Microfluidics by Yujun Song,Daojian Cheng,Liang Zhao Pdf
The first book offering a global overview of fundamental microfluidics and the wide range of possible applications, for example, in chemistry, biology, and biomedical science. As such, it summarizes recent progress in microfluidics, including its origin and development, the theoretical fundamentals, and fabrication techniques for microfluidic devices. The book also comprehensively covers the fluid mechanics, physics and chemistry as well as applications in such different fields as detection and synthesis of inorganic and organic materials. A useful reference for non-specialists and a basic guideline for research scientists and technicians already active in this field or intending to work in microfluidics.
Mems Packaging by Lee Yung-cheng,Cheng Yu-ting,Ramadoss Ramesh Pdf
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability. Contents: Introduction to MEMS Packaging (Y C Lee, Ramesh Ramadoss and Nils Hoivik)Silex's TSV Technology: Overview of Processes and MEMS Applications (Tomas Bauer and Thorbjörn Ebefors)Vertical Interconnects for High-end MEMS (Maaike M Visser Taklo and Sigurd Moe)Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost (Paul Pickering, Collin Twanow and Dean Spicer)Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market (Steven Nasiri, Ramesh Ramadoss and Sandra Winkler)PCB Based MEMS and Microfluidics (Ramesh Ramadoss, Antonio Luque and Carmen Aracil)Single Wafer Encapsulation of MEMS Resonators (Janna Rodriguez and Thomas Kenny)Heterogeneous Integration and Wafer-Level Packaging of MEMS (Masayoshi Esashi and Shuji Tanaka)Packaging of Membrane-Based Polymer Microfluidic Systems (Yu-Chuan Su)Wafer-Level Solder Bonding by Using Localized Induction Heating (Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang)Localized Sealing Schemes for MEMS Packaging (Y T Cheng, Y C Su and Liwei Lin)Microsprings for High-Density Flip-Chip Packaging (Eugene M Chow and Christopher L Chua)MEMS Reliability (Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht) Readership: Researchers and graduate students participating in research, R&D, and manufacturing of MEMS products; professionals associated with the integration for systems represented by smartphones, AR/VR, and wearable electronics. Keywords: MEMS;Packaging;Microelectromechanical Systems;Reliability;Microstructures;Sensors;ActuatorsReview: Key Features: The book covers engineering topics critical to product development as well as research topics critical to integration for future MEMS-enabled systemsIt is a major resource for those participating in MEMS and for every professional associated with the integration for systems represented by smartphones, AR/VR and wearable electronics
VLSI Circuits for Biomedical Applications by Krzysztof Iniewski Pdf
Supported with over 280 illustrations and over 160 equations, the book offers cutting-edge guidance on designing integrated circuits for wireless biosensing, body implants, biosensing interfaces, and molecular biology. You discover innovative design techniques and novel materials to help you achieve higher levels circuit and system performance.
Integrated Interconnect Technologies for 3D Nanoelectronic Systems by Muhannad S. Bakir,James D. Meindl Pdf
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Acoustic Wave and Electromechanical Resonators by Humberto Campanella Pdf
This groundbreaking book provides you with a comprehensive understanding of FBAR (thin-film bulk acoustic wave resonator), MEMS (microelectomechanical system), and NEMS (nanoelectromechanical system) resonators. For the first time anywhere, you find extensive coverage of these devices at both the technology and application levels. This practical reference offers you guidance in design, fabrication, and characterization of FBARs, MEMS and NEBS. It discusses the integration of these devices with standard CMOS (complementary-metal-oxide-semiconductor) technologies, and their application to sensing and RF systems. Moreover, this one-stop resource looks at the main characteristics, differences, and limitations of FBAR, MEMS, and NEMS devices, helping you to choose the right approaches for your projects. Over 280 illustrations and more than 130 equations support key topics throughout the book.
RFID-Enabled Sensor Design and Applications by Amin Rida,Li Yang,Manos Tentzeris Pdf
RFID (radio-frequency identification) is an emerging communication system technology and one of the most rapidly growing segments of todayOCOs automatic identification data collection industry. This cutting-edge resource offers you a solid understanding of the basic technical principles and applications of RFID-enabled sensor systems. The book provides you with a detailed description of RFID and itOCOs operation, along with a fundamental overview of sensors and wireless sensor networks. Moreover, this practical reference gives you step-by-step guidance on how to design RFID-enabled sensors that form a wireless sensor network. You also find detailed coverage of state-of OCothe-art RFID/sensor technology and worldwide applications.
Microfabrication for Microfluidics by Sang-Joon John Lee,Narayanan Sundararajan Pdf
Providing a definitive source of knowledge about the principles, materials, and process techniques used in the fabrication of microfluidics, this practical volume is a must for your reference shelf. The book focuses on fabrication, but also covers the basic purpose, benefits, and limitations of the fabricated structures as they are applied to microfluidic sensor and actuator functions. You find guidance on rapidly assessing options and tradeoffs for the selection of a fabrication method with clear tabulated process comparisons.
Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
Microdroplet Technology by Philip Day,Andreas Manz,Yonghao Zhang Pdf
Microdroplet technology has recently emerged to provide new and diverse applications via microfluidic functionality, especially in various areas of biology and chemistry. This book, then, gives an overview of the principle components and wide-ranging applications for state-of-the-art of droplet-based microfluidics. Chapter authors are internationally-leading researchers from chemistry, biology, physics and engineering that present various key aspects of micrdroplet technology -- fundamental flow physics, methodology and components for flow control, applications in biology and chemistry, and a discussion of future perspectives. This book acts as a reference for academics, post-graduate students, and researcher wishing to deepen their understand of microfluidics and introduce optimal design and operation of new droplet-based microfluidic devices for more comprehensive analyte assessments.
HereOCOs a groundbreaking book that introduces and discusses the important aspects of lab-on-a-chip, including the practical techniques, circuits, microsystems, and key applications in the biomedical, biology, and life science fields. Moreover, this volume covers ongoing research in lab-on-a-chip integration and electric field imaging. Presented in a clear and logical manner, the book provides you with the fundamental underpinnings of lab-on-a-chip, presents practical results, and brings you up to date with state-of-the-art research in the field. This unique resource is supported with over 160 illustrations that clarify important topics throughout.