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Author : EOS/ESD Association, Incorporated
Publisher : Unknown
Page : 13 pages
File Size : 41,8 Mb
Release : 2007
Category : Electronic
ISBN : 1585371211
Author : EOS/ESD Association, Incorporated
Publisher : Unknown
Page : 128 pages
File Size : 50,6 Mb
Release : 2014-08-22
Category : Electronic
ISBN : 1585372633
Author : Steven H. Voldman
Publisher : John Wiley & Sons
Page : 1172 pages
File Size : 54,7 Mb
Release : 2021-04-12
Category : Technology & Engineering
ISBN : 9781119965176
A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.
Author : Steven H. Voldman
Publisher : John Wiley & Sons
Page : 244 pages
File Size : 49,8 Mb
Release : 2012-10-22
Category : Technology & Engineering
ISBN : 9780470979716
Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips. The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology. Look inside for extensive coverage on: The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-electronics to nano-technology Semiconductor manufacturing handling and auditing processing to avoid ESD failures ESD, EOS, EMI, EMC, and latchup semiconductor component and system level testing to demonstrate product resilience from human body model (HBM), transmission line pulse (TLP), charged device model (CDM), human metal model (HMM), cable discharge events (CDE), to system level IEC 61000-4-2 tests ESD on-chip design and process manufacturing practices and solutions to improve ESD semiconductor chip solutions, also practical off-chip ESD protection and system level solutions to provide more robust systems System level concerns in servers, laptops, disk drives, cell phones, digital cameras, hand held devices, automobiles, and space applications Examples of ESD design for state-of-the-art technologies, including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, magnetic recording technology, micro-machines (MEMs) to nano-structures ESD Basics: From Semiconductor Manufacturing to Product Use complements the author’s series of books on ESD protection. For those new to the field, it is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic Era.
Author : Steven H. Voldman
Publisher : John Wiley & Sons
Page : 296 pages
File Size : 55,8 Mb
Release : 2015-01-05
Category : Technology & Engineering
ISBN : 9781118701478
A comprehensive and in-depth review of analog circuitlayout, schematic architecture, device, power network and ESDdesign This book will provide a balanced overview of analog circuitdesign layout, analog circuit schematic development,architecture of chips, and ESD design. It will start atan introductory level and will bring the reader right up to thestate-of-the-art. Two critical design aspects for analog and powerintegrated circuits are combined. The first design aspect coversanalog circuit design techniques to achieve the desired circuitperformance. The second and main aspect presents the additionalchallenges associated with the design of adequate and effective ESDprotection elements and schemes. A comprehensive list of practicalapplication examples is used to demonstrate the successfulcombination of both techniques and any potential designtrade-offs. Chapter One looks at analog design discipline, including layoutand analog matching and analog layout design practices. Chapter Twodiscusses analog design with circuits, examining: singletransistor amplifiers; multi-transistor amplifiers; active loadsand more. The third chapter covers analog design layout (alsoMOSFET layout), before Chapters Four and Five discuss analog designsynthesis. The next chapters introduce the reader to analog-digitalmixed signal design synthesis, analog signal pin ESD networks, andanalog ESD power clamps. Chapter Nine, the last chapter, covers ESDdesign in analog applications. Clearly describes analog design fundamentals (circuitfundamentals) as well as outlining the various ESDimplications Covers a large breadth of subjects and technologies, such asCMOS, LDMOS, BCD, SOI, and thick body SOI Establishes an “ESD analog design” discipline thatdistinguishes itself from the alternative ESD digital designfocus Focuses on circuit and circuit design applications Assessible, with the artwork and tutorial style of the ESD bookseries PowerPoint slides are available for university facultymembers Even in the world of digital circuits, analog and power circuitsare two very important but under-addressed topics, especially fromthe ESD aspect. Dr. Voldman’s new book will serve as anessential and practical guide to the greater IC community. Withhigh practical and academic values this book is a“bible” for professionals, graduate students, deviceand circuit designers for investigating the physics of ESD and forproduct designs and testing.
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 52,5 Mb
Release : 2021-10-31
Category : Electronic
ISBN : 158537332X
Author : Steven H. Voldman
Publisher : John Wiley & Sons
Page : 328 pages
File Size : 45,8 Mb
Release : 2016-10-14
Category : Technology & Engineering
ISBN : 9781118707159
With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). Describes both conventional testing and new testing techniques for both chip and system level evaluation. Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors’ series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work.
Author : Steven H. Voldman
Publisher : John Wiley & Sons
Page : 368 pages
File Size : 40,9 Mb
Release : 2013-10-28
Category : Technology & Engineering
ISBN : 9781118511886
Electrical Overstress (EOS) continues to impact semiconductor manufacturing, semiconductor components and systems as technologies scale from micro- to nano-electronics. This bookteaches the fundamentals of electrical overstress and how to minimize and mitigate EOS failures. The text provides a clear picture of EOS phenomena, EOS origins, EOS sources, EOS physics, EOS failure mechanisms, and EOS on-chip and system design. It provides an illuminating insight into the sources of EOS in manufacturing, integration of on-chip, and system level EOS protection networks, followed by examples in specific technologies, circuits, and chips. The book is unique in covering the EOS manufacturing issues from on-chip design and electronic design automation to factory-level EOS program management in today’s modern world. Look inside for extensive coverage on: Fundamentals of electrical overstress, from EOS physics, EOS time scales, safe operating area (SOA), to physical models for EOS phenomena EOS sources in today’s semiconductor manufacturing environment, and EOS program management, handling and EOS auditing processing to avoid EOS failures EOS failures in both semiconductor devices, circuits and system Discussion of how to distinguish between EOS events, and electrostatic discharge (ESD) events (e.g. such as human body model (HBM), charged device model (CDM), cable discharge events (CDM), charged board events (CBE), to system level IEC 61000-4-2 test events) EOS protection on-chip design practices and how they differ from ESD protection networks and solutions Discussion of EOS system level concerns in printed circuit boards (PCB), and manufacturing equipment Examples of EOS issues in state-of-the-art digital, analog and power technologies including CMOS, LDMOS, and BCD EOS design rule checking (DRC), LVS, and ERC electronic design automation (EDA) and how it is distinct from ESD EDA systems EOS testing and qualification techniques, and Practical off-chip ESD protection and system level solutions to provide more robust systems Electrical Overstress (EOS): Devices, Circuits and Systems is a continuation of the author’s series of books on ESD protection. It is an essential reference and a useful insight into the issues that confront modern technology as we enter the nano-electronic era.
Author : Paisarn Muneesawang,Suchart Yammen
Publisher : John Wiley & Sons
Page : 316 pages
File Size : 48,5 Mb
Release : 2015-03-23
Category : Computers
ISBN : 9781119058717
A presentation of the use of computer vision systems to controlmanufacturing processes and product quality in the hard disk driveindustry. Visual Inspection Technology in the Hard Disk DriveIndustry is an application-oriented book borne out of collaborative research withthe world’s leading hard disk drive companies. It covers thelatest developments and important topics in computer visiontechnology in hard disk drive manufacturing, as well as offering aglimpse of future technologies.
Author : Charvaka Duvvury,Harald Gossner
Publisher : John Wiley & Sons
Page : 424 pages
File Size : 40,6 Mb
Release : 2017-05-05
Category : Technology & Engineering
ISBN : 9781118861882
An effective and cost efficient protection of electronic system against ESD stress pulses specified by IEC 61000-4-2 is paramount for any system design. This pioneering book presents the collective knowledge of system designers and system testing experts and state-of-the-art techniques for achieving efficient system-level ESD protection, with minimum impact on the system performance. All categories of system failures ranging from 'hard' to 'soft' types are considered to review simulation and tool applications that can be used. The principal focus of System Level ESD Co-Design is defining and establishing the importance of co-design efforts from both IC supplier and system builder perspectives. ESD designers often face challenges in meeting customers' system-level ESD requirements and, therefore, a clear understanding of the techniques presented here will facilitate effective simulation approaches leading to better solutions without compromising system performance. With contributions from Robert Ashton, Jeffrey Dunnihoo, Micheal Hopkins, Pratik Maheshwari, David Pomerenke, Wolfgang Reinprecht, and Matti Usumaki, readers benefit from hands-on experience and in-depth knowledge in topics ranging from ESD design and the physics of system ESD phenomena to tools and techniques to address soft failures and strategies to design ESD-robust systems that include mobile and automotive applications. The first dedicated resource to system-level ESD co-design, this is an essential reference for industry ESD designers, system builders, IC suppliers and customers and also Original Equipment Manufacturers (OEMs). Key features: Clarifies the concept of system level ESD protection. Introduces a co-design approach for ESD robust systems. Details soft and hard ESD fail mechanisms. Detailed protection strategies for both mobile and automotive applications. Explains simulation tools and methodology for system level ESD co-design and overviews available test methods and standards. Highlights economic benefits of system ESD co-design.
Author : Kit L. Yam
Publisher : John Wiley & Sons
Page : 1368 pages
File Size : 41,7 Mb
Release : 2010-01-05
Category : Technology & Engineering
ISBN : 9780470541388
The complete and authoritative guide to modern packaging technologies —updated and expanded From A to Z, The Wiley Encyclopedia of Packaging Technology, Third Edition covers all aspects of packaging technologies essential to the food and pharmaceutical industries, among others. This edition has been thoroughly updated and expanded to include important innovations and changes in materials, processes, and technologies that have occurred over the past decade. It is an invaluable resource for packaging technologists, scientists and engineers, students and educators, packaging material suppliers, packaging converters, packaging machinery manufacturers, processors, retailers, and regulatory agencies. In addition to updating and improving articles from the previous edition, new articles are also added to cover the recent advances and developments in packaging. Content new to this edition includes: Advanced packaging materials such as antimicrobial materials, biobased materials, nanocomposite materials, ceramic-coated films, and perforated films Advanced packaging technologies such as active and intelligent packaging, radio frequency identification (RFID), controlled release packaging, smart blending, nanotechnology, biosensor technology, and package integrity inspection Various aspects important to packaging such as sustainable packaging, migration, lipid oxidation, light protection, and intellectual property Contributions from experts in all-important aspects of packaging Extensive cross-referencing and easy-to-access information on all subjects Large, double-column format for easy reference
Author : Karl Mathia
Publisher : Cambridge University Press
Page : 251 pages
File Size : 51,6 Mb
Release : 2010-05-06
Category : Science
ISBN : 9780521876520
Understand the design, testing, and application of cleanroom robotics and get real-world examples and design tips with this practical guide.
Author : Vladislav Vashchenko,Mirko Scholz
Publisher : Springer Science & Business Media
Page : 320 pages
File Size : 47,8 Mb
Release : 2014-03-21
Category : Technology & Engineering
ISBN : 9783319032214
This book addresses key aspects of analog integrated circuits and systems design related to system level electrostatic discharge (ESD) protection. It is an invaluable reference for anyone developing systems-on-chip (SoC) and systems-on-package (SoP), integrated with system-level ESD protection. The book focuses on both the design of semiconductor integrated circuit (IC) components with embedded, on-chip system level protection and IC-system co-design. The readers will be enabled to bring the system level ESD protection solutions to the level of integrated circuits, thereby reducing or completely eliminating the need for additional, discrete components on the printed circuit board (PCB) and meeting system-level ESD requirements. The authors take a systematic approach, based on IC-system ESD protection co-design. A detailed description of the available IC-level ESD testing methods is provided, together with a discussion of the correlation between IC-level and system-level ESD testing methods. The IC-level ESD protection design is demonstrated with representative case studies which are analyzed with various numerical simulations and ESD testing. The overall methodology for IC-system ESD co-design is presented as a step-by-step procedure that involves both ESD testing and numerical simulations.
Author : Elya B. Joffe,Kai-Sang Lock
Publisher : John Wiley & Sons
Page : 827 pages
File Size : 55,7 Mb
Release : 2011-09-20
Category : Technology & Engineering
ISBN : 9781118211519
GROUNDS FOR GROUNDING The first book to cover grounding from the circuit to system and across the entire spectrum of applications Grounds for Grounding provides a complete and thorough approach to the subject of designing electrical and electronic circuits and systems, blending theory and practice to demonstrate how a few basic rules can be applied across a broad range of applications. The authors begin with the basic concepts of Electromagnetic Compatibility (EMC) that are essential for understanding grounding theory and its applications, such as “ground loop,” which is one of the most misunderstood concepts in EMC. Next, they provide an introduction to grounding, including safety grounding, grounding for control of electromagnetic interference, and grounding-related case studies. Subsequent chapter coverage includes: Fundamentals of grounding design Bonding principles Grounding for power distribution and lightning protection systems Grounding in wiring circuits and cable shields Grounding of EMI terminal protection devices Grounding on printed circuit boards Integrated facility and platform grounding system Practical case studies are integrated throughout the book to aid in readers’ comprehension and each chapter concludes with a useful bibliography. Grounds for Grounding is an indispensable resource for electrical and electronic engineers who work with the design of circuits, systems, and facilities.
Author : K K Goswami
Publisher : Elsevier
Page : 336 pages
File Size : 50,7 Mb
Release : 2009-03-24
Category : Technology & Engineering
ISBN : 9781845695859
Carpets have been made throughout the world for hundreds of years. The manufacture of carpets has evolved over time and continues to improve in all areas. This book provides an overview of the developments and innovations within this area, whilst covering the many different types of carpet that are manufactured. Advances in carpet manufacture begins by covering the different types and requirements of carpets, along with the structure and properties of the carpet fibres and yarns that are used. The remainder of the book is dedicated to the developments that have occurred in the manufacture of carpets. Topics include the advances in carpet weaving and the reduction of static in carpets. A selection of carpet types are discussed, including wool carpets, textile sports surfaces and handmade carpets. With the variety of topics covered and its international team of contributors, this book is a valuable and informative reference for technologists in the carpet and associated industries. Provides an overview of recent developments and innovations in carpet manufacture Covers the structure and properties of different carpet fibres and yarns Examines advances in carpet weaving
