Benefiting From Thermal And Mechanical Simulation In Micro Electronics

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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Author : G.Q. Zhang,L.J. Ernst,O. de Saint Leger
Publisher : Springer Science & Business Media
Page : 195 pages
File Size : 51,6 Mb
Release : 2013-06-29
Category : Technology & Engineering
ISBN : 9781475731590

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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics by G.Q. Zhang,L.J. Ernst,O. de Saint Leger Pdf

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

Mechanics of Microelectronics

Author : G.Q. Zhang,W.D. van Driel,X.J. Fan
Publisher : Springer Science & Business Media
Page : 566 pages
File Size : 54,9 Mb
Release : 2006-08-25
Category : Technology & Engineering
ISBN : 9781402049354

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Mechanics of Microelectronics by G.Q. Zhang,W.D. van Driel,X.J. Fan Pdf

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Author : Ephraim Suhir,Y.C. Lee,C.P. Wong
Publisher : Springer Science & Business Media
Page : 1471 pages
File Size : 45,7 Mb
Release : 2007-05-26
Category : Technology & Engineering
ISBN : 9780387329895

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by Ephraim Suhir,Y.C. Lee,C.P. Wong Pdf

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Microelectronics Technology and Devices, SBMICRO 2002

Author : Electrochemical Society. Electronics Division
Publisher : The Electrochemical Society
Page : 506 pages
File Size : 48,7 Mb
Release : 2002
Category : Technology & Engineering
ISBN : 1566773288

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Microelectronics Technology and Devices, SBMICRO 2002 by Electrochemical Society. Electronics Division Pdf

Lead-free Electronics

Author : Sanka Ganesan,Michael G. Pecht
Publisher : John Wiley & Sons
Page : 804 pages
File Size : 43,8 Mb
Release : 2006-02-17
Category : Technology & Engineering
ISBN : 9780471786177

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Lead-free Electronics by Sanka Ganesan,Michael G. Pecht Pdf

Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.

Structural Integrity and Reliability in Electronics

Author : W.J. Plumbridge,R.J. Matela,A. Westwater
Publisher : Springer Science & Business Media
Page : 341 pages
File Size : 40,5 Mb
Release : 2003-12-31
Category : Mathematics
ISBN : 9781402017650

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Structural Integrity and Reliability in Electronics by W.J. Plumbridge,R.J. Matela,A. Westwater Pdf

The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book is probably the first to address the situation from a multidisciplinary teaching perspective. The authors' expertise in Materials, Electronics Manufacture and Design are integrated throughout to establish a common platform and language for practitioners from the many fields involved. Communication is facilitated by a dual-level of presentation of the subject principles and the latest developments in industry and in research. Electronic routes for monitoring current and future progress are also provided. The book will appeal both to specialists wanting to update or increase their appreciation of related topics, and the generalist seeking relevant applications. It represents a major contribution to the field.

Fast Simulation of Electro-Thermal MEMS

Author : Tamara Bechtold,Evgenii B. Rudnyi,Jan G. Korvink
Publisher : Springer
Page : 180 pages
File Size : 47,7 Mb
Release : 2006-10-06
Category : Technology & Engineering
ISBN : 3540346120

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Fast Simulation of Electro-Thermal MEMS by Tamara Bechtold,Evgenii B. Rudnyi,Jan G. Korvink Pdf

This book provides the reader with a complete methodology and software environment for creating efficient dynamic compact models for electro-thermal MEMS devices. It supplies the basic knowledge and understanding for using model order reduction at the engineering level. This tutorial is written for MEMS engineers and is enriched with many case studies which equip readers with the know-how to facilitate the simulation of a specific problem.

The Piezojunction Effect in Silicon Integrated Circuits and Sensors

Author : Fabiano Fruett,Gerard C.M. Meijer
Publisher : Springer Science & Business Media
Page : 162 pages
File Size : 41,8 Mb
Release : 2006-04-18
Category : Technology & Engineering
ISBN : 9780306482106

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The Piezojunction Effect in Silicon Integrated Circuits and Sensors by Fabiano Fruett,Gerard C.M. Meijer Pdf

This book describes techniques that can reduce mechanical-stress-induced inaccuracy and long-term instability in chips. The authors also show that the piezojunction effect can be applied for new types of mechanical-sensor structures. Thermo-mechanical stress is induced when packaged chips cool down to the temperature of application.

Advanced Adhesives in Electronics

Author : M O Alam,C Bailey
Publisher : Elsevier
Page : 279 pages
File Size : 43,8 Mb
Release : 2011-05-25
Category : Technology & Engineering
ISBN : 9780857092892

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Advanced Adhesives in Electronics by M O Alam,C Bailey Pdf

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques