Chemical Mechanical Polishing In Silicon Processing

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Chemical Mechanical Polishing in Silicon Processing

Author : Anonim
Publisher : Academic Press
Page : 307 pages
File Size : 41,7 Mb
Release : 1999-10-29
Category : Technology & Engineering
ISBN : 9780080864617

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Chemical Mechanical Polishing in Silicon Processing by Anonim Pdf

Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry.

Advances in Chemical Mechanical Planarization (CMP)

Author : Babu Suryadevara
Publisher : Woodhead Publishing
Page : 650 pages
File Size : 44,8 Mb
Release : 2021-09-10
Category : Technology & Engineering
ISBN : 9780128218198

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Advances in Chemical Mechanical Planarization (CMP) by Babu Suryadevara Pdf

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Semiconductors and Semimetals

Author : Robert K. Willardson,Albert C. Beer
Publisher : Unknown
Page : 307 pages
File Size : 47,6 Mb
Release : 2000
Category : Electronic
ISBN : OCLC:928813572

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Semiconductors and Semimetals by Robert K. Willardson,Albert C. Beer Pdf

Chemical Mechanical Planarization in IC Device Manufacturing III

Author : Robert Leon Opila
Publisher : The Electrochemical Society
Page : 664 pages
File Size : 43,9 Mb
Release : 2000
Category : Technology & Engineering
ISBN : 1566772605

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Chemical Mechanical Planarization in IC Device Manufacturing III by Robert Leon Opila Pdf

This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).

Chemical-Mechanical Polishing - Fundamentals and Challenges: Volume 566

Author : S. V. Babu
Publisher : Unknown
Page : 304 pages
File Size : 42,8 Mb
Release : 2000-02-10
Category : Technology & Engineering
ISBN : UCSD:31822028470763

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Chemical-Mechanical Polishing - Fundamentals and Challenges: Volume 566 by S. V. Babu Pdf

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Advances in CMP Polishing Technologies

Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
Publisher : William Andrew
Page : 330 pages
File Size : 53,5 Mb
Release : 2011-12-06
Category : Science
ISBN : 9781437778595

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Advances in CMP Polishing Technologies by Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa Pdf

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Chemical Mechanical Planarization VI

Author : Sudipta Seal
Publisher : The Electrochemical Society
Page : 370 pages
File Size : 44,9 Mb
Release : 2003
Category : Technology & Engineering
ISBN : 1566774047

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Chemical Mechanical Planarization VI by Sudipta Seal Pdf

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

Author : Christopher Lyle Borst,William N. Gill,Ronald J. Gutmann
Publisher : Springer Science & Business Media
Page : 235 pages
File Size : 55,8 Mb
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 9781461511656

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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses by Christopher Lyle Borst,William N. Gill,Ronald J. Gutmann Pdf

As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.

Chemical Mechanical Polishing 14

Author : R. Rhoades,G. Banerjee,B. Basim,L. Economikos,D. Huang,Y. Obeng
Publisher : The Electrochemical Society
Page : 93 pages
File Size : 54,6 Mb
Release : 2016-09-21
Category : Science
ISBN : 9781607687450

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Chemical Mechanical Polishing 14 by R. Rhoades,G. Banerjee,B. Basim,L. Economikos,D. Huang,Y. Obeng Pdf

Chemical Mechanical Polishing 9

Author : G. Banerjee,K. Sundaram,V. Desai,Y. Obeng
Publisher : The Electrochemical Society
Page : 91 pages
File Size : 51,5 Mb
Release : 2008-05
Category : Science
ISBN : 9781566776295

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Chemical Mechanical Polishing 9 by G. Banerjee,K. Sundaram,V. Desai,Y. Obeng Pdf

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 9¿, held during the 213th meeting of The Electrochemical Society, in Phoenix, Arizona from May 18-23, 2008.

Chemical-mechanical Polishing

Author : Anonim
Publisher : Unknown
Page : 312 pages
File Size : 42,9 Mb
Release : 2001
Category : Electrolytic polishing
ISBN : UOM:39015048290418

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Chemical-mechanical Polishing by Anonim Pdf

Chemical-Mechanical Planarization of Semiconductor Materials

Author : M.R. Oliver
Publisher : Springer Science & Business Media
Page : 432 pages
File Size : 51,6 Mb
Release : 2013-03-14
Category : Technology & Engineering
ISBN : 9783662062340

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Chemical-Mechanical Planarization of Semiconductor Materials by M.R. Oliver Pdf

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Chemical Mechanical Polishing 10

Author : G. Banerjee
Publisher : The Electrochemical Society
Page : 145 pages
File Size : 54,9 Mb
Release : 2009-05
Category : Science
ISBN : 9781566777230

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Chemical Mechanical Polishing 10 by G. Banerjee Pdf

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 10¿, held during the 215th meeting of The Electrochemical Society, in San Francisco, California from May 24 to 29, 2009.

Microelectronic Applications of Chemical Mechanical Planarization

Author : Yuzhuo Li
Publisher : John Wiley & Sons
Page : 760 pages
File Size : 47,7 Mb
Release : 2007-12-04
Category : Technology & Engineering
ISBN : 0470180897

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Microelectronic Applications of Chemical Mechanical Planarization by Yuzhuo Li Pdf

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.