Chip On Board Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of Chip On Board book. This book definitely worth reading, it is an incredibly well-written.
Author : John H. Lau Publisher : Springer Science & Business Media Page : 584 pages File Size : 44,5 Mb Release : 1994-06-30 Category : Computers ISBN : 0442014414
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Integrated Interconnect Technologies for 3D Nanoelectronic Systems by Muhannad S. Bakir,James D. Meindl Pdf
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Integrated Circuit Packaging, Assembly and Interconnections by William Greig Pdf
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Advanced Flip Chip Packaging by Ho-Ming Tong,Yi-Shao Lai,C.P. Wong Pdf
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Mechanical Analysis of Electronic Packaging Systems by Mckeown Pdf
"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
The CRC Handbook of Mechanical Engineering, Second Edition by D. Yogi Goswami Pdf
Since the first edition of this comprehensive handbook was published ten years ago, many changes have taken place in engineering and related technologies. Now, this best-selling reference has been updated for the 21st century, providing complete coverage of classic engineering issues as well as groundbreaking new subject areas. The second edition of The CRC Handbook of Mechanical Engineering covers every important aspect of the subject in a single volume. It continues the mission of the first edition in providing the practicing engineer in industry, government, and academia with relevant background and up-to-date information on the most important topics of modern mechanical engineering. Coverage of traditional topics has been updated, including sections on thermodynamics, solid and fluid mechanics, heat and mass transfer, materials, controls, energy conversion, manufacturing and design, robotics, environmental engineering, economics and project management, patent law, and transportation. Updates to these sections include new references and information on computer technology related to the topics. This edition also includes coverage of new topics such as nanotechnology, MEMS, electronic packaging, global climate change, electric and hybrid vehicles, and bioengineering.
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology
Multi-Chip Module Test Strategies by Yervant Zorian Pdf
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Materials for Advanced Packaging by Daniel Lu,C.P. Wong Pdf
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
System-on-Chip Test Architectures by Laung-Terng Wang,Charles E. Stroud,Nur A. Touba Pdf
Modern electronics testing has a legacy of more than 40 years. The introduction of new technologies, especially nanometer technologies with 90nm or smaller geometry, has allowed the semiconductor industry to keep pace with the increased performance-capacity demands from consumers. As a result, semiconductor test costs have been growing steadily and typically amount to 40% of today's overall product cost. This book is a comprehensive guide to new VLSI Testing and Design-for-Testability techniques that will allow students, researchers, DFT practitioners, and VLSI designers to master quickly System-on-Chip Test architectures, for test debug and diagnosis of digital, memory, and analog/mixed-signal designs. Emphasizes VLSI Test principles and Design for Testability architectures, with numerous illustrations/examples. Most up-to-date coverage available, including Fault Tolerance, Low-Power Testing, Defect and Error Tolerance, Network-on-Chip (NOC) Testing, Software-Based Self-Testing, FPGA Testing, MEMS Testing, and System-In-Package (SIP) Testing, which are not yet available in any testing book. Covers the entire spectrum of VLSI testing and DFT architectures, from digital and analog, to memory circuits, and fault diagnosis and self-repair from digital to memory circuits. Discusses future nanotechnology test trends and challenges facing the nanometer design era; promising nanotechnology test techniques, including Quantum-Dots, Cellular Automata, Carbon-Nanotubes, and Hybrid Semiconductor/Nanowire/Molecular Computing. Practical problems at the end of each chapter for students.
Hardware Protection through Obfuscation by Domenic Forte,Swarup Bhunia,Mark M. Tehranipoor Pdf
This book introduces readers to various threats faced during design and fabrication by today’s integrated circuits (ICs) and systems. The authors discuss key issues, including illegal manufacturing of ICs or “IC Overproduction,” insertion of malicious circuits, referred as “Hardware Trojans”, which cause in-field chip/system malfunction, and reverse engineering and piracy of hardware intellectual property (IP). The authors provide a timely discussion of these threats, along with techniques for IC protection based on hardware obfuscation, which makes reverse-engineering an IC design infeasible for adversaries and untrusted parties with any reasonable amount of resources. This exhaustive study includes a review of the hardware obfuscation methods developed at each level of abstraction (RTL, gate, and layout) for conventional IC manufacturing, new forms of obfuscation for emerging integration strategies (split manufacturing, 2.5D ICs, and 3D ICs), and on-chip infrastructure needed for secure exchange of obfuscation keys- arguably the most critical element of hardware obfuscation.