Author : Daniel J. Belton
Publisher : Unknown
Page : 288 pages
File Size : 52,8 Mb
Release : 1998-10
Category : Technology & Engineering
ISBN : UCSD:31822026267385
Electronic Packaging Materials Science X: Volume 515 by Daniel J. Belton Pdf
Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR