Electronic Packaging Materials Science X Volume 515

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Electronic Packaging Materials Science X: Volume 515

Author : Daniel J. Belton
Publisher : Unknown
Page : 288 pages
File Size : 52,8 Mb
Release : 1998-10
Category : Technology & Engineering
ISBN : UCSD:31822026267385

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Electronic Packaging Materials Science X: Volume 515 by Daniel J. Belton Pdf

Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR

Molecular Modeling and Multiscaling Issues for Electronic Material Applications

Author : Artur Wymyslowski,Nancy Iwamoto,Matthew Yuen,Haibo Fan
Publisher : Springer
Page : 203 pages
File Size : 47,6 Mb
Release : 2014-11-20
Category : Technology & Engineering
ISBN : 9783319128627

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Molecular Modeling and Multiscaling Issues for Electronic Material Applications by Artur Wymyslowski,Nancy Iwamoto,Matthew Yuen,Haibo Fan Pdf

This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.

Electronic Packaging Materials Science

Author : Anonim
Publisher : Unknown
Page : 288 pages
File Size : 42,9 Mb
Release : 1998
Category : Electronic packaging
ISBN : UVA:X004260755

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Electronic Packaging Materials Science by Anonim Pdf

Lead-Free Solder Interconnect Reliability

Author : Dongkai Shangguan
Publisher : ASM International
Page : 292 pages
File Size : 51,5 Mb
Release : 2005
Category : Technology & Engineering
ISBN : 9781615030934

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Lead-Free Solder Interconnect Reliability by Dongkai Shangguan Pdf

Applications of Synchrotron Radiation Techniques to Materials Science IV: Volume 524

Author : Susan M. Mini
Publisher : Unknown
Page : 408 pages
File Size : 44,8 Mb
Release : 1998-08-17
Category : Technology & Engineering
ISBN : UCSD:31822025698200

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Applications of Synchrotron Radiation Techniques to Materials Science IV: Volume 524 by Susan M. Mini Pdf

The 57 papers update the status of characterization techniques that use synchrotron radiation since the previous symposium on the subject in the spring of 1996. The techniques considered include X-ray absorption and scattering, imaging, tomography, microscopy, and topographic methods. Among the materials are surfaces, interfaces, electronic materials, metal oxides, solar cells, thin films, carbides, polymers, alloys, nanoparticles, and graphitic materials. Some of the papers are doubled spaced. Annotation copyrighted by Book News, Inc., Portland, OR

Composite Materials

Author : Deborah D.L. Chung
Publisher : Springer Science & Business Media
Page : 297 pages
File Size : 43,9 Mb
Release : 2013-06-29
Category : Technology & Engineering
ISBN : 9781447137320

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Composite Materials by Deborah D.L. Chung Pdf

Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal management, smart structures and other timely technologies rarely covered in existing books on composites. It also treats materials with polymer, metal, cement, carbon and ceramics matrices, contrasting with others that emphasise polymer-matrix composites. This functional approach will be useful to both practitioners and students. A good selection of example problems, solutions and figures, together with a new and vibrant approach, provides a valuable reference source for all engineers working with composite materials.

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Author : G.Q. Zhang,L.J. Ernst,O. de Saint Leger
Publisher : Springer Science & Business Media
Page : 195 pages
File Size : 54,6 Mb
Release : 2013-06-29
Category : Technology & Engineering
ISBN : 9781475731590

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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics by G.Q. Zhang,L.J. Ernst,O. de Saint Leger Pdf

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

Materials Science of Microelectromechanical Systems (MEMS) Devices

Author : Arthur H. Heuer,S. Joshua Jacobs
Publisher : Unknown
Page : 270 pages
File Size : 42,7 Mb
Release : 1999
Category : Technology & Engineering
ISBN : 1558994521

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Materials Science of Microelectromechanical Systems (MEMS) Devices by Arthur H. Heuer,S. Joshua Jacobs Pdf

Materials in Space - Science, Technology and Exploration: Volume 551

Author : Aloysius F. Hepp
Publisher : Unknown
Page : 336 pages
File Size : 47,8 Mb
Release : 1999-11-26
Category : Science
ISBN : UOM:39015041889620

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Materials in Space - Science, Technology and Exploration: Volume 551 by Aloysius F. Hepp Pdf

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Electron Microscopy of Semiconducting Materials and ULSI Devices

Author : Clive Hayzelden,Crispin Hetherington,Frances Ross
Publisher : Unknown
Page : 296 pages
File Size : 51,6 Mb
Release : 1998
Category : Technology & Engineering
ISBN : UOM:39015041916985

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Electron Microscopy of Semiconducting Materials and ULSI Devices by Clive Hayzelden,Crispin Hetherington,Frances Ross Pdf

The first symposium on electron microscopy and materials for ultra-large scale integration (ULSI) at the Society's meeting attracted 34 papers by contributors from Asia, North America, and Europe. They cover specimen preparation and defect analysis in semiconductor devices; metallization, silicides, and diffusion barriers; the advanced characterization of ULSI structures, and semiconductor epitaxy and heterostructures. Annotation copyrighted by Book News, Inc., Portland, OR

Proceedings 1999 International Symposium on Microelectronics

Author : Anonim
Publisher : Unknown
Page : 836 pages
File Size : 40,7 Mb
Release : 1999
Category : Electronic ceramics
ISBN : UCSD:31822025767401

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Proceedings 1999 International Symposium on Microelectronics by Anonim Pdf

This text comprises the proceedings of the 1999 International Symposium on Microelectronics.

Organic/Inorganic Hybrid Materials: Volume 519

Author : Richard M. Laine
Publisher : Mrs Proceedings
Page : 440 pages
File Size : 51,6 Mb
Release : 1998-11-18
Category : Technology & Engineering
ISBN : UCSD:31822026128363

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Organic/Inorganic Hybrid Materials: Volume 519 by Richard M. Laine Pdf

Contains fifty-three papers (both invited and presented) from the April 1998 MRS Spring Meeting symposium. Seven focus areas include molecular and nanocomposite hybrid synthesis; processing and characterization; porous materials produced by hybrid processing methods; hybrid materials that exhibit optical, electronic, catalytic or physical properties; and new methods of characterizing these materials. A sampling of topics: catalytic materials by design from hybrid organic-inorganics, self-organization in nanoparticle titanium dioxide thin films, characterization of dendrimerbased nanocomposites by SAXS and SANS, bioencapsulation, new inorganic-organic hybrid polymers for integrated optics, barrier properties of inorganic-organic polymers, and thermoplastics modified with nanoscale inorganic macromers. Annotation copyrighted by Book News, Inc., Portland, OR