Failure Mechanisms In Semiconductor Devices

Author : E. Ajith Amerasekera,Farid N. Najm
Publisher : John Wiley & Sons
Page : 368 pages
File Size : 55,6 Mb
Release : 1997-08-04
Category : Technology & Engineering
ISBN : UOM:39015040548888

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Failure Mechanisms in Semiconductor Devices by E. Ajith Amerasekera,Farid N. Najm Pdf

Failure Mechanisms in Semiconductor Devices Second Edition E. Ajith Amerasekera Texas Instruments Inc., Dallas, USA Farid N. Najm University of Illinois at Urbana-Champaign, USA Since the successful first edition of Failure Mechanisms in Semiconductor Devices, semiconductor technology has become increasingly important. The high complexity of today's integrated circuits has engendered a demand for greater component reliability. Reflecting the need for guaranteed performance in consumer applications, this thoroughly updated edition includes more detailed material on reliability modelling and prediction. The book analyses the main failure mechanisms in terms of cause, effects and prevention and explains the mathematics behind reliability analysis. The authors detail methodologies for the identification of failures and describe the approaches for building reliability into semiconductor devices. Their thorough yet accessible text covers the physics of failure mechanisms from the semiconductor die itself to the packaging and interconnections. Incorporating recent advances, this comprehensive survey of semiconductor reliability will be an asset to both engineers and graduate students in the field.

Author : E. Ajith Amerasekera,D. S. Campbell
Publisher : Wiley
Page : 220 pages
File Size : 49,7 Mb
Release : 1987-12-28
Category : Technology & Engineering
ISBN : 0471914347

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Failure Mechanisms in Semiconductor Devices by E. Ajith Amerasekera,D. S. Campbell Pdf

Thoroughly surveys the physics of failure mechanisms in semiconductor devices, from the semiconductor dye itself to the packaging and interconnections. Its specific intention is to identify the processes leading to damage and the techniques used to repair or detect it. Discusses and critiques accelerated lifetesting and how the various tests apply to different failure mechanisms. Also provides a critical review of reliability modelling and estimation and techniques, and quality assurance and screening techniques, emphasizing the complexity of present-generation integrated circuits. Throughout, suggestions are offered on ways to improve the quality of devices.

Author : A. Christou,B.A. Unger
Publisher : Springer Science & Business Media
Page : 571 pages
File Size : 53,6 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9789400924826

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Semiconductor Device Reliability by A. Christou,B.A. Unger Pdf

This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.

Author : Steven H. Voldman
Publisher : John Wiley & Sons
Page : 411 pages
File Size : 47,9 Mb
Release : 2009-07-01
Category : Technology & Engineering
ISBN : 9780470747261

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ESD by Steven H. Voldman Pdf

Electrostatic discharge (ESD) failure mechanisms continue to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a failure analysis and case-study approach. It provides a clear insight into the physics of failure from a generalist perspective, followed by investigation of failure mechanisms in specific technologies, circuits, and systems. The book is unique in covering both the failure mechanism and the practical solutions to fix the problem from either a technology or circuit methodology. Look inside for extensive coverage on: failure analysis tools, EOS and ESD failure sources and failure models of semiconductor technology, and how to use failure analysis to design more robust semiconductor components and systems; electro-thermal models and technologies; the state-of-the-art technologies discussed include CMOS, BiCMOS, silicon on insulator (SOI), bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, gallium arsenide (GaAs), gallium nitride (GaN), magneto-resistive (MR) , giant magneto-resistors (GMR), tunneling magneto-resistor (TMR), devices; micro electro-mechanical (MEM) systems, and photo-masks and reticles; practical methods to use failure analysis for the understanding of ESD circuit operation, temperature analysis, power distribution, ground rule development, internal bus distribution, current path analysis, quality metrics, (connecting the theoretical to the practical analysis); the failure of each key element of a technology from passives, active elements to the circuit, sub-system to package, highlighted by case studies of the elements, circuits and system-on-chip (SOC) in today’s products. ESD: Failure Mechanisms and Models is a continuation of the author’s series of books on ESD protection. It is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic era.

Author : Giulio Di Giacomo
Publisher : McGraw-Hill Professional Publishing
Page : 0 pages
File Size : 42,5 Mb
Release : 1997
Category : Microelectronic packaging
ISBN : 007017024X

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Reliability of Electronic Packages and Semiconductor Devices by Giulio Di Giacomo Pdf

This text looks at predicting and extending the functional life of semiconductor components. Using empirical modelling, the author covers major types of failure mechanisms that can greatly reduce the active life of semiconductor components, including interconnection fatigue and electromigration.

Author : P. Singh,Puligandla Viswanadham
Publisher : Springer Science & Business Media
Page : 391 pages
File Size : 43,7 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461560296

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Failure Modes and Mechanisms in Electronic Packages by P. Singh,Puligandla Viswanadham Pdf

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

Author : Marius Bazu,Titu Bajenescu
Publisher : John Wiley & Sons
Page : 372 pages
File Size : 41,5 Mb
Release : 2011-03-08
Category : Technology & Engineering
ISBN : 9781119990000

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Failure Analysis by Marius Bazu,Titu Bajenescu Pdf

Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

Author : M. E. Goldberg,M. F. Goldberg,Joseph Vaccaro
Publisher : Unknown
Page : 266 pages
File Size : 52,7 Mb
Release : 1963
Category : Electronic apparatus and appliances
ISBN : UCSD:31822015398662

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Physics of Failure in Electronics by M. E. Goldberg,M. F. Goldberg,Joseph Vaccaro Pdf

Author : Shahrzad Salemi
Publisher : RIAC
Page : 271 pages
File Size : 51,7 Mb
Release : 2008
Category : Electronic apparatus and appliances
ISBN : 9781933904290

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Physics-of-Failure Based Handbook of Microelectronic Systems by Shahrzad Salemi Pdf

Author : Michael Pecht,Riko Radojcic,Gopal Rao
Publisher : CRC Press
Page : 205 pages
File Size : 55,5 Mb
Release : 2017-11-22
Category : Technology & Engineering
ISBN : 9781351443562

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Guidebook for Managing Silicon Chip Reliability by Michael Pecht,Riko Radojcic,Gopal Rao Pdf

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

Author : Osamu Ueda,Stephen J. Pearton
Publisher : Springer Science & Business Media
Page : 618 pages
File Size : 47,7 Mb
Release : 2012-09-24
Category : Technology & Engineering
ISBN : 9781461443360

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Materials and Reliability Handbook for Semiconductor Optical and Electron Devices by Osamu Ueda,Stephen J. Pearton Pdf

Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.

Author : Jerry C. Whitaker
Publisher : CRC Press
Page : 2626 pages
File Size : 47,6 Mb
Release : 1996-12-23
Category : Technology & Engineering
ISBN : 0849383455

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The Electronics Handbook by Jerry C. Whitaker Pdf

The superb organization of The Electronics Handbook means that it is not only a comprehensive and fascinating reference, but also a pleasure to use. Some of these organizational features include:

Author : Morton E. Goldberg,Joseph Vaccaro
Publisher : Unknown
Page : 696 pages
File Size : 45,9 Mb
Release : 1965
Category : Electronic apparatus and appliances
ISBN : UCSD:31822033800624

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Physics of Failure in Electronics by Morton E. Goldberg,Joseph Vaccaro Pdf

Author : Alvin W. Strong,Ernest Y. Wu,Rolf-Peter Vollertsen,Jordi Sune,Giuseppe La Rosa,Timothy D. Sullivan,Stewart E. Rauch, III
Publisher : John Wiley & Sons
Page : 642 pages
File Size : 50,6 Mb
Release : 2009-10-13
Category : Technology & Engineering
ISBN : 9780470455258

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Reliability Wearout Mechanisms in Advanced CMOS Technologies by Alvin W. Strong,Ernest Y. Wu,Rolf-Peter Vollertsen,Jordi Sune,Giuseppe La Rosa,Timothy D. Sullivan,Stewart E. Rauch, III Pdf

This invaluable resource tells the complete story of failure mechanisms—from basic concepts to the tools necessary to conduct reliability tests and analyze the results. Both a text and a reference work for this important area of semiconductor technology, it assumes no reliability education or experience. It also offers the first reference book with all relevant physics, equations, and step-by-step procedures for CMOS technology reliability in one place. Practical appendices provide basic experimental procedures that include experiment design, performing stressing in the laboratory, data analysis, reliability projections, and interpreting projections.

Author : Anonim
Publisher : Unknown
Page : 412 pages
File Size : 49,7 Mb
Release : 1978
Category : Integrated circuits
ISBN : UOM:39015004479013

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Microcircuit Reliability Bibliography by Anonim Pdf