Graphene And Vlsi Interconnects

Author : Cher-Ming Tan,Udit Narula,Vivek Sangwan
Publisher : CRC Press
Page : 121 pages
File Size : 40,6 Mb
Release : 2021-11-24
Category : Science
ISBN : 9781000470680

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Graphene and VLSI Interconnects by Cher-Ming Tan,Udit Narula,Vivek Sangwan Pdf

Copper (Cu) has been used as an interconnection material in the semiconductor industry for years owing to its best balance of conductivity and performance. However, it is running out of steam as it is approaching its limits with respect to electrical performance and reliability. Graphene is a non-metal material, but it can help to improve electromigration (EM) performance of Cu because of its excellent properties. Combining graphene with Cu for very large-scale integration (VLSI) interconnects can be a viable solution. The incorporation of graphene into Cu allows the present Cu fabrication back-end process to remain unaltered, except for the small step of “inserting” graphene into Cu. Therefore, it has a great potential to revolutionize the VLSI integrated circuit (VLSI-IC) industry and appeal for further advancement of the semiconductor industry. This book is a compilation of comprehensive studies done on the properties of graphene and its synthesis methods suitable for applications of VLSI interconnects. It introduces the development of a new method to synthesize graphene, wherein it not only discusses the method to grow graphene over Cu but also allows the reader to know how to optimize graphene growth, using statistical design of experiments (DoE), on Cu interconnects in order to obtain good-quality and reliable interconnects. It provides a basic understanding of graphene–Cu interaction mechanism and evaluates the electrical and EM performance of graphenated Cu interconnects.

Author : Cher-Ming Tan,Udit Narula,Vivek Sangwan
Publisher : CRC Press
Page : 126 pages
File Size : 42,6 Mb
Release : 2021-11-25
Category : Science
ISBN : 9781000470673

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Graphene and VLSI Interconnects by Cher-Ming Tan,Udit Narula,Vivek Sangwan Pdf

Copper (Cu) has been used as an interconnection material in the semiconductor industry for years owing to its best balance of conductivity and performance. However, it is running out of steam as it is approaching its limits with respect to electrical performance and reliability. Graphene is a non-metal material, but it can help to improve electromigration (EM) performance of Cu because of its excellent properties. Combining graphene with Cu for very large-scale integration (VLSI) interconnects can be a viable solution. The incorporation of graphene into Cu allows the present Cu fabrication back-end process to remain unaltered, except for the small step of “inserting” graphene into Cu. Therefore, it has a great potential to revolutionize the VLSI integrated circuit (VLSI-IC) industry and appeal for further advancement of the semiconductor industry. This book is a compilation of comprehensive studies done on the properties of graphene and its synthesis methods suitable for applications of VLSI interconnects. It introduces the development of a new method to synthesize graphene, wherein it not only discusses the method to grow graphene over Cu but also allows the reader to know how to optimize graphene growth, using statistical design of experiments (DoE), on Cu interconnects in order to obtain good-quality and reliable interconnects. It provides a basic understanding of graphene–Cu interaction mechanism and evaluates the electrical and EM performance of graphenated Cu interconnects.

Author : Debaprasad Das,Hafizur Rahaman
Publisher : CRC Press
Page : 196 pages
File Size : 53,7 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781482239508

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Carbon Nanotube and Graphene Nanoribbon Interconnects by Debaprasad Das,Hafizur Rahaman Pdf

An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there is a growing need for nanoelectronic devices and their interconnects (a physical connecting medium made of thin metal films between several electrical nodes in a semiconducting chip that transmit signals from one point to another without any distortion). Carbon Nanotube and Graphene Nanoribbon Interconnects explores two new important carbon nanomaterials, carbon nanotube (CNT) and graphene nanoribbon (GNR), and compares them with that of copper-based interconnects. These nanomaterials show almost 1,000 times more current-carrying capacity and significantly higher mean free path than copper. Due to their remarkable properties, CNT and GNR could soon replace traditional copper interconnects. Dedicated to proving their benefits, this book covers the basic theory of CNT and GNR, and provides a comprehensive analysis of the CNT- and GNR-based VLSI interconnects at nanometric dimensions. Explore the Potential Applications of CNT and Graphene for VLSI Circuits The book starts off with a brief introduction of carbon nanomaterials, discusses the latest research, and details the modeling and analysis of CNT and GNR interconnects. It also describes the electrical, thermal, and mechanical properties, and structural behavior of these materials. In addition, it chronicles the progression of these fundamental properties, explores possible engineering applications and growth technologies, and considers applications for CNT and GNR apart from their use in VLSI circuits. Comprising eight chapters this text: Covers the basics of carbon nanotube and graphene nanoribbon Discusses the growth and characterization of carbon nanotube and graphene nanoribbon Presents the modeling of CNT and GNR as future VLSI interconnects Examines the applicability of CNT and GNR in terms of several analysis works Addresses the timing and frequency response of the CNT and GNR interconnects Explores the signal integrity analysis for CNT and GNR interconnects Models and analyzes the applicability of CNT and GNR as power interconnects Considers the future scope of CNT and GNR Beneficial to VLSI designers working in this area, Carbon Nanotube and Graphene Nanoribbon Interconnects provides a complete understanding of carbon-based materials and interconnect technology, and equips the reader with sufficient knowledge about the future scope of research and development for this emerging topic.

Author : Brajesh Kumar Kaushik,Manoj Kumar Majumder
Publisher : Springer
Page : 86 pages
File Size : 51,9 Mb
Release : 2014-11-01
Category : Technology & Engineering
ISBN : 9788132220473

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Carbon Nanotube Based VLSI Interconnects by Brajesh Kumar Kaushik,Manoj Kumar Majumder Pdf

The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

Author : Debaprasad Das,Hafizur Rahaman
Publisher : CRC Press
Page : 196 pages
File Size : 48,5 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781351831086

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Carbon Nanotube and Graphene Nanoribbon Interconnects by Debaprasad Das,Hafizur Rahaman Pdf

An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there is a growing need for nanoelectronic devices and their interconnects (a physical connecting medium made of thin metal films between several electrical nodes in a semiconducting chip that transmit signals from one point to another without any distortion). Carbon Nanotube and Graphene Nanoribbon Interconnects explores two new important carbon nanomaterials, carbon nanotube (CNT) and graphene nanoribbon (GNR), and compares them with that of copper-based interconnects. These nanomaterials show almost 1,000 times more current-carrying capacity and significantly higher mean free path than copper. Due to their remarkable properties, CNT and GNR could soon replace traditional copper interconnects. Dedicated to proving their benefits, this book covers the basic theory of CNT and GNR, and provides a comprehensive analysis of the CNT- and GNR-based VLSI interconnects at nanometric dimensions. Explore the Potential Applications of CNT and Graphene for VLSI Circuits The book starts off with a brief introduction of carbon nanomaterials, discusses the latest research, and details the modeling and analysis of CNT and GNR interconnects. It also describes the electrical, thermal, and mechanical properties, and structural behavior of these materials. In addition, it chronicles the progression of these fundamental properties, explores possible engineering applications and growth technologies, and considers applications for CNT and GNR apart from their use in VLSI circuits. Comprising eight chapters this text: Covers the basics of carbon nanotube and graphene nanoribbon Discusses the growth and characterization of carbon nanotube and graphene nanoribbon Presents the modeling of CNT and GNR as future VLSI interconnects Examines the applicability of CNT and GNR in terms of several analysis works Addresses the timing and frequency response of the CNT and GNR interconnects Explores the signal integrity analysis for CNT and GNR interconnects Models and analyzes the applicability of CNT and GNR as power interconnects Considers the future scope of CNT and GNR Beneficial to VLSI designers working in this area, Carbon Nanotube and Graphene Nanoribbon Interconnects provides a complete understanding of carbon-based materials and interconnect technology, and equips the reader with sufficient knowledge about the future scope of research and development for this emerging topic.

Author : Afreen Khursheed,Kavita Khare
Publisher : CRC Press
Page : 187 pages
File Size : 55,9 Mb
Release : 2021-12-23
Category : Technology & Engineering
ISBN : 9781000504316

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Nano Interconnects by Afreen Khursheed,Kavita Khare Pdf

This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book: Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects. Discusses properties and performance of practical nanotube devices and related applications. Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology. Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect. Examines interconnect power and interconnect delay issues arising due to downscaling of device size.

Author : Esteban Tlelo-Cuautle,Sheldon X.-D. Tan
Publisher : BoD – Books on Demand
Page : 306 pages
File Size : 46,7 Mb
Release : 2012-01-20
Category : Technology & Engineering
ISBN : 9789533078847

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VLSI Design by Esteban Tlelo-Cuautle,Sheldon X.-D. Tan Pdf

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc.

Author : Anirban Sengupta,Sudeb Dasgupta,Virendra Singh,Rohit Sharma,Santosh Kumar Vishvakarma
Publisher : Springer
Page : 775 pages
File Size : 49,9 Mb
Release : 2019-08-17
Category : Computers
ISBN : 9789813297678

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VLSI Design and Test by Anirban Sengupta,Sudeb Dasgupta,Virendra Singh,Rohit Sharma,Santosh Kumar Vishvakarma Pdf

This book constitutes the refereed proceedings of the 23st International Symposium on VLSI Design and Test, VDAT 2019, held in Indore, India, in July 2019. The 63 full papers were carefully reviewed and selected from 199 submissions. The papers are organized in topical sections named: analog and mixed signal design; computing architecture and security; hardware design and optimization; low power VLSI and memory design; device modelling; and hardware implementation.

Author : B.K. Kaushik,V. Ramesh Kumar,Amalendu Patnaik
Publisher : Springer
Page : 116 pages
File Size : 47,7 Mb
Release : 2016-04-06
Category : Technology & Engineering
ISBN : 9789811008009

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Crosstalk in Modern On-Chip Interconnects by B.K. Kaushik,V. Ramesh Kumar,Amalendu Patnaik Pdf

The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.

Author : James E. Morris
Publisher : Springer
Page : 996 pages
File Size : 40,7 Mb
Release : 2018-09-22
Category : Technology & Engineering
ISBN : 9783319903620

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Nanopackaging by James E. Morris Pdf

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Author : Fakhfakh, Mourad
Publisher : IGI Global
Page : 464 pages
File Size : 51,5 Mb
Release : 2014-10-31
Category : Technology & Engineering
ISBN : 9781466666283

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Performance Optimization Techniques in Analog, Mixed-Signal, and Radio-Frequency Circuit Design by Fakhfakh, Mourad Pdf

Improving the performance of existing technologies has always been a focal practice in the development of computational systems. However, as circuitry is becoming more complex, conventional techniques are becoming outdated and new research methodologies are being implemented by designers. Performance Optimization Techniques in Analog, Mix-Signal, and Radio-Frequency Circuit Design features recent advances in the engineering of integrated systems with prominence placed on methods for maximizing the functionality of these systems. This book emphasizes prospective trends in the field and is an essential reference source for researchers, practitioners, engineers, and technology designers interested in emerging research and techniques in the performance optimization of different circuit designs.

Author : P. Uma Sathyakam,Partha Sharathi Mallick
Publisher : Springer Nature
Page : 134 pages
File Size : 55,5 Mb
Release : 2020-10-31
Category : Technology & Engineering
ISBN : 9789811588884

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Design and Crosstalk Analysis in Carbon Nanotube Interconnects by P. Uma Sathyakam,Partha Sharathi Mallick Pdf

This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances in modelling and challenges of carbon nanotube (CNT)-based VLSI interconnects. Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries. Various topics covered include the use of semiconducting CNTs around metallic CNTs, CNT interconnects with air gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques. This book will be useful for researchers and design engineers working on carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Author : Alkire,Arnold,Atanassov,Ayers,Bayachou,Banerjee,Barrera,Biddinger,Blackburn,Bock,Boghossian,Botte,Burgess,Calabrese Barton,Chaitanya,Chen,Choi,Chu,Cliffel,D'Souza,DaRos,Di Noto,Diaz,Dinh,Doeff,Doorn,Doughty,Echegoyen,Fenton,Fergus,Gaillard,Gasteiger,Gottesfeld,Grebel,Guldi,Harb,Hillier,Hesketh,Hirsch,Homma,Hunter,Imahori,Simonian,Itagaki,Jackson,Johnson,Kamat,Khosla,Kim,Koehne,Kostecki,Kulesza,Kusoglu,Leonte,Liaw,Lucht,Magagnin,Manivannan,Manthiram,Martel,Meng,Milliron,Minteer,Mitra,Mukundan,Muldoon,Nagahara,Narayan,Nguyen,Obeng,Orendorff,Paddison,Papadimitrakopoulos,Pharkya,Pintauro,Podlaha,Pylypenko,Ramasamy,Riemer,Rotkin,Rougier,Roy,Sailor,Schmidt,Sekhar,Shacham-Diamand,Shao,Soleymani,Stefan-van Staden,Stevenson,Stickney,Subramanian,Sundaram,Suroviec,Taylor,Virtanen,Wang,Weber,Xing,Yoshihara,Zangari,Zawodzinski
Publisher : The Electrochemical Society
Page : 2056 pages
File Size : 52,8 Mb
Release : 2017-08-04
Category : Science
ISBN : 9781607688174

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Selected Proceedings from the 231st ECS Meeting by Alkire,Arnold,Atanassov,Ayers,Bayachou,Banerjee,Barrera,Biddinger,Blackburn,Bock,Boghossian,Botte,Burgess,Calabrese Barton,Chaitanya,Chen,Choi,Chu,Cliffel,D'Souza,DaRos,Di Noto,Diaz,Dinh,Doeff,Doorn,Doughty,Echegoyen,Fenton,Fergus,Gaillard,Gasteiger,Gottesfeld,Grebel,Guldi,Harb,Hillier,Hesketh,Hirsch,Homma,Hunter,Imahori,Simonian,Itagaki,Jackson,Johnson,Kamat,Khosla,Kim,Koehne,Kostecki,Kulesza,Kusoglu,Leonte,Liaw,Lucht,Magagnin,Manivannan,Manthiram,Martel,Meng,Milliron,Minteer,Mitra,Mukundan,Muldoon,Nagahara,Narayan,Nguyen,Obeng,Orendorff,Paddison,Papadimitrakopoulos,Pharkya,Pintauro,Podlaha,Pylypenko,Ramasamy,Riemer,Rotkin,Rougier,Roy,Sailor,Schmidt,Sekhar,Shacham-Diamand,Shao,Soleymani,Stefan-van Staden,Stevenson,Stickney,Subramanian,Sundaram,Suroviec,Taylor,Virtanen,Wang,Weber,Xing,Yoshihara,Zangari,Zawodzinski Pdf

Author : Sandip Bhattacharya,J Ajayan,Fernando Avila Herrera
Publisher : CRC Press
Page : 223 pages
File Size : 52,8 Mb
Release : 2023-12-22
Category : Technology & Engineering
ISBN : 9781003817062

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Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design by Sandip Bhattacharya,J Ajayan,Fernando Avila Herrera Pdf

Focusses on materials and nanomaterials utilization in next generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR) Helps readers realize interconnects, interconnect models, and crosstalk noise analysis Describes hybrid CNT and GNR based interconnects Presents the details of power supply voltage drop analysis in CNT and GNR interconnects Overviews pertinent RF performance and stability analysis

Author : R. K. Nagaria,V. S. Tripathi,Carlos Ruiz Zamarreno,Yogendra Kumar Prajapati
Publisher : Springer Nature
Page : 867 pages
File Size : 42,5 Mb
Release : 2023-07-01
Category : Technology & Engineering
ISBN : 9789819909735

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VLSI, Communication and Signal Processing by R. K. Nagaria,V. S. Tripathi,Carlos Ruiz Zamarreno,Yogendra Kumar Prajapati Pdf

This book covers a variety of topics in Electronics and Communication Engineering, especially in the area of microelectronics and VLSI design, communication systems and networks, and signal and image processing. The content is based on papers presented at the 5th International Conference on VLSI, Communication and Signal Processing (VCAS 2022). The book also discusses the emerging applications of novel tools and techniques in image, video, and multimedia signal processing. This book is useful to students, researchers, and professionals working in the electronics and communication domain.