Materials And Technologies For 3 D Integration

Author : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Publisher : John Wiley & Sons
Page : 488 pages
File Size : 52,5 Mb
Release : 2019-05-06
Category : Technology & Engineering
ISBN : 9783527338559

Get Book

Handbook of 3D Integration, Volume 4 by Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir Pdf

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Author : Philip Garrou,Mitsumasa Koyanagi,Peter Ramm
Publisher : John Wiley & Sons
Page : 484 pages
File Size : 47,7 Mb
Release : 2014-04-22
Category : Technology & Engineering
ISBN : 9783527670123

Get Book

Handbook of 3D Integration, Volume 3 by Philip Garrou,Mitsumasa Koyanagi,Peter Ramm Pdf

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

Author : Philip Garrou,Christopher Bower,Peter Ramm
Publisher : John Wiley & Sons
Page : 798 pages
File Size : 45,8 Mb
Release : 2011-09-22
Category : Technology & Engineering
ISBN : 9783527623068

Get Book

Handbook of 3D Integration, Volume 1 by Philip Garrou,Christopher Bower,Peter Ramm Pdf

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

Author : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Publisher : John Wiley & Sons
Page : 265 pages
File Size : 44,6 Mb
Release : 2019-01-25
Category : Technology & Engineering
ISBN : 9783527697045

Get Book

Handbook of 3D Integration, Volume 4 by Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir Pdf

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Author : Muhannad S. Bakir,James D. Meindl
Publisher : Artech House
Page : 551 pages
File Size : 50,8 Mb
Release : 2008-11-30
Category : Technology & Engineering
ISBN : 9781596932470

Get Book

Integrated Interconnect Technologies for 3D Nanoelectronic Systems by Muhannad S. Bakir,James D. Meindl Pdf

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

Author : Nettleton, Kimberely Fletcher
Publisher : IGI Global
Page : 456 pages
File Size : 41,7 Mb
Release : 2013-01-31
Category : Education
ISBN : 9781466628168

Get Book

Cases on 3D Technology Application and Integration in Education by Nettleton, Kimberely Fletcher Pdf

Cases on 3D Technology Application and Integration in Education highlights the use of 3D technologies in the educational environment and the future prospects of adaption and evolution beyond the traditional methods of teaching. This comprehensive collection of research aims to provide instructors and researchers with a solid foundation of information on 3D technology.

Author : Abbas Sheibanyrad,Frédéric Pétrot,Axel Jantsch
Publisher : Springer Science & Business Media
Page : 280 pages
File Size : 48,6 Mb
Release : 2010-11-08
Category : Technology & Engineering
ISBN : 9781441976185

Get Book

3D Integration for NoC-based SoC Architectures by Abbas Sheibanyrad,Frédéric Pétrot,Axel Jantsch Pdf

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

Author : Fred Roozeboom
Publisher : Unknown
Page : 304 pages
File Size : 47,9 Mb
Release : 2009
Category : Computer graphics
ISBN : UCSD:31822037778206

Get Book

Materials and Technologies for 3-D Integration by Fred Roozeboom Pdf

Author : Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif
Publisher : Springer Science & Business Media
Page : 365 pages
File Size : 41,9 Mb
Release : 2009-06-29
Category : Technology & Engineering
ISBN : 9780387765341

Get Book

Wafer Level 3-D ICs Process Technology by Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif Pdf

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Author : Rohit Sharma
Publisher : CRC Press
Page : 328 pages
File Size : 42,5 Mb
Release : 2018-09-03
Category : Technology & Engineering
ISBN : 9781351831598

Get Book

Design of 3D Integrated Circuits and Systems by Rohit Sharma Pdf

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Author : Anonim
Publisher : The Electrochemical Society
Page : 588 pages
File Size : 43,9 Mb
Release : 2008-10
Category : Microelectromechanical systems
ISBN : 9781566776547

Get Book

Semiconductor Wafer Bonding 10: Science, Technology, and Applications by Anonim Pdf

This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.

Author : Masayoshi Esashi
Publisher : John Wiley & Sons
Page : 528 pages
File Size : 46,8 Mb
Release : 2021-03-16
Category : Technology & Engineering
ISBN : 9783527823253

Get Book

3D and Circuit Integration of MEMS by Masayoshi Esashi Pdf

Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Author : Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Publisher : CRC Press
Page : 376 pages
File Size : 51,9 Mb
Release : 2016-04-19
Category : Science
ISBN : 9789814303828

Get Book

3D Integration for VLSI Systems by Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester Pdf

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Author : Tapan Gupta
Publisher : Springer Science & Business Media
Page : 423 pages
File Size : 51,5 Mb
Release : 2010-01-22
Category : Technology & Engineering
ISBN : 9781441900760

Get Book

Copper Interconnect Technology by Tapan Gupta Pdf

Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.

Author : Christopher A. Bower
Publisher : Unknown
Page : 320 pages
File Size : 42,8 Mb
Release : 2007-03-30
Category : Computers
ISBN : UOM:39015059144363

Get Book

Enabling Technologies for 3-D Integration: Volume 970 by Christopher A. Bower Pdf

An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc...) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.