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Author : Navid Yazdi
Publisher : Unknown
Page : 320 pages
File Size : 42,5 Mb
Release : 1999
Category : Accelerometers
ISBN : UOM:39015043228066
Author : Mahmoud Rasras,Ibrahim (Abe) M. Elfadel,Ha Duong Ngo
Publisher : MDPI
Page : 252 pages
File Size : 47,5 Mb
Release : 2019-05-27
Category : Technology & Engineering
ISBN : 9783038974147
Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Author : Xu, Yong Ping
Publisher : River Publishers
Page : 312 pages
File Size : 52,7 Mb
Release : 2019-02-12
Category : Technology & Engineering
ISBN : 9788770220453
Most MEMS accelerometers on the market today are capacitive accelerometers that are based on the displacement sensing mechanism. This book is intended to cover recent developments of MEMS silicon oscillating accelerometers (SOA), also referred to as MEMS resonant accelerometer. As contrast to the capacitive accelerometer, the MEMS SOA is based on the force sensing mechanism, where the input acceleration is converted to a frequency output. MEMS Silicon Oscillating Accelerometers and Readout Circuits consists of six chapters and covers both MEMS sensor and readout circuit, and provides an in-depth coverage on the design and modelling of the MEMS SOA with several recently reported prototypes. The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.
Author : Henry Baltes,Oliver Brand,Gary K. Fedder,Christofer Hierold,Jan G. Korvink,Osamu Tabata
Publisher : John Wiley & Sons
Page : 610 pages
File Size : 44,9 Mb
Release : 2013-03-26
Category : Technology & Engineering
ISBN : 9783527675067
This edition of 'CMOS-MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, the combination of the globally established, billion dollar chip mass fabrication technology CMOS with the fascinating and commercially promising new world of MEMS is covered from all angles. The book introduces readers to this fi eld and takes them from fabrication technologies and material charaterization aspects to the actual applications of CMOS-MEMS - a wide range of miniaturized physical, chemical and biological sensors and RF systems. Vital knowledge on circuit and system integration issues concludes this in-depth treatise, illustrating the advantages of combining CMOS and MEMS in the first place, rather than having a hybrid solution.
Author : Haluk Kulah
Publisher : Unknown
Page : 328 pages
File Size : 42,6 Mb
Release : 2003
Category : Electronic
ISBN : UOM:39015056499554
Author : Junseok Chae
Publisher : Unknown
Page : 356 pages
File Size : 49,6 Mb
Release : 2003
Category : Electronic
ISBN : UOM:39015060006239
Author : Markku Tilli,Mervi Paulasto-Kröckel,Matthias Petzold,Horst Theuss,Teruaki Motooka,Veikko Lindroos
Publisher : Elsevier
Page : 1028 pages
File Size : 47,6 Mb
Release : 2020-04-17
Category : Technology & Engineering
ISBN : 9780128177877
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
Author : David Frederick Lemmerhirt
Publisher : Unknown
Page : 412 pages
File Size : 51,8 Mb
Release : 2005
Category : Electronic
ISBN : UOM:39015062412740
Author : Abhijeet V. Chavan
Publisher : Unknown
Page : 620 pages
File Size : 43,6 Mb
Release : 2000
Category : Electronic
ISBN : UOM:39015050175010
Author : Shamus McNamara
Publisher : Unknown
Page : 166 pages
File Size : 48,8 Mb
Release : 2002
Category : Electronic
ISBN : WISC:89081079832
Author : Anonim
Publisher : Unknown
Page : 598 pages
File Size : 54,9 Mb
Release : 2000
Category : Electric circuits
ISBN : UIUC:30112033009678
Author : Giuseppe Ferri,Vincenzo Stornelli
Publisher : MDPI
Page : 171 pages
File Size : 51,7 Mb
Release : 2018-12-07
Category : Electronic books
ISBN : 9783038973768
This book is a printed edition of the Special Issue "Interface Circuits for Microsensor Integrated Systems" that was published in Micromachines
Author : Ark-Chew Wong
Publisher : Unknown
Page : 524 pages
File Size : 43,5 Mb
Release : 2001
Category : Microelectromechanical systems
ISBN : UOM:39015053748896
Author : Anonim
Publisher : Unknown
Page : 1020 pages
File Size : 52,8 Mb
Release : 2003
Category : Actuators
ISBN : UOM:39015047932655
Author : Daniel Durini
Publisher : Woodhead Publishing
Page : 522 pages
File Size : 46,9 Mb
Release : 2019-10-19
Category : Technology & Engineering
ISBN : 9780081024355
High Performance Silicon Imaging: Fundamentals and Applications of CMOS and CCD Sensors, Second Edition, covers the fundamentals of silicon image sensors, addressing existing performance issues and current and emerging solutions. Silicon imaging is a fast growing area of the semiconductor industry. Its use in cell phone cameras is already well established, with emerging applications including web, security, automotive and digital cinema cameras. The book has been revised to reflect the latest state-of-the art developments in the field, including 3D imaging, advances in achieving lower signal noise, and new applications for consumer markets. The fundamentals section has also been expanded to include a chapter on the characterization and testing of CMOS and CCD sensors that is crucial to the success of new applications. This book is an excellent resource for both academics and engineers working in the optics, photonics, semiconductor and electronics industries. Covers the fundamentals of silicon-based image sensors and technical advances, focusing on performance issues Looks at image sensors in applications, such as mobile phones, scientific imaging, and TV broadcasting, and in automotive, consumer and biomedical applications Addresses the theory behind 3D imaging and 3D sensor development, including challenges and opportunities