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Author : P. Bindra,Robin A. Susko
Publisher : Unknown
Page : 266 pages
File Size : 45,6 Mb
Release : 1989
Category : Electronic packaging
ISBN : STANFORD:36105030017508
Author : Anonim
Publisher : ASM International
Page : 1234 pages
File Size : 55,9 Mb
Release : 1989-11-01
Category : Technology & Engineering
ISBN : 0871702851
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author : Gerald A. Walker
Publisher : Springer
Page : 342 pages
File Size : 54,9 Mb
Release : 2013-12-11
Category : Technology & Engineering
ISBN : 9781489973115
Author : Anonim
Publisher : Unknown
Page : 412 pages
File Size : 53,5 Mb
Release : 1978
Category : Integrated circuits
ISBN : UOM:39015004479013
Author : Lubomyr Taras Romankiw,Tetsuya Ōsaka
Publisher : Unknown
Page : 832 pages
File Size : 47,6 Mb
Release : 1988
Category : Electrochemistry, Industrial
ISBN : UCAL:B4164914
Author : Lawrence L. Rosine
Publisher : Springer
Page : 297 pages
File Size : 43,7 Mb
Release : 2013-12-01
Category : Technology & Engineering
ISBN : 9781489973078
Author : John R. Susko,Randy W. Snyder,Robin A. Susko
Publisher : Unknown
Page : 228 pages
File Size : 45,5 Mb
Release : 1988
Category : Electrochemistry
ISBN : STANFORD:36105030501303
Author : X.J. Fan,E. Suhir
Publisher : Springer Science & Business Media
Page : 558 pages
File Size : 53,5 Mb
Release : 2010-07-23
Category : Technology & Engineering
ISBN : 9781441957191
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Author : Gerald A. Walker
Publisher : Unknown
Page : 0 pages
File Size : 51,6 Mb
Release : 1960
Category : Electronic packaging
ISBN : OCLC:29288768
Author : James E. Morris
Publisher : Springer Science & Business Media
Page : 459 pages
File Size : 46,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9789400904392
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
Author : Vitaliy Zhurbenko
Publisher : BoD – Books on Demand
Page : 502 pages
File Size : 40,9 Mb
Release : 2010-04-01
Category : Technology & Engineering
ISBN : 9789533070872
This book is based on recent research work conducted by the authors dealing with the design and development of active and passive microwave components, integrated circuits and systems. It is divided into seven parts. In the first part comprising the first two chapters, alternative concepts and equations for multiport network analysis and characterization are provided. A thru-only de-embedding technique for accurate on-wafer characterization is introduced. The second part of the book corresponds to the analysis and design of ultra-wideband low- noise amplifiers (LNA).
Author : Vijay K. Varadan,K. J. Vinoy,K. A. Jose
Publisher : John Wiley & Sons
Page : 406 pages
File Size : 43,5 Mb
Release : 2003-07-25
Category : Technology & Engineering
ISBN : 9780470846193
Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.
Author : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
Publisher : Newnes
Page : 768 pages
File Size : 44,9 Mb
Release : 2017-07-04
Category : Technology & Engineering
ISBN : 9780124104846
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author : Judy Pecht
Publisher : CRC Press
Page : 130 pages
File Size : 43,9 Mb
Release : 2019-07-23
Category : Mathematics
ISBN : 9781351082624
In today's electronic environment, operating reliability for continued daily use of electronic products is essential. This book discusses the reliability of products that lie dormant for long periods of time and are subject to stresses such as humidity, ionic contaminants, temperature, radiation, shock, and vibration. Non-operating reliability is especially critical for life-saving electronic products such as fire alarm systems, standby power sources, and burglar alarms. Air bags in automobiles, earthquake alarm systems, and radiation warning systems in nuclear power plants are also covered. This physics-of-failure approach is also important to maintaining defense hardware such as missiles and munitions systems which often lie dormant for years before being deployed on very short notice
Author : Suzanne Costello,Marc P.Y. Desmulliez
Publisher : Artech House
Page : 197 pages
File Size : 49,5 Mb
Release : 2013-10-01
Category : Technology & Engineering
ISBN : 9781608075270
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today’s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.
