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Author : Anonim
Publisher : Unknown
Page : 322 pages
File Size : 40,9 Mb
Release : 2005
Category : Electronic packaging
ISBN : UOM:39015058301485
Author : Components, Packaging & Manufacturing Technology Society,IEEE Electrical Insulation Society Staff,Yixiong Huang,ieee,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 488 pages
File Size : 40,7 Mb
Release : 2011-11
Category : Electronic
ISBN : 1467301485
Author : Components, Packaging, and Manufacturing Technology Society,Semiconductor Equipment and Materials International,Components, Packaging & Manufacturing Technology Society. Santa Clara Valley Chapter,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 132 pages
File Size : 44,5 Mb
Release : 2007
Category : Electronic packaging
ISBN : 1424413389
Author : Anonim
Publisher : IEEE Computer Society Press
Page : 281 pages
File Size : 43,9 Mb
Release : 2004-01-01
Category : Electronic packaging
ISBN : 0780384369
Author : Anonim
Publisher : International Society of Hybrid
Page : 349 pages
File Size : 40,6 Mb
Release : 2000
Category : Technology & Engineering
ISBN : 0930815599
These conference proceedings cover such topics as: high density packaging materials; automotive electronics; system level packaging; chip scale packaging; optoelectronics; power packaging; sensors; actuators, and MEMS; flex circuits; and thermal management.
Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 49,8 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Yixiong Huang,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 488 pages
File Size : 51,9 Mb
Release : 2011
Category : Electronic
ISBN : 1467301477
Author : Anonim
Publisher : Unknown
Page : 224 pages
File Size : 54,9 Mb
Release : 1997
Category : Electronic packaging
ISBN : CORNELL:31924079773507
Author : Anonim
Publisher : Unknown
Page : 488 pages
File Size : 47,7 Mb
Release : 2011
Category : Electronic packaging
ISBN : OCLC:775357733
Author : Anonim
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 302 pages
File Size : 40,6 Mb
Release : 2005-01-01
Category : Electronic packaging
ISBN : 0780390857
Author : Anonim
Publisher : IEEE Computer Society Press
Page : 130 pages
File Size : 43,6 Mb
Release : 2007-01-01
Category : Technology & Engineering
ISBN : 1424413370
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 43,9 Mb
Release : 2010
Category : Electronic packaging
ISBN : 142446756X
Author : C. P. Wong
Publisher : IEEE
Page : 362 pages
File Size : 47,6 Mb
Release : 1999
Category : Technology & Engineering
ISBN : 0930815564
The 5th International Symposium on Advanced Packaging Materials was devoted to the advances made in electronic packaging materials. Topics covered in these proceedings include adhesives, integral passive materials, on-chip interconnect materials, underfills and encapsulent materials.
Author : IEEE Electrical Insulation Society Staff
Publisher : Unknown
Page : 128 pages
File Size : 44,8 Mb
Release : 2013-02-27
Category : Technology & Engineering
ISBN : 1467360937
Author : Anonim
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 402 pages
File Size : 46,5 Mb
Release : 2002
Category : Science
ISBN : CORNELL:31924093614513
This volume originates from the 2002 8th International Advanced Packaging Materials Symposium and covers topics including: bending of bare fibres; bare fibre under the combined action of bending and tension; polymer coated fibres; and solder materials and joints.
