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Author : A. Christou
Publisher : RIAC
Page : 392 pages
File Size : 43,5 Mb
Release : 1996
Category : Technology & Engineering
ISBN : 9780965266949
Author : F. Patrick McCluskey,Thomas Podlesak,Richard Grzybowski
Publisher : CRC Press
Page : 279 pages
File Size : 49,9 Mb
Release : 2018-05-04
Category : Technology & Engineering
ISBN : 9781351440806
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Author : Randall Kirschman
Publisher : Wiley-IEEE Press
Page : 0 pages
File Size : 47,7 Mb
Release : 1998-09-01
Category : Technology & Engineering
ISBN : 0780334779
"HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.
Author : Aris Christou,Willie M. Webb
Publisher : RIAC
Page : 260 pages
File Size : 45,5 Mb
Release : 2006
Category : Electronic
ISBN : 9781933904108
Author : Lucian Stoica,Steve Riches,Colin Johnston
Publisher : CRC Press
Page : 161 pages
File Size : 49,9 Mb
Release : 2022-09-01
Category : Technology & Engineering
ISBN : 9781000795455
There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include:• High temperature electronics market• High temperature devices, materials and assembly processes• Design, manufacture and testing of multi-sensor data acquisition system for aero-engine control• Future applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering.
Author : Pradeep Lall,Michael G. Pecht,Edward B. Hakim
Publisher : CRC Press
Page : 332 pages
File Size : 55,7 Mb
Release : 2020-07-09
Category : Technology & Engineering
ISBN : 9780429605598
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Author : Milton Ohring,Lucian Kasprzak
Publisher : Academic Press
Page : 758 pages
File Size : 55,9 Mb
Release : 2014-11-03
Category : Technology & Engineering
ISBN : 9780080575520
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author : Edmundo A. Gutierrez-D.,M. Jamal Deen,Cor L. Claeys
Publisher : Academic Press
Page : 985 pages
File Size : 44,8 Mb
Release : 2001
Category : Cryoelectronics
ISBN : 9780123106759
Summarizes the advances in cryoelectronics starting from the fundamentals in physics and semiconductor devices to electronic systems, hybrid superconductor-semiconductor technologies, photonic devices, cryocoolers and thermal management. This book provides an exploration of the theory, research, and technologies related to cryoelectronics.
Author : Magnus Willander,H. L. Hartnagel
Publisher : Springer
Page : 346 pages
File Size : 44,9 Mb
Release : 1997
Category : Education
ISBN : UOM:39015040982616
High Temperature Electronics covers a very active and topical area. This text reviews in detail the trends and options for electronic materials in high temperature environments. The contributors are leading authorities from several countries to provide an international appeal. After an introduction to the subject, users of these materials (e.g. aircraft and space, automotive, military and power industries) are considered. A discussion of silicon and gallium arsenide electronics is followed by an assessment of the future for electronic materials and devices.
Author : Titu I. Bajenescu,Marius I. Bazu
Publisher : Springer Science & Business Media
Page : 547 pages
File Size : 45,5 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9783642585050
This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
Author : Norman. B. Fuqua
Publisher : CRC Press
Page : 406 pages
File Size : 45,7 Mb
Release : 2020-11-26
Category : Technology & Engineering
ISBN : 9781000103359
This book addresses the needs of electronic design engineers, reliability engineers, and their respective managers, stressing a pragmatic viewpoint rather than a vigorous mathematical presentation.
Author : John X. Wang
Publisher : CRC Press
Page : 350 pages
File Size : 46,8 Mb
Release : 2012-07-25
Category : Technology & Engineering
ISBN : 9781439826690
Going "green" is becoming a major component of the mission for electronics manufacturers worldwide. While this goal seems simplistic, it poses daunting dilemmas. Yet, to compete effectively in the global economy, manufacturers must take the initiative to drive this crucial movement. Green Electronics Manufacturing: Creating Environmental Sensible P
Author : Stoica Lucian ,Riches Steve ,Johnston Colin
Publisher : River Publishers
Page : 162 pages
File Size : 52,8 Mb
Release : 2016-09-30
Category : Technology & Engineering
ISBN : 9788793379251
There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include: High temperature electronics marketHigh temperature devices, materials and assembly processesDesign, manufacture and testing of multi-sensor data acquisition system for aero-engine controlFuture applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering.
Author : Richard K. Ulrich,William D. Brown
Publisher : John Wiley & Sons
Page : 852 pages
File Size : 54,8 Mb
Release : 2006-02-24
Category : Technology & Engineering
ISBN : 9780471466093
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author : Eugene R. Hnatek
Publisher : CRC Press
Page : 433 pages
File Size : 43,7 Mb
Release : 2002-10-25
Category : Technology & Engineering
ISBN : 9780824743543
Practical Reliability of Electronic Equipment and Products will help electrical, electronics, manufacturing, mechanical, systems design, and reliability engineers; electronics production managers; electronic circuit designers; and upper-level undergraduate and graduate students in these disciplines.