Author : Erdogan Madenci,Ibrahim Guven,Bahattin Kilic
Publisher : Springer Science & Business Media
Page : 201 pages
File Size : 43,6 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461502555
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® by Erdogan Madenci,Ibrahim Guven,Bahattin Kilic Pdf
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.