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Author : Anonim
Publisher : Unknown
Page : 186 pages
File Size : 45,9 Mb
Release : 2002
Category : Electronic packaging
ISBN : CORNELL:31924090474150
Author : Anonim
Publisher : Unknown
Page : 660 pages
File Size : 44,5 Mb
Release : 1983
Category : Microelectronics
ISBN : UIUC:30112033136125
Author : Phillipe Cognard
Publisher : Elsevier
Page : 398 pages
File Size : 48,8 Mb
Release : 2005-07-14
Category : Technology & Engineering
ISBN : 9780080534091
Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives Every scientific and technical issue concerning every chemical type in every industry Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways
Author : Anonim
Publisher : Unknown
Page : 530 pages
File Size : 43,5 Mb
Release : 1999
Category : Electronic packaging
ISBN : CORNELL:31924071771095
Author : Michael Pecht,Abhijit Dasgupta,John W. Evans,Jillian Y. Evans
Publisher : John Wiley & Sons
Page : 498 pages
File Size : 49,6 Mb
Release : 1994-12-13
Category : Technology & Engineering
ISBN : 0471594369
All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Author : Maria Prudenziati,Jacob Hormadaly
Publisher : Elsevier
Page : 609 pages
File Size : 54,7 Mb
Release : 2012-08-30
Category : Technology & Engineering
ISBN : 9780857096210
Whilst printed films are currently used in varied devices across a wide range of fields, research into their development and properties is increasingly uncovering even greater potential. Printed films provides comprehensive coverage of the most significant recent developments in printed films and their applications.Materials and properties of printed films are the focus of part one, beginning with a review of the concepts, technologies and materials involved in their production and use. Printed films as electrical components and silicon metallization for solar cells are discussed, as are conduction mechanisms in printed film resistors, and thick films in packaging and microelectronics. Part two goes on to review the varied applications of printed films in devices. Printed resistive sensors are considered, as is the role of printed films in capacitive, piezoelectric and pyroelectric sensors, mechanical micro-systems and gas sensors. The applications of printed films in biosensors, actuators, heater elements, varistors and polymer solar cells are then explored, followed by a review of screen printing for the fabrication of solid oxide fuel cells and laser printed micro- and meso-scale power generating devices.With its distinguished editors and international team of expert contributors, Printed films is a key text for anyone working in such fields as microelectronics, fuel cell and sensor technology in both industry and academia. Provides a comprehensive analysis of the most significant recent developments in printed films and their applications Reviews the concepts, properties, technologies and materials involved in the production and use of printed films Analyses the varied applications of printed films in devices, including printed restrictive sensors for physical quantities and printed thick film mechanical micro-systems (MEMS), among others
Author : Jerry C. Whitaker
Publisher : CRC Press
Page : 624 pages
File Size : 45,6 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781420036855
The days of troubleshooting a piece of gear armed only with a scope, voltmeter, and a general idea of how the hardware works are gone forever. As technology continues to drive equipment design forward, maintenance difficulties will continue to increase, and those responsible for maintaining this equipment will continue to struggle to keep up. The Electronic Systems Maintenance Handbook, Second Edition establishes a foundation for servicing, operating, and optimizing audio, video, computer, and RF systems. Beginning with an overview of reliability principles and properties, a team of top experts describes the steps essential to ensuring high reliability and minimum downtime. They examine heat management issues, grounding systems, and all aspects of system test and measurement. They even explore disaster planning and provide guidelines for keeping a facility running under extreme circumstances. Today more than ever, the reliability of a system can have a direct and immediate impact on the profitability of an operation. Advocating a carefully planned, systematic maintenance program, the richly illustrated Electronic Systems Maintenance Handbook helps engineers and technicians meet the challenges inherent in modern electronic equipment and ensure top quality performance from each piece of hardware.
Author : John H. Lau
Publisher : Springer Science & Business Media
Page : 584 pages
File Size : 51,6 Mb
Release : 1994-06-30
Category : Computers
ISBN : 0442014414
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Author : Michael Pecht
Publisher : John Wiley & Sons
Page : 470 pages
File Size : 53,5 Mb
Release : 1994-03-31
Category : Technology & Engineering
ISBN : 0471594466
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.
Author : Taraseiskey
Publisher : CRC Press
Page : 336 pages
File Size : 48,7 Mb
Release : 2018-10-08
Category : Technology & Engineering
ISBN : 9781482292169
"Discusses the fundamental design principles, capabilities, and applications of power hybrid microcircuits and modules--detailing the operation of power semiconductor and passive components, the properties of materials, design guidelines, thermal management, and manufacturing technologies."
Author : Pradeep Lall,Michael G. Pecht,Edward B. Hakim
Publisher : CRC Press
Page : 332 pages
File Size : 54,7 Mb
Release : 2020-07-09
Category : Technology & Engineering
ISBN : 9780429605598
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Author : Andre Heck
Publisher : Springer Science & Business Media
Page : 1132 pages
File Size : 55,8 Mb
Release : 2004-04-30
Category : Science
ISBN : 1402019254
With about 200,000 entries, StarBriefs Plus represents the most comprehensive and accurately validated collection of abbreviations, acronyms, contractions and symbols within astronomy, related space sciences and other related fields. As such, this invaluable reference source (and its companion volume, StarGuides Plus) should be on the reference shelf of every library, organization or individual with any interest in these areas. Besides astronomy and associated space sciences, related fields such as aeronautics, aeronomy, astronautics, atmospheric sciences, chemistry, communications, computer sciences, data processing, education, electronics, engineering, energetics, environment, geodesy, geophysics, information handling, management, mathematics, meteorology, optics, physics, remote sensing, and so on, are also covered when justified. Terms in common use and/or of general interest have also been included where appropriate.
Author : Anonim
Publisher : Springer Science & Business Media
Page : 805 pages
File Size : 51,9 Mb
Release : 2012-12-06
Category : Science
ISBN : 9789401143516
This compilation probably looks like one of the craziest things a human being could spend his or her time on. Yet nobody would wonder at someone taking a short walk every day - after twenty five years that person would have covered a surprisingly long distance. This is exactly the story behind this list, which appeared first as a few pages within the directory StarGuides (or whatever name it had at that time) and as a distinct sister publication since 1990. The idea behind this dictionary is to offer astronomers and related space scientists practical assistance in decoding the numerous abbreviations, acronyms, contractions and symbols which they might encounter in all aspects of the vast range of their professional activities, including traveling. Perhaps it is a bit paradoxical, but if scientists quickly grasp the meaning of an acronym solely in their own specific discipline, they will probably encounter more difficulties when dealing with adjacent fields. It is for this purpose that this dictionary might be most often used. Scientists might also refer to this compilation in order to avoid identifying a project by an acronym which already has too many meanings or confused definitions.
Author : National Institute of Standards and Technology (U.S.)
Publisher : Unknown
Page : 268 pages
File Size : 51,9 Mb
Release : 2002
Category : Engineering
ISBN : UIUC:30112065973171
Author : Raj P. Chhabra
Publisher : CRC Press
Page : 1649 pages
File Size : 44,8 Mb
Release : 2017-11-08
Category : Science
ISBN : 9781498715294
The CRC Handbook of Thermal Engineering, Second Edition, is a fully updated version of this respected reference work, with chapters written by leading experts. Its first part covers basic concepts, equations and principles of thermodynamics, heat transfer, and fluid dynamics. Following that is detailed coverage of major application areas, such as bioengineering, energy-efficient building systems, traditional and renewable energy sources, food processing, and aerospace heat transfer topics. The latest numerical and computational tools, microscale and nanoscale engineering, and new complex-structured materials are also presented. Designed for easy reference, this new edition is a must-have volume for engineers and researchers around the globe.
