Thermal And Power Management Of Integrated Circuits

Author : Arman Vassighi,Manoj Sachdev
Publisher : Springer Science & Business Media
Page : 188 pages
File Size : 48,9 Mb
Release : 2006-06-01
Category : Technology & Engineering
ISBN : 9780387297491

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Thermal and Power Management of Integrated Circuits by Arman Vassighi,Manoj Sachdev Pdf

In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Author : Arman Vassighi
Publisher : Library and Archives Canada = Bibliothèque et Archives Canada
Page : 254 pages
File Size : 43,8 Mb
Release : 2004
Category : Electronic
ISBN : 0612945979

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Heat and Power Management for High-performance Integrated Circuits [microform] by Arman Vassighi Pdf

Author : Mona M. Hella,Patrick Mercier
Publisher : CRC Press
Page : 376 pages
File Size : 44,8 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781315355986

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Power Management Integrated Circuits by Mona M. Hella,Patrick Mercier Pdf

Power Management Integrated Circuits and Technologies delivers a modern treatise on mixed-signal integrated circuit design for power management. Comprised of chapters authored by leading researchers from industry and academia, this definitive text: Describes circuit- and architectural-level innovations that meet advanced power and speed capabilities Explores hybrid inductive-capacitive converters for wide-range dynamic voltage scaling Presents innovative control techniques for single inductor dual output (SIDO) and single inductor multiple output (SIMO) converters Discusses cutting-edge design techniques including switching converters for analog/RF loads Compares the use of GaAs pHEMTs to CMOS devices for efficient high-frequency switching converters Thus, Power Management Integrated Circuits and Technologies provides comprehensive, state-of-the-art coverage of this exciting and emerging field of engineering.

Author : Seda Ogrenci-Memik
Publisher : Unknown
Page : 253 pages
File Size : 51,5 Mb
Release : 2015
Category : TECHNOLOGY & ENGINEERING
ISBN : 1523101008

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Heat Management in Integrated Circuits by Seda Ogrenci-Memik Pdf

"As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins, creating sub-optimal results. At a larger scale, cooling is the second most costly item in the electricity bills of well-designed high-performance computing and data centers, costing 30-50% of the total. Thermal monitoring and management in integrated circuits is therefore becoming increasingly important. This book covers thermal monitoring and management in integrated circuits, with a focus on devices and materials that are intimately integrated on-chip as opposed to in-package or on-board. The devices and circuits discussed include various designs used for the purpose of converting temperature to a digital measurement and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. Topics covered include an overview of heat in integrated circuits and systems, on-chip temperature sensing, dynamic thermal management, active cooling, and mitigating thermal events at the system-level and above"--Provided by publisher.

Author : Bernhard Wicht
Publisher : John Wiley & Sons
Page : 484 pages
File Size : 54,9 Mb
Release : 2024-07-22
Category : Technology & Engineering
ISBN : 9781119123064

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Design of Power Management Integrated Circuits by Bernhard Wicht Pdf

Comprehensive resource on power management ICs affording new levels of functionality and applications with cost reduction in various fields Design of Power Management Integrated Circuits is a comprehensive reference for power management IC design, covering the circuit design of main power management circuits like linear and switched-mode voltage regulators, along with sub-circuits such as power switches, gate drivers and their supply, level shifters, the error amplifier, current sensing, and control loop design. Circuits for protection and diagnostics, as well as aspects of the physical design like lateral and vertical power delivery, pin-out, floor planning, grounding/supply guidelines, and packaging, are also addressed. A full chapter is dedicated to the design of integrated passives. The text illustrates the application of power management integrated circuits (PMIC) to growth areas like computing, the internet of Things, mobility, and renewable energy. Includes numerous real-world examples, case studies, and exercises illustrating key design concepts and techniques. Offering a unique insight into this rapidly evolving technology through the author's experience developing PMICs in both the industrial and academic environment, Design of Power Management Integrated Circuits includes information on: Capacitive, inductive and hybrid DC-DC converters and their essential circuit blocks, covering error amplifiers, comparators, and ramp generators Sensing, protection, and diagnostics, covering thermal protection, inductive loads and clamping structures, under-voltage, reference and power-on reset generation Integrated MOS, MOM and MIM capacitors, integrated inductors Control loop design and PWM generation ensuring stability and fast transient response; subharmonic oscillations in current mode control (analysis and circuit design for slope compensation) DC behavior and DC-related circuit design, covering power efficiency, line and load regulation, error amplifier, dropout, and power transistor sizing Commonly used level shifters (including sizing rules) and cascaded (tapered) driver sizing and optimization guidelines Optimizing the physical design considering packaging, floor planning, EMI, pinout, PCB design and thermal design Design of Power Management Integrated Circuits is an essential resource on the subject for circuit designers/IC designers, system engineers, and application engineers, along with advanced undergraduate students and graduate students in related programs of study.

Author : John Hu,Mohammed Ismail
Publisher : Springer Science & Business Media
Page : 128 pages
File Size : 47,6 Mb
Release : 2011-09-03
Category : Technology & Engineering
ISBN : 9781441995261

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CMOS High Efficiency On-chip Power Management by John Hu,Mohammed Ismail Pdf

This book will introduce various power management integrated circuits (IC) design techniques to build future energy-efficient “green” electronics. The goal is to achieve high efficiency, which is essential to meet consumers’ growing need for longer battery lives. The focus is to study topologies amiable for full on-chip implementation (few external components) in the mainstream CMOS technology, which will reduce the physical size and the manufacturing cost of the devices.

Author : Ke-Horng Chen
Publisher : John Wiley & Sons
Page : 562 pages
File Size : 51,9 Mb
Release : 2016-09-26
Category : Technology & Engineering
ISBN : 9781118896815

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Power Management Techniques for Integrated Circuit Design by Ke-Horng Chen Pdf

This book begins with the premise that energy demands are directing scientists towards ever-greener methods of power management, so highly integrated power control ICs (integrated chip/circuit) are increasingly in demand for further reducing power consumption. A timely and comprehensive reference guide for IC designers dealing with the increasingly widespread demand for integrated low power management Includes new topics such as LED lighting, fast transient response, DVS-tracking and design with advanced technology nodes Leading author (Chen) is an active and renowned contributor to the power management IC design field, and has extensive industry experience Accompanying website includes presentation files with book illustrations, lecture notes, simulation circuits, solution manuals, instructors’ manuals, and program downloads

Author : J. Altet,Antonio Rubio
Publisher : Springer Science & Business Media
Page : 212 pages
File Size : 52,7 Mb
Release : 2013-03-09
Category : Technology & Engineering
ISBN : 9781475736359

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Thermal Testing of Integrated Circuits by J. Altet,Antonio Rubio Pdf

Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.

Author : Rohit Sharma
Publisher : CRC Press
Page : 328 pages
File Size : 52,5 Mb
Release : 2018-09-03
Category : Technology & Engineering
ISBN : 9781351831598

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Design of 3D Integrated Circuits and Systems by Rohit Sharma Pdf

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Author : Seda Ogrenci-Memik
Publisher : IET
Page : 264 pages
File Size : 53,7 Mb
Release : 2015-12
Category : Computers
ISBN : 9781849199346

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Heat Management in Integrated Circuits by Seda Ogrenci-Memik Pdf

Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems.

Author : Mona M. Hella
Publisher : Unknown
Page : 400 pages
File Size : 47,5 Mb
Release : 2016
Category : Electric power
ISBN : 1523107359

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Power Management Integrated Circuits by Mona M. Hella Pdf

Author : Mona M. Hella,Patrick Mercier
Publisher : CRC Press
Page : 329 pages
File Size : 43,5 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781482228946

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Power Management Integrated Circuits by Mona M. Hella,Patrick Mercier Pdf

Power Management Integrated Circuits and Technologies delivers a modern treatise on mixed-signal integrated circuit design for power management. Comprised of chapters authored by leading researchers from industry and academia, this definitive text: Describes circuit- and architectural-level innovations that meet advanced power and speed capabilities Explores hybrid inductive-capacitive converters for wide-range dynamic voltage scaling Presents innovative control techniques for single inductor dual output (SIDO) and single inductor multiple output (SIMO) converters Discusses cutting-edge design techniques including switching converters for analog/RF loads Compares the use of GaAs pHEMTs to CMOS devices for efficient high-frequency switching converters Thus, Power Management Integrated Circuits and Technologies provides comprehensive, state-of-the-art coverage of this exciting and emerging field of engineering.

Author : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Publisher : John Wiley & Sons
Page : 265 pages
File Size : 41,7 Mb
Release : 2019-01-25
Category : Technology & Engineering
ISBN : 9783527697045

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Handbook of 3D Integration, Volume 4 by Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir Pdf

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Author : Yu Hao,Tan Chuan Seng
Publisher : World Scientific
Page : 392 pages
File Size : 51,8 Mb
Release : 2015-08-28
Category : Technology & Engineering
ISBN : 9789814699037

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Advances In 3d Integrated Circuits And Systems by Yu Hao,Tan Chuan Seng Pdf

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Author : Jose L. Ayala,Braulio Garcia-Camara,Manuel Prieto,Martino Ruggiero,Gilles Sicard
Publisher : Springer
Page : 352 pages
File Size : 52,6 Mb
Release : 2011-09-25
Category : Computers
ISBN : 9783642241543

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Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation by Jose L. Ayala,Braulio Garcia-Camara,Manuel Prieto,Martino Ruggiero,Gilles Sicard Pdf

This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.