Heat Management In Integrated Circuits

Author : Seda Ogrenci-Memik
Publisher : Unknown
Page : 253 pages
File Size : 54,6 Mb
Release : 2015
Category : TECHNOLOGY & ENGINEERING
ISBN : 1523101008

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Heat Management in Integrated Circuits by Seda Ogrenci-Memik Pdf

"As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins, creating sub-optimal results. At a larger scale, cooling is the second most costly item in the electricity bills of well-designed high-performance computing and data centers, costing 30-50% of the total. Thermal monitoring and management in integrated circuits is therefore becoming increasingly important. This book covers thermal monitoring and management in integrated circuits, with a focus on devices and materials that are intimately integrated on-chip as opposed to in-package or on-board. The devices and circuits discussed include various designs used for the purpose of converting temperature to a digital measurement and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. Topics covered include an overview of heat in integrated circuits and systems, on-chip temperature sensing, dynamic thermal management, active cooling, and mitigating thermal events at the system-level and above"--Provided by publisher.

Author : Arman Vassighi,Manoj Sachdev
Publisher : Springer Science & Business Media
Page : 188 pages
File Size : 52,8 Mb
Release : 2006-06-01
Category : Technology & Engineering
ISBN : 9780387297491

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Thermal and Power Management of Integrated Circuits by Arman Vassighi,Manoj Sachdev Pdf

In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Author : Seda Ogrenci-Memik
Publisher : IET
Page : 264 pages
File Size : 54,6 Mb
Release : 2015-12
Category : Computers
ISBN : 9781849199346

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Heat Management in Integrated Circuits by Seda Ogrenci-Memik Pdf

Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems.

Author : Arman Vassighi
Publisher : Library and Archives Canada = Bibliothèque et Archives Canada
Page : 254 pages
File Size : 52,6 Mb
Release : 2004
Category : Electronic
ISBN : 0612945979

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Heat and Power Management for High-performance Integrated Circuits [microform] by Arman Vassighi Pdf

Author : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Publisher : John Wiley & Sons
Page : 265 pages
File Size : 55,8 Mb
Release : 2019-01-25
Category : Technology & Engineering
ISBN : 9783527697045

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Handbook of 3D Integration, Volume 4 by Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir Pdf

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Author : Philip Y. Paik,Krishnendu Chakrabarty,Vamsee Krishna Pamula
Publisher : Artech House Publishers
Page : 216 pages
File Size : 54,9 Mb
Release : 2007
Category : Science
ISBN : UOM:39015069317678

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Adaptive Cooling of Integrated Circuits Using Digital Microfluidics by Philip Y. Paik,Krishnendu Chakrabarty,Vamsee Krishna Pamula Pdf

Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.

Author : Jerry E. Sergent,Al Krum
Publisher : McGraw Hill Professional
Page : 370 pages
File Size : 47,9 Mb
Release : 1998
Category : Science
ISBN : 0070266999

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Thermal Management Handbook: For Electronic Assemblies by Jerry E. Sergent,Al Krum Pdf

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

Author : Xingcun Colin Tong
Publisher : Springer Science & Business Media
Page : 633 pages
File Size : 52,7 Mb
Release : 2011-01-05
Category : Technology & Engineering
ISBN : 9781441977595

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Advanced Materials for Thermal Management of Electronic Packaging by Xingcun Colin Tong Pdf

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Author : J. Altet,Antonio Rubio
Publisher : Springer Science & Business Media
Page : 212 pages
File Size : 41,6 Mb
Release : 2013-03-09
Category : Technology & Engineering
ISBN : 9781475736359

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Thermal Testing of Integrated Circuits by J. Altet,Antonio Rubio Pdf

Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.

Author : C.J. Hoogendoorn,R.A.W.M. Henkes,C.J.M. Lasance
Publisher : Springer Science & Business Media
Page : 334 pages
File Size : 51,9 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9789401110822

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Thermal Management of Electronic Systems by C.J. Hoogendoorn,R.A.W.M. Henkes,C.J.M. Lasance Pdf

The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.

Author : Clemens J.M. Lasance,András Poppe
Publisher : Springer Science & Business Media
Page : 550 pages
File Size : 42,6 Mb
Release : 2013-09-17
Category : Technology & Engineering
ISBN : 9781461450917

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Thermal Management for LED Applications by Clemens J.M. Lasance,András Poppe Pdf

Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

Author : Sadik Kakaç,Hafit Yüncü,K. Hijikata
Publisher : Springer Science & Business Media
Page : 953 pages
File Size : 46,6 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9789401110907

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Cooling of Electronic Systems by Sadik Kakaç,Hafit Yüncü,K. Hijikata Pdf

Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

Author : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
Publisher : Newnes
Page : 768 pages
File Size : 41,5 Mb
Release : 2017-07-04
Category : Technology & Engineering
ISBN : 9780124104846

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Three-Dimensional Integrated Circuit Design by Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman Pdf

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Author : Bernhard Wicht
Publisher : John Wiley & Sons
Page : 484 pages
File Size : 42,7 Mb
Release : 2024-07-22
Category : Technology & Engineering
ISBN : 9781119123064

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Design of Power Management Integrated Circuits by Bernhard Wicht Pdf

Comprehensive resource on power management ICs affording new levels of functionality and applications with cost reduction in various fields Design of Power Management Integrated Circuits is a comprehensive reference for power management IC design, covering the circuit design of main power management circuits like linear and switched-mode voltage regulators, along with sub-circuits such as power switches, gate drivers and their supply, level shifters, the error amplifier, current sensing, and control loop design. Circuits for protection and diagnostics, as well as aspects of the physical design like lateral and vertical power delivery, pin-out, floor planning, grounding/supply guidelines, and packaging, are also addressed. A full chapter is dedicated to the design of integrated passives. The text illustrates the application of power management integrated circuits (PMIC) to growth areas like computing, the internet of Things, mobility, and renewable energy. Includes numerous real-world examples, case studies, and exercises illustrating key design concepts and techniques. Offering a unique insight into this rapidly evolving technology through the author's experience developing PMICs in both the industrial and academic environment, Design of Power Management Integrated Circuits includes information on: Capacitive, inductive and hybrid DC-DC converters and their essential circuit blocks, covering error amplifiers, comparators, and ramp generators Sensing, protection, and diagnostics, covering thermal protection, inductive loads and clamping structures, under-voltage, reference and power-on reset generation Integrated MOS, MOM and MIM capacitors, integrated inductors Control loop design and PWM generation ensuring stability and fast transient response; subharmonic oscillations in current mode control (analysis and circuit design for slope compensation) DC behavior and DC-related circuit design, covering power efficiency, line and load regulation, error amplifier, dropout, and power transistor sizing Commonly used level shifters (including sizing rules) and cascaded (tapered) driver sizing and optimization guidelines Optimizing the physical design considering packaging, floor planning, EMI, pinout, PCB design and thermal design Design of Power Management Integrated Circuits is an essential resource on the subject for circuit designers/IC designers, system engineers, and application engineers, along with advanced undergraduate students and graduate students in related programs of study.

Author : Thomas Moore
Publisher : Elsevier
Page : 293 pages
File Size : 46,9 Mb
Release : 2013-10-22
Category : Technology & Engineering
ISBN : 9781483292342

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Characterization of Integrated Circuit Packaging Materials by Thomas Moore Pdf

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.