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Thermal Testing of Integrated Circuits by J. Altet,Antonio Rubio Pdf
Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.
Theory and Practice of Thermal Transient Testing of Electronic Components by Marta Rencz,Gábor Farkas,András Poppe Pdf
This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Thermal and Power Management of Integrated Circuits by Arman Vassighi,Manoj Sachdev Pdf
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Electrothermal Analysis of VLSI Systems by Yi-Kan Cheng,Ching-Han Tsai,Chin-Chi Teng,Sung-Mo (Steve) Kang Pdf
This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.
Wafer-Level Testing and Test During Burn-In for Integrated Circuits by Sudarshan Bahukudumbi,Krishnendu Chakrabarty Pdf
Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this unique book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.
Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Author : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir Publisher : John Wiley & Sons Page : 488 pages File Size : 45,9 Mb Release : 2019-05-06 Category : Technology & Engineering ISBN : 9783527338559
Handbook of 3D Integration, Volume 4 by Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir Pdf
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Failure Analysis of Integrated Circuits by Lawrence C. Wagner Pdf
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) by Anonim Pdf
Please click here for information on Set 1: Thermal Packaging Techniques Thermal and mechanical packaging -- the enabling technologies for the physical implementation of electronic systems -- are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics. Set 2: Thermal Packaging Tools The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering. Foreword Foreword (English) (42 KB) Foreword (Japanese) (342 KB) Please click here for information on Set 1: Thermal Packaging Techniques Thermal and mechanical packaging -- the enabling technologies for the physical implementation of electronic systems -- are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly e
Integrated Circuit Quality and Reliability by Eugene R. Hnatek Pdf
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Thermal Management of Electronic Systems II by E. Beyne,C.J.M. Lasance,J. Berghmans Pdf
For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Technologies for Smart Sensors and Sensor Fusion by Kevin Yallup,Krzysztof Iniewski Pdf
Exciting new developments are enabling sensors to go beyond the realm of simple sensing of movement or capture of images to deliver information such as location in a built environment, the sense of touch, and the presence of chemicals. These sensors unlock the potential for smarter systems, allowing machines to interact with the world around them in more intelligent and sophisticated ways. Featuring contributions from authors working at the leading edge of sensor technology, Technologies for Smart Sensors and Sensor Fusion showcases the latest advancements in sensors with biotechnology, medical science, chemical detection, environmental monitoring, automotive, and industrial applications. This valuable reference describes the increasingly varied number of sensors that can be integrated into arrays, and examines the growing availability and computational power of communication devices that support the algorithms needed to reduce the raw sensor data from multiple sensors and convert it into the information needed by the sensor array to enable rapid transmission of the results to the required point. Using both SI and US units, the text: Provides a fundamental and analytical understanding of the underlying technology for smart sensors Discusses groundbreaking software and sensor systems as well as key issues surrounding sensor fusion Exemplifies the richness and diversity of development work in the world of smart sensors and sensor fusion Offering fresh insight into the sensors of the future, Technologies for Smart Sensors and Sensor Fusion not only exposes readers to trends but also inspires innovation in smart sensor and sensor system development.
Thermal Measurements in Electronics Cooling by Kaveh Azar Pdf
Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic. This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.
Qpedia Thermal Management – Electronics Cooling Book, Volume 3 by Advanced Thermal Solutions,Kaveh Azar,Bahman Tavassoli Pdf
The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.
Reliability of Electronic Components by Titu I. Bajenescu,Marius I. Bazu Pdf
This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
Author : Peter A. Engel Publisher : Springer Science & Business Media Page : 307 pages File Size : 50,6 Mb Release : 2012-12-06 Category : Science ISBN : 9781461209157
Structural Analysis of Printed Circuit Board Systems by Peter A. Engel Pdf
This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.
