Through Silicon Vias

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Through-Silicon Vias for 3D Integration

John H. Lau
Through Silicon Vias for 3D Integration Book PDF

Author : John H. Lau
Publisher : McGraw Hill Professional
Page : 513 pages
File Size : 48,8 Mb
Release : 2012-08-05
Category : Technology & Engineering
ISBN : 9780071785150

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Through-Silicon Vias for 3D Integration by John H. Lau Pdf

A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging

Through Silicon Vias

Brajesh Kumar Kaushik,Vobulapuram Ramesh Kumar,Manoj Kumar Majumder,Arsalan Alam
Through Silicon Vias Book PDF

Author : Brajesh Kumar Kaushik,Vobulapuram Ramesh Kumar,Manoj Kumar Majumder,Arsalan Alam
Publisher : CRC Press
Page : 165 pages
File Size : 48,9 Mb
Release : 2016-11-30
Category : Science
ISBN : 9781315351797

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Through Silicon Vias by Brajesh Kumar Kaushik,Vobulapuram Ramesh Kumar,Manoj Kumar Majumder,Arsalan Alam Pdf

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

Through-Silicon Vias for 3D Integration

John Lau
Through Silicon Vias for 3D Integration Book PDF

Author : John Lau
Publisher : McGraw Hill Professional
Page : 514 pages
File Size : 52,7 Mb
Release : 2012-09-20
Category : Technology & Engineering
ISBN : 9780071785143

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Through-Silicon Vias for 3D Integration by John Lau Pdf

A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging

Three-Dimensional Integrated Circuit Design

Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
Three Dimensional Integrated Circuit Design Book PDF

Author : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
Publisher : Newnes
Page : 768 pages
File Size : 51,9 Mb
Release : 2017-07-04
Category : Technology & Engineering
ISBN : 9780124104846

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Three-Dimensional Integrated Circuit Design by Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman Pdf

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Handbook of Silicon Based MEMS Materials and Technologies

Markku Tilli,Mervi Paulasto-Kröckel,Matthias Petzold,Horst Theuss,Teruaki Motooka,Veikko Lindroos
Handbook of Silicon Based MEMS Materials and Technologies Book PDF

Author : Markku Tilli,Mervi Paulasto-Kröckel,Matthias Petzold,Horst Theuss,Teruaki Motooka,Veikko Lindroos
Publisher : Elsevier
Page : 1028 pages
File Size : 51,5 Mb
Release : 2020-04-17
Category : Technology & Engineering
ISBN : 9780128177877

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Handbook of Silicon Based MEMS Materials and Technologies by Markku Tilli,Mervi Paulasto-Kröckel,Matthias Petzold,Horst Theuss,Teruaki Motooka,Veikko Lindroos Pdf

Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors

Arbitrary Modeling of TSVs for 3D Integrated Circuits

Khaled Salah,Yehea Ismail,Alaa El-Rouby
Arbitrary Modeling of TSVs for 3D Integrated Circuits Book PDF

Author : Khaled Salah,Yehea Ismail,Alaa El-Rouby
Publisher : Springer
Page : 179 pages
File Size : 42,8 Mb
Release : 2014-08-21
Category : Technology & Engineering
ISBN : 9783319076119

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Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah,Yehea Ismail,Alaa El-Rouby Pdf

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Carbon Nanotubes for Interconnects

Aida Todri-Sanial,Jean Dijon,Antonio Maffucci
Carbon Nanotubes for Interconnects Book PDF

Author : Aida Todri-Sanial,Jean Dijon,Antonio Maffucci
Publisher : Springer
Page : 333 pages
File Size : 48,8 Mb
Release : 2016-07-09
Category : Technology & Engineering
ISBN : 9783319297460

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Carbon Nanotubes for Interconnects by Aida Todri-Sanial,Jean Dijon,Antonio Maffucci Pdf

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Emerging Electronic Devices, Circuits and Systems

Chandan Giri,Takahiro Iizuka,Hafizur Rahaman,Bhargab B. Bhattacharya
Emerging Electronic Devices Circuits and Systems Book PDF

Author : Chandan Giri,Takahiro Iizuka,Hafizur Rahaman,Bhargab B. Bhattacharya
Publisher : Springer Nature
Page : 465 pages
File Size : 49,5 Mb
Release : 2023-06-01
Category : Technology & Engineering
ISBN : 9789819900558

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Emerging Electronic Devices, Circuits and Systems by Chandan Giri,Takahiro Iizuka,Hafizur Rahaman,Bhargab B. Bhattacharya Pdf

The book constitutes peer-reviewed proceedings of a workshop on Emerging Electronics Devices, Circuits, and Systems (EEDCS) held in conjunction with International Symposium on Devices, Circuits, and Systems (ISDCS 2022). The book focuses on the recent development in devices, circuits, and systems. It also discusses innovations, trends, practical challenges, and solutions adopted in device design, modeling, fabrication, characterization, and their circuit implementation with pertinent system applications. It will be useful for researchers, developers, engineers, academicians, and students.

Ultra-thin Chip Technology and Applications

Joachim Burghartz
Ultra thin Chip Technology and Applications Book PDF

Author : Joachim Burghartz
Publisher : Springer Science & Business Media
Page : 467 pages
File Size : 51,8 Mb
Release : 2010-11-18
Category : Technology & Engineering
ISBN : 9781441972767

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Ultra-thin Chip Technology and Applications by Joachim Burghartz Pdf

Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.

Designing TSVs for 3D Integrated Circuits

Nauman Khan,Soha Hassoun
Designing TSVs for 3D Integrated Circuits Book PDF

Author : Nauman Khan,Soha Hassoun
Publisher : Springer
Page : 76 pages
File Size : 48,7 Mb
Release : 2012-09-23
Category : Technology & Engineering
ISBN : 146145509X

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Designing TSVs for 3D Integrated Circuits by Nauman Khan,Soha Hassoun Pdf

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.

Design of 3D Integrated Circuits and Systems

Rohit Sharma
Design of 3D Integrated Circuits and Systems Book PDF

Author : Rohit Sharma
Publisher : CRC Press
Page : 328 pages
File Size : 55,8 Mb
Release : 2018-09-03
Category : Technology & Engineering
ISBN : 9781351831598

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Design of 3D Integrated Circuits and Systems by Rohit Sharma Pdf

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Sung Kyu Lim
Design for High Performance Low Power and Reliable 3D Integrated Circuits Book PDF

Author : Sung Kyu Lim
Publisher : Springer Science & Business Media
Page : 573 pages
File Size : 41,6 Mb
Release : 2012-11-27
Category : Technology & Engineering
ISBN : 9781441995421

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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by Sung Kyu Lim Pdf

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

3D Microelectronic Packaging

Yan Li,Deepak Goyal
3D Microelectronic Packaging Book PDF

Author : Yan Li,Deepak Goyal
Publisher : Springer
Page : 463 pages
File Size : 48,7 Mb
Release : 2017-01-20
Category : Technology & Engineering
ISBN : 9783319445861

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3D Microelectronic Packaging by Yan Li,Deepak Goyal Pdf

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging Book PDF

Author : Xing-Chang Wei
Publisher : CRC Press
Page : 322 pages
File Size : 48,6 Mb
Release : 2017-09-19
Category : Computers
ISBN : 9781315305868

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by Xing-Chang Wei Pdf

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Semiconductor Devices in Harsh Conditions

Kirsten Weide-Zaage,Malgorzata Chrzanowska-Jeske
Semiconductor Devices in Harsh Conditions Book PDF

Author : Kirsten Weide-Zaage,Malgorzata Chrzanowska-Jeske
Publisher : CRC Press
Page : 257 pages
File Size : 47,8 Mb
Release : 2016-11-25
Category : Technology & Engineering
ISBN : 9781498743822

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Semiconductor Devices in Harsh Conditions by Kirsten Weide-Zaage,Malgorzata Chrzanowska-Jeske Pdf

This book introduces the reader to a number of challenges for the operation of electronic devices in various harsh environmental conditions. While some chapters focus on measuring and understanding the effects of these environments on electronic components, many also propose design solutions, whether in choice of material, innovative structures, or strategies for amelioration and repair. Many applications need electronics designed to operate in harsh environments. Readers will find, in this collection of topics, tools and ideas useful in their own pursuits and of interest to their intellectual curiosity. With a focus on radiation, operating conditions, sensor systems, package, and system design, the book is divided into three parts. The first part deals with sensing devices designed for operating in the presence of radiation, commercials of the shelf (COTS) products for space computing, and influences of single event upset. The second covers system and package design for harsh operating conditions. The third presents devices for biomedical applications under moisture and temperature loads in the frame of sensor systems and operating conditions.