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Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 408 pages
File Size : 46,5 Mb
Release : 1999
Category : Computers
ISBN : 1566772419
Author : Cor L. Claeys,Electrochemical Society. Meeting
Publisher : The Electrochemical Society
Page : 636 pages
File Size : 43,7 Mb
Release : 2001
Category : Technology & Engineering
ISBN : 1566773083
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 509 pages
File Size : 44,6 Mb
Release : 2007
Category : Integrated circuits
ISBN : 9781566775724
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
Author : C. Claeys
Publisher : The Electrochemical Society
Page : 547 pages
File Size : 48,5 Mb
Release : 2009-09
Category : Integrated circuits
ISBN : 9781566777445
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Author : Electrochemical Society. Meeting
Publisher : The Electrochemical Society
Page : 620 pages
File Size : 50,9 Mb
Release : 2003
Category : Technology & Engineering
ISBN : 1566773768
Author : C. Claeys,H. Iwai,M. Tao,S. Deleonibus,J. Murota
Publisher : The Electrochemical Society
Page : 429 pages
File Size : 42,9 Mb
Release : 2011
Category : Electronic
ISBN : 9781607682615
Author : C. Claeys,J. Murota,M. Tao,H. Iwai,S. Deleonibus
Publisher : The Electrochemical Society
Page : 335 pages
File Size : 50,9 Mb
Release : 2015
Category : Electronic
ISBN : 9781607686750
Author : Electrochemical Society,Electrochemical Society (United States). Electronics and Photonics Division
Publisher : Unknown
Page : 319 pages
File Size : 44,7 Mb
Release : 2013
Category : Electronic
ISBN : 162332100X
Author : C. M. Osburn,John M. Andrews
Publisher : Unknown
Page : 804 pages
File Size : 52,8 Mb
Release : 1989
Category : Integrated circuits
ISBN : CORNELL:31924072149259
Author : J. Murota,C. L. Claeys,H. Iwai,M. Tao,S. Deleonibus,A. Mai,K. Shiojima,P. Chin
Publisher : The Electrochemical Society
Page : 325 pages
File Size : 52,5 Mb
Release : 2024-07-02
Category : Electronic
ISBN : 9781607688211
Author : Cor L. Claeys
Publisher : Unknown
Page : 0 pages
File Size : 41,5 Mb
Release : 2005
Category : Integrated circuits
ISBN : 1566774640
" ... includes papers that were presented at the Fourth Symposium on ULSI Process Integration held in Quaebec, Canada during the 207th Meeting of the Electrochemical Society, May 16-20, 2005."--Pref.
Author : Chih-Hang Tung,George T. T. Sheng,Chih-Yuan Lu
Publisher : John Wiley & Sons
Page : 688 pages
File Size : 45,8 Mb
Release : 2003-10-06
Category : Technology & Engineering
ISBN : 0471457728
More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs
Author : Androula G. Nassiopoulou,Xanthi Zianni
Publisher : World Scientific
Page : 409 pages
File Size : 55,8 Mb
Release : 2001
Category : Technology & Engineering
ISBN : 9789810247690
This volume contains papers on the following: CMOS devices and devices based on compound semiconductors; processing; silicon integrated technology and integrated circuit design; quantum physics; nanotechnology; nanodevices, sensors and microsystems. The latest news and future challenges in these fields are presented in invited papers.
Author : Androula G Nassiopoulou,Xanthi Zianni
Publisher : World Scientific
Page : 409 pages
File Size : 55,5 Mb
Release : 2001-10-19
Category : Technology & Engineering
ISBN : 9789814489997
This volume contains papers on the following: CMOS devices and devices based on compound semiconductors; processing; silicon integrated technology and integrated circuit design; quantum physics; nanotechnology; nanodevices, sensors and microsystems. The latest news and future challenges in these fields are presented in invited papers.
Author : Electrochemical Society. Electronics Division
Publisher : The Electrochemical Society
Page : 506 pages
File Size : 54,5 Mb
Release : 2002
Category : Technology & Engineering
ISBN : 1566773288