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The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
SiGe, Ge, and Related Compounds 6: Materials, Processing, and Devices by D. Harame,M. Caymax,M. Heyns,G. Masini,S. Miyazaki,G. Niu,A. Reznicek,K. Saraswat,B. Tillack,B. Vincent,Y. C. Yeo,A. Ogura,J. Murota Pdf
Solid State Topics (General) - 218th ECS Meeting by K. B. Sundaram Pdf
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Solid State Topics General Session¿, held during the 218th meeting of The Electrochemical Society, in Las Vegas, Nevada from October 10 to 15, 2010.
Handbook of Silicon Based MEMS Materials and Technologies by Markku Tilli,Mervi Paulasto-Kröckel,Matthias Petzold,Horst Theuss,Teruaki Motooka,Veikko Lindroos Pdf
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
Developments in Surface Contamination and Cleaning - Vol 2 by Rajiv Kohli,Kashmiri L. Mittal Pdf
Rajiv Kohli and Kash Mittal have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and best practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination. Topics covered include: A systems analysis approach to contamination control Physical factors that influence the behavior of particle deposition in enclosures An overview of current yield models and description of advanced models Types of strippable coatings, their properties and applications of these coatings for removal of surface contaminants In-depth coverage of ultrasonic cleaning Contamination and cleaning issues at the nanoscale Experimental results illustrating the impact of model parameters on the removal of particle contamination The expert contributions in this book provide a valuable source of information on the current status and recent developments in surface contamination and cleaning. The book will be of value to industry, government and academic personnel involved in research and development, manufacturing, process and quality control, and procurement specifications across sectors including microelectronics, aerospace, optics, xerography and joining (adhesive bonding). ABOUT THE EDITORS Rajiv Kohli is a leading expert with The Aerospace Corporation in contaminant particle behavior, surface cleaning, and contamination control. At the NASA Johnson Space Center in Houston, Texas, he provides technical support for contamination control related to ground-based and manned spaceflight hardware for the Space Shuttle, the International Space Station, and the new Constellation Program that is designed to meet the United States Vision for Space Exploration. Kashmiri Lal "Kash" Mittal was associated with IBM from 1972 to 1994. Currently, he is teaching and consulting in the areas of surface contamination and cleaning, and in adhesion science and technology. He is the Editor-in-Chief of the Journal of Adhesion Science and Technology and is the editor of 98 published books, many of them dealing with surface contamination and cleaning. Also available Developments in Surface Contamination and Cleaning, Volume 1: Fundamentals and Applied Aspects (edited by Rajiv Kohli & K.L. Mittal). ISBN: 9780815515555. · Provides guidance on best-practice cleaning techniques and the avoidance of surface contamination · Covers contamination and cleaning issues at the nanoscale · Includes an in-depth look at ultrasonic cleaning
Ultra-thin Chip Technology and Applications by Joachim Burghartz Pdf
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Sinep 2009. 1st International Workshop on Si Based Nano-Electronics and -Photonics by Steafno Chiussi Pdf
The main objective of this International Workshop in Vigo is to target this major problem by bringing together scientists and engineers specialized on various different topics related to group IV semiconductors. In five consecutive sessions dedicated to - Group IV materials: CMOS and further extension of the roadmap - Group IV materials: Nano-photonics - Material aspects and characterization on nano-scale - Nanostructures and material processing on atomic scale
