Vertical 3d Memory Technologies

Author : Betty Prince
Publisher : John Wiley & Sons
Page : 368 pages
File Size : 49,9 Mb
Release : 2014-08-13
Category : Technology & Engineering
ISBN : 9781118760468

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Vertical 3D Memory Technologies by Betty Prince Pdf

The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference

Author : Rino Micheloni
Publisher : Springer
Page : 380 pages
File Size : 44,9 Mb
Release : 2016-05-26
Category : Computers
ISBN : 9789401775120

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3D Flash Memories by Rino Micheloni Pdf

This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.

Author : Ye Zhou
Publisher : Royal Society of Chemistry
Page : 753 pages
File Size : 44,9 Mb
Release : 2023-10-09
Category : Technology & Engineering
ISBN : 9781839165696

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Advanced Memory Technology by Ye Zhou Pdf

Author : Seiichi Aritome
Publisher : John Wiley & Sons
Page : 432 pages
File Size : 53,7 Mb
Release : 2015-12-01
Category : Technology & Engineering
ISBN : 9781119132622

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NAND Flash Memory Technologies by Seiichi Aritome Pdf

Offers a comprehensive overview of NAND flash memories, with insights into NAND history, technology, challenges, evolutions, and perspectives Describes new program disturb issues, data retention, power consumption, and possible solutions for the challenges of 3D NAND flash memory Written by an authority in NAND flash memory technology, with over 25 years’ experience

Author : Fred Roozeboom,Paul Timans,Evgeni Gusev,Vijay Narayanan,Kuniyuki Kakushima,Zia Karim,Stefan De Gendt
Publisher : The Electrochemical Society
Page : 356 pages
File Size : 49,7 Mb
Release : 2024-06-15
Category : Electronic
ISBN : 9781607687146

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Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6 by Fred Roozeboom,Paul Timans,Evgeni Gusev,Vijay Narayanan,Kuniyuki Kakushima,Zia Karim,Stefan De Gendt Pdf

Author : Ammar Nayfeh,Nazek El-Atab
Publisher : Elsevier
Page : 192 pages
File Size : 55,6 Mb
Release : 2020-05-27
Category : Science
ISBN : 9780128223437

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Nanomaterials-Based Charge Trapping Memory Devices by Ammar Nayfeh,Nazek El-Atab Pdf

Rising consumer demand for low power consumption electronics has generated a need for scalable and reliable memory devices with low power consumption. At present, scaling memory devices and lowering their power consumption is becoming more difficult due to unresolved challenges, such as short channel effect, Drain Induced Barrier Lowering (DIBL), and sub-surface punch-through effect, all of which cause high leakage currents. As a result, the introduction of different memory architectures or materials is crucial. Nanomaterials-based Charge Trapping Memory Devices provides a detailed explanation of memory device operation and an in-depth analysis of the requirements of future scalable and low powered memory devices in terms of new materials properties. The book presents techniques to fabricate nanomaterials with the desired properties. Finally, the book highlights the effect of incorporating such nanomaterials in memory devices. This book is an important reference for materials scientists and engineers, who are looking to develop low-powered solutions to meet the growing demand for consumer electronic products and devices. Explores in depth memory device operation, requirements and challenges Presents fabrication methods and characterization results of new nanomaterials using techniques, including laser ablation of nanoparticles, ALD growth of nano-islands, and agglomeration-based technique of nanoparticles Demonstrates how nanomaterials affect the performance of memory devices

Author : Wen Siang Lew,Gerard Joseph Lim,Putu Andhita Dananjaya
Publisher : Springer Nature
Page : 439 pages
File Size : 53,6 Mb
Release : 2021-01-09
Category : Science
ISBN : 9789811569128

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Emerging Non-volatile Memory Technologies by Wen Siang Lew,Gerard Joseph Lim,Putu Andhita Dananjaya Pdf

This book offers a balanced and comprehensive guide to the core principles, fundamental properties, experimental approaches, and state-of-the-art applications of two major groups of emerging non-volatile memory technologies, i.e. spintronics-based devices as well as resistive switching devices, also known as Resistive Random Access Memory (RRAM). The first section presents different types of spintronic-based devices, i.e. magnetic tunnel junction (MTJ), domain wall, and skyrmion memory devices. This section describes how their developments have led to various promising applications, such as microwave oscillators, detectors, magnetic logic, and neuromorphic engineered systems. In the second half of the book, the underlying device physics supported by different experimental observations and modelling of RRAM devices are presented with memory array level implementation. An insight into RRAM desired properties as synaptic element in neuromorphic computing platforms from material and algorithms viewpoint is also discussed with specific example in automatic sound classification framework.

Author : C. Claeys,H. Iwai,M. Tao,S. Deleonibus,J. Murota
Publisher : The Electrochemical Society
Page : 429 pages
File Size : 49,8 Mb
Release : 2011
Category : Electronic
ISBN : 9781607682615

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ULSI Process Integration 7 by C. Claeys,H. Iwai,M. Tao,S. Deleonibus,J. Murota Pdf

Author : King-Ning Tu,Chih Chen,Hung-Ming Chen
Publisher : John Wiley & Sons
Page : 336 pages
File Size : 49,8 Mb
Release : 2021-12-14
Category : Science
ISBN : 9781119418337

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Electronic Packaging Science and Technology by King-Ning Tu,Chih Chen,Hung-Ming Chen Pdf

Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

Author : Betty Prince,David Prince
Publisher : John Wiley & Sons
Page : 342 pages
File Size : 53,7 Mb
Release : 2018-06-11
Category : Technology & Engineering
ISBN : 9781119296355

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Memories for the Intelligent Internet of Things by Betty Prince,David Prince Pdf

A detailed, practical review of state-of-the-art implementations of memory in IoT hardware As the Internet of Things (IoT) technology continues to evolve and become increasingly common across an array of specialized and consumer product applications, the demand on engineers to design new generations of flexible, low-cost, low power embedded memories into IoT hardware becomes ever greater. This book helps them meet that demand. Coauthored by a leading international expert and multiple patent holder, this book gets engineers up to speed on state-of-the-art implementations of memory in IoT hardware. Memories for the Intelligent Internet of Things covers an array of common and cutting-edge IoT embedded memory implementations. Ultra-low-power memories for IoT devices-including plastic and polymer circuitry for specialized applications, such as medical electronics-are described. The authors explore microcontrollers with embedded memory used for smart control of a multitude of Internet devices. They also consider neuromorphic memories made in Ferroelectric RAM (FeRAM), Resistance RAM (ReRAM), and Magnetic RAM (MRAM) technologies to implement artificial intelligence (AI) for the collection, processing, and presentation of large quantities of data generated by IoT hardware. Throughout the focus is on memory technologies which are complementary metal oxide semiconductor (CMOS) compatible, including embedded floating gate and charge trapping EEPROM/Flash along with FeRAMS, FeFETs, MRAMs and ReRAMs. Provides a timely, highly practical look at state-of-the-art IoT memory implementations for an array of product applications Synthesizes basic science with original analysis of memory technologies for Internet of Things (IoT) based on the authors' extensive experience in the field Focuses on practical and timely applications throughout Features numerous illustrations, tables, application requirements, and photographs Considers memory related security issues in IoT devices Memories for the Intelligent Internet of Things is a valuable working resource for electrical engineers and engineering managers working in the electronics system and semiconductor industries. It is also an indispensable reference/text for graduate and advanced undergraduate students interested in the latest developments in integrated circuit devices and systems.

Author : Simon Deleonibus
Publisher : CRC Press
Page : 410 pages
File Size : 42,6 Mb
Release : 2018-12-13
Category : Science
ISBN : 9780429858628

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Emerging Devices for Low-Power and High-Performance Nanosystems by Simon Deleonibus Pdf

The history of information and communications technologies (ICT) has been paved by both evolutive paths and challenging alternatives, so-called emerging devices and architectures. Their introduction poses the issues of state variable definition, information processing, and process integration in 2D, above IC, and in 3D. This book reviews the capabilities of integrated nanosystems to match low power and high performance either by hybrid and heterogeneous CMOS in 2D/3D or by emerging devices for alternative sensing, actuating, data storage, and processing. The choice of future ICTs will need to take into account not only their energy efficiency but also their sustainability in the global ecosystem.

Author : Quan Li
Publisher : Springer
Page : 500 pages
File Size : 42,5 Mb
Release : 2015-06-09
Category : Science
ISBN : 9783319182933

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Anisotropic Nanomaterials by Quan Li Pdf

In this book anisotropic one-dimensional and two-dimensional nanoscale building blocks and their assembly into fascinating and qualitatively new functional structures embracing both hard and soft components are explained. Contributions from leading experts regarding important aspects like synthesis, assembly, properties and applications of the above materials are compiled into a reference book. The anisotropy, i.e. the direction-dependent physical properties, of materials is fascinating and elegant and has sparked the quest for anisotropic materials with useful properties. With such a curiosity, material scientists have ventured into the realm of nanometer length scale and have explored the anisotropic nanoscale building blocks such as metallic and nonmetallic particles as well as organic molecular aggregates. It turns out that the anisotropic nanoscale building blocks, in addition to direction-dependent properties, exhibit dimension and morphology dependence of physical properties. Moreover, ordered arrays of anisotropic nanoscale building blocks furnish novel properties into the resulting system which would be entirely different from the properties of individual ones. Undoubtedly, these promising properties have qualified them as enabling building blocks of 21st century materials science, nanoscience and nanotechnology. Readers will find this book professionally valuable and intellectually stimulating in the rapidly emerging area of anisotropic nanomaterials. Quan Li, Ph.D., is Director of the Organic Synthesis and Advanced Materials Laboratory at the Liquid Crystal Institute of Kent State University, where he is also Adjunct Professor in the Chemical Physics Interdisciplinary Program. He has directed research projects funded by US Air Force Research Laboratory (AFRL), US Air Force Office of Scientific Research (AFSOR), US Army Research Office (ARO), US Department of Defense Multidisciplinary University Research Initiative (DoD MURI), US National Science Foundation (NSF), US Department of Energy (DOE), US National Aeronautics and Space Administration (NASA), Ohio Third Frontier, and Samsung Electronics, among others.

Author : Fei Lei,Qiang Xu,Guangde Zhang
Publisher : CRC Press
Page : 592 pages
File Size : 51,6 Mb
Release : 2017-03-31
Category : Technology & Engineering
ISBN : 9781498782135

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Machinery, Materials Science and Engineering Applications by Fei Lei,Qiang Xu,Guangde Zhang Pdf

This conference proceeding contains papers presented at the 6th International Conference on Machinery, Materials Science and Engineering Applications (MMSE 2016), held 28-30 October, 2016 in Wuhan, China. The conference proceeding contributions cover a large number of topics, both theoretical and applied, including Material science, Electrical Engineering and Automation Control, Electronic Engineering, Applied Mechanics, Mechanical Engineering, Aerospace Science and Technology, Computer Science and Information technology and other related engineering topics. MMSE provides a perfect platform for scientists and engineering researchers to exchange ideas, build cooperative relationships and discuss the latest scientific achievements. MMSE will be of interest for academics and professionals working in a wide range of industrial, governmental and academic sectors, including Material Science, Electrical and Electronic Engineering, Information Technology and Telecommunications, Civil Engineering, Energy Production, Manufacturing, Mechanical Engineering, Nuclear Engineering, Transportation and Aerospace Science and Technology.

Author : Yuan Xie
Publisher : Springer Science & Business Media
Page : 322 pages
File Size : 53,8 Mb
Release : 2013-10-21
Category : Technology & Engineering
ISBN : 9781441995513

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Emerging Memory Technologies by Yuan Xie Pdf

This book explores the design implications of emerging, non-volatile memory (NVM) technologies on future computer memory hierarchy architecture designs. Since NVM technologies combine the speed of SRAM, the density of DRAM, and the non-volatility of Flash memory, they are very attractive as the basis for future universal memories. This book provides a holistic perspective on the topic, covering modeling, design, architecture and applications. The practical information included in this book will enable designers to exploit emerging memory technologies to improve significantly the performance/power/reliability of future, mainstream integrated circuits.

Author : Muhannad S. Bakir,James D. Meindl
Publisher : Artech House
Page : 551 pages
File Size : 51,5 Mb
Release : 2008-11-30
Category : Technology & Engineering
ISBN : 9781596932470

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Integrated Interconnect Technologies for 3D Nanoelectronic Systems by Muhannad S. Bakir,James D. Meindl Pdf

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.