Author : Components, Packaging & Manufacturing Technology Society,IEEE Electrical Insulation Society Staff,Yixiong Huang,ieee,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 488 pages
File Size : 47,5 Mb
Release : 2011-11
Category : Electronic
ISBN : 1467301485
2011 International Symposium On Advanced Packaging Materials
2011 International Symposium On Advanced Packaging Materials Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of 2011 International Symposium On Advanced Packaging Materials book. This book definitely worth reading, it is an incredibly well-written.
2011 International Symposium on Advanced Packaging Materials (APM 2011)
Author : Yixiong Huang,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 488 pages
File Size : 43,6 Mb
Release : 2011
Category : Electronic
ISBN : 1467301477
2011 International Symposium on Advanced Packaging Materials (APM 2011) by Yixiong Huang,Institute of Electrical and Electronics Engineers Pdf
2011 International Symposium on Advanced Packaging Materials (APM)
Author : Anonim
Publisher : Unknown
Page : 488 pages
File Size : 51,5 Mb
Release : 2011
Category : Electronic packaging
ISBN : OCLC:775357733
2011 International Symposium on Advanced Packaging Materials (APM) by Anonim Pdf
International Symposium on Advanced Packaging Materials
Author : Anonim
Publisher : Unknown
Page : 322 pages
File Size : 47,9 Mb
Release : 2005
Category : Electronic packaging
ISBN : UOM:39015058301485
International Symposium on Advanced Packaging Materials by Anonim Pdf
International Symposium on Advanced Packaging Materials
Author : Anonim
Publisher : International Society of Hybrid
Page : 349 pages
File Size : 47,5 Mb
Release : 2000
Category : Technology & Engineering
ISBN : 0930815599
International Symposium on Advanced Packaging Materials by Anonim Pdf
These conference proceedings cover such topics as: high density packaging materials; automotive electronics; system level packaging; chip scale packaging; optoelectronics; power packaging; sensors; actuators, and MEMS; flex circuits; and thermal management.
2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces
Author : Components, Packaging, and Manufacturing Technology Society,Semiconductor Equipment and Materials International,Components, Packaging & Manufacturing Technology Society. Santa Clara Valley Chapter,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 132 pages
File Size : 43,7 Mb
Release : 2007
Category : Electronic packaging
ISBN : 1424413389
2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces by Components, Packaging, and Manufacturing Technology Society,Semiconductor Equipment and Materials International,Components, Packaging & Manufacturing Technology Society. Santa Clara Valley Chapter,Institute of Electrical and Electronics Engineers Pdf
2004 9th International Advanced Packaging Materials Symposium
Author : Anonim
Publisher : IEEE Computer Society Press
Page : 281 pages
File Size : 45,8 Mb
Release : 2004-01-01
Category : Electronic packaging
ISBN : 0780384369
2004 9th International Advanced Packaging Materials Symposium by Anonim Pdf
Proceedings, 3rd International Symposium on Advanced Packaging Materials
Author : Anonim
Publisher : Unknown
Page : 224 pages
File Size : 50,6 Mb
Release : 1997
Category : Electronic packaging
ISBN : CORNELL:31924079773507
Proceedings, 3rd International Symposium on Advanced Packaging Materials by Anonim Pdf
Materials for Advanced Packaging
Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 52,6 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988
Materials for Advanced Packaging by Daniel Lu,C.P. Wong Pdf
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
2005 10th International Symposium on Advanced Packaging Materials
Author : Anonim
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 302 pages
File Size : 47,7 Mb
Release : 2005-01-01
Category : Electronic packaging
ISBN : 0780390857
2005 10th International Symposium on Advanced Packaging Materials by Anonim Pdf
2013 IEEE International Symposium on Advanced Packaging Materials (APM 2013)
Author : Anonim
Publisher : Unknown
Page : 300 pages
File Size : 50,8 Mb
Release : 2013
Category : Electronic
ISBN : 1467360910
2013 IEEE International Symposium on Advanced Packaging Materials (APM 2013) by Anonim Pdf
APM-Microtech
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 47,7 Mb
Release : 2010
Category : Electronic packaging
ISBN : 142446756X
APM-Microtech by Anonim Pdf
2007 12th International Symposium on Advanced Packaging Materials
Author : Anonim
Publisher : IEEE Computer Society Press
Page : 130 pages
File Size : 52,7 Mb
Release : 2007-01-01
Category : Technology & Engineering
ISBN : 1424413370
2007 12th International Symposium on Advanced Packaging Materials by Anonim Pdf
International Symposium on Advanced Packaging Materials
Author : C. P. Wong
Publisher : IEEE
Page : 362 pages
File Size : 52,8 Mb
Release : 1999
Category : Technology & Engineering
ISBN : 0930815564
International Symposium on Advanced Packaging Materials by C. P. Wong Pdf
The 5th International Symposium on Advanced Packaging Materials was devoted to the advances made in electronic packaging materials. Topics covered in these proceedings include adhesives, integral passive materials, on-chip interconnect materials, underfills and encapsulent materials.
3rd International Symposium on Advanced Packaging Materials
Author : Anonim
Publisher : Unknown
Page : 182 pages
File Size : 40,5 Mb
Release : 1997
Category : Electronic packaging
ISBN : OCLC:959741296