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2013 Ieee Electrical Design Of Advanced Packaging And Systems Symposium Edaps 2013 Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of 2013 Ieee Electrical Design Of Advanced Packaging And Systems Symposium Edaps 2013 book. This book definitely worth reading, it is an incredibly well-written.
Author : IEEE Staff
Publisher : Unknown
Page : 128 pages
File Size : 53,5 Mb
Release : 2013-12-12
Category : Electronic
ISBN : 147993741X
The EDAPS 2013 is the premier symposium in Asian area to discuss IC design, SiP SoP packaging, EMI EMC, and EDA tools for advanced 3 D IC and packaging design
Author : Anonim
Publisher : Unknown
Page : 273 pages
File Size : 45,6 Mb
Release : 2013
Category : Electronic
ISBN : 1479923133
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 55,7 Mb
Release : 2015
Category : Electronic packaging
ISBN : OCLC:949000563
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 41,9 Mb
Release : 2011
Category : Electronic packaging
ISBN : 146732289X
Author : Chun T. Rim,Chris Mi
Publisher : John Wiley & Sons
Page : 626 pages
File Size : 53,6 Mb
Release : 2017-08-07
Category : Technology & Engineering
ISBN : 9781119329053
From mobile, cable-free re-charging of electric vehicles, smart phones and laptops to collecting solar electricity from orbiting solar farms, wireless power transfer (WPT) technologies offer consumers and society enormous benefits. Written by innovators in the field, this comprehensive resource explains the fundamental principles and latest advances in WPT and illustrates key applications of this emergent technology. Key features and coverage include: The fundamental principles of WPT to practical applications on dynamic charging and static charging of EVs and smartphones. Theories for inductive power transfer (IPT) such as the coupled inductor model, gyrator circuit model, and magnetic mirror model. IPTs for road powered EVs, including controller, compensation circuit, electro-magnetic field cancel, large tolerance, power rail segmentation, and foreign object detection. IPTs for static charging for EVs and large tolerance and capacitive charging issues, as well as IPT mobile applications such as free space omnidirectional IPT by dipole coils and 2D IPT for robots. Principle and applications of capacitive power transfer. Synthesized magnetic field focusing, wireless nuclear instrumentation, and future WPT. A technical asset for engineers in the power electronics, internet of things and automotive sectors, Wireless Power Transfer for Electric Vehicles and Mobile Devices is an essential design and analysis guide and an important reference for graduate and higher undergraduate students preparing for careers in these industries.
Author : Khaled Salah Mohamed
Publisher : Springer
Page : 93 pages
File Size : 48,7 Mb
Release : 2018-03-02
Category : Technology & Engineering
ISBN : 9783319757148
This Book discusses machine learning for model order reduction, which can be used in modern VLSI design to predict the behavior of an electronic circuit, via mathematical models that predict behavior. The author describes techniques to reduce significantly the time required for simulations involving large-scale ordinary differential equations, which sometimes take several days or even weeks. This method is called model order reduction (MOR), which reduces the complexity of the original large system and generates a reduced-order model (ROM) to represent the original one. Readers will gain in-depth knowledge of machine learning and model order reduction concepts, the tradeoffs involved with using various algorithms, and how to apply the techniques presented to circuit simulations and numerical analysis. Introduces machine learning algorithms at the architecture level and the algorithm levels of abstraction; Describes new, hybrid solutions for model order reduction; Presents machine learning algorithms in depth, but simply; Uses real, industrial applications to verify algorithms.
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 55,9 Mb
Release : 2012
Category : Electronic packaging
ISBN : OCLC:839274748
Author : IEEE Staff
Publisher : Unknown
Page : 128 pages
File Size : 46,5 Mb
Release : 2017-12-14
Category : Electronic
ISBN : 1538612399
Design for signal integrity, analysis of performance of integrated systems
Author : Thomas Noulis
Publisher : CRC Press
Page : 519 pages
File Size : 41,7 Mb
Release : 2018-01-09
Category : Technology & Engineering
ISBN : 9781138031616
Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Author : De-Shuang Huang,Kang-Hyun Jo,Jianqiang Li,Valeriya Gribova,Abir Hussain
Publisher : Springer Nature
Page : 778 pages
File Size : 40,9 Mb
Release : 2021-08-09
Category : Computers
ISBN : 9783030845292
This two-volume set of LNCS 12836 and LNCS 12837 constitutes - in conjunction with the volume LNAI 12838 - the refereed proceedings of the 17th International Conference on Intelligent Computing, ICIC 2021, held in Shenzhen, China in August 2021. The 192 full papers of the three proceedings volumes were carefully reviewed and selected from 458 submissions. The ICIC theme unifies the picture of contemporary intelligent computing techniques as an integral concept that highlights the trends in advanced computational intelligence and bridges theoretical research with applications. The theme for this conference is “Advanced Intelligent Computing Methodologies and Applications.” The papers are organized in the following subsections: Intelligent Computing in Computer Vision, Intelligent Control and Automation, Intelligent Modeling Technologies for Smart Cities, Machine Learning, and Theoretical Computational Intelligence and Applications.
Author : Frede Blaabjerg,Tomislav Dragicevic,Pooya Davari
Publisher : MDPI
Page : 500 pages
File Size : 49,5 Mb
Release : 2019-06-24
Category : Technology & Engineering
ISBN : 9783039210206
Power electronics technology is still an emerging technology, and it has found its way into many applications, from renewable energy generation (i.e., wind power and solar power) to electrical vehicles (EVs), biomedical devices, and small appliances, such as laptop chargers. In the near future, electrical energy will be provided and handled by power electronics and consumed through power electronics; this not only will intensify the role of power electronics technology in power conversion processes, but also implies that power systems are undergoing a paradigm shift, from centralized distribution to distributed generation. Today, more than 1000 GW of renewable energy generation sources (photovoltaic (PV) and wind) have been installed, all of which are handled by power electronics technology. The main aim of this book is to highlight and address recent breakthroughs in the range of emerging applications in power electronics and in harmonic and electromagnetic interference (EMI) issues at device and system levels as discussed in robust and reliable power electronics technologies, including fault prognosis and diagnosis technique stability of grid-connected converters and smart control of power electronics in devices, microgrids, and at system levels.
Author : Aida Todri-Sanial,Chuan Seng Tan
Publisher : CRC Press
Page : 397 pages
File Size : 49,9 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781498710374
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 53,8 Mb
Release : 2017
Category : Electronic packaging
ISBN : 1538612380
Author : Anonim
Publisher : Unknown
Page : 246 pages
File Size : 53,8 Mb
Release : 2012
Category : Electronic
ISBN : 1467314455
Author : Abhineet Saini,B. S. Pabla,Chander Prakash,Gurmohan Singh,Alokesh Pramanik
Publisher : CRC Press
Page : 471 pages
File Size : 53,7 Mb
Release : 2023-11-15
Category : Technology & Engineering
ISBN : 9781000983487
The book, which is part of a two-volume handbook set, presents a collection of recent advances in the field of industrial engineering, design, and related technologies. It includes state-of-the-art research conducted in the fields of Industry 4.0/5.0, smart systems/industries, robotics and automation, automobile engineering, thermal and fluid engineering, and its implementation. Manufacturing Technologies and Production Systems: Principles and Practices offers a comprehensive description of the developments in industrial engineering primarily focusing on industrial design, automotive engineering, construction and structural engineering, thermo-fluid mechanics, and interdisciplinary domains. The book captures emerging areas of materials science and advanced manufacturing engineering and presents the most recent trends in research for emerging researchers, field engineers, and academic professionals.