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Advanced Metallization And Interconnect Systems For Ulsi Applications In 1996 Volume 12 Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of Advanced Metallization And Interconnect Systems For Ulsi Applications In 1996 Volume 12 book. This book definitely worth reading, it is an incredibly well-written.
Author : Robert Havemann
Publisher : Mrs Conference Proceedings
Page : 640 pages
File Size : 51,8 Mb
Release : 1997
Category : Computers
ISBN : UOM:39015040062161
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Robin Cheung,Jeffrey Klein,Kazuo Tsubouchi,Masanori Murakami,Nobuyoshi Kobayashi
Publisher : Materials Research Society
Page : 765 pages
File Size : 53,8 Mb
Release : 2000-02-01
Category : Technology & Engineering
ISBN : 1558994122
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Daniel C. Edelstein
Publisher : Unknown
Page : 608 pages
File Size : 48,9 Mb
Release : 1999-10-07
Category : Technology & Engineering
ISBN : UOM:39015042090459
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Russell C. Ellwanger,Shi-Qing Wang
Publisher : Materials Research Society
Page : 767 pages
File Size : 54,9 Mb
Release : 2000-02-01
Category : Technology & Engineering
ISBN : 155899341X
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Arief Suriadi Budiman
Publisher : Springer
Page : 118 pages
File Size : 55,6 Mb
Release : 2014-12-27
Category : Technology & Engineering
ISBN : 9789812873354
This Brief highlights the search for strain gradients and geometrically necessary dislocations as a possible source of strength for two cases of deformation of materials at small scales: nanoindented single crystal copper and uniaxially compressed single crystal submicron gold pillars. When crystalline materials are mechanically deformed in small volumes, higher stresses are needed for plastic flow. This has been called the "Smaller is Stronger" phenomenon and has been widely observed. studies suggest that plasticity in one case is indeed controlled by the GNDs (strain gradient hardening), whereas in the other, plasticity is not controlled by strain gradients or sub-structure hardening, but rather by dislocation source starvation, wherein smaller volumes are stronger because fewer sources of dislocations are available (dislocation starvation hardening).
Author : Anonim
Publisher : Academic Press
Page : 307 pages
File Size : 55,8 Mb
Release : 1999-10-29
Category : Technology & Engineering
ISBN : 9780080864617
Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry.
Author : Hazara S. Rathore
Publisher : The Electrochemical Society
Page : 278 pages
File Size : 40,8 Mb
Release : 1997
Category : Dielectric devices
ISBN : 1566771358
Author : Paul S. Ho,Jihperng Leu,Wei William Lee
Publisher : Springer Science & Business Media
Page : 310 pages
File Size : 41,7 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9783642559082
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for
Author : Yoshio Nishi,Robert Doering
Publisher : CRC Press
Page : 1720 pages
File Size : 46,8 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781420017663
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author : M.R. Oliver
Publisher : Springer Science & Business Media
Page : 432 pages
File Size : 54,8 Mb
Release : 2013-03-14
Category : Technology & Engineering
ISBN : 9783662062340
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Author : William D. Brown,Electrochemical Society. Dielectric Science and Technology Division,Electrochemical Society. Meeting
Publisher : The Electrochemical Society
Page : 384 pages
File Size : 41,8 Mb
Release : 1998
Category : Dielectric devices
ISBN : 1566771978
Author : Richard Vinci,Richard Paul Vinci
Publisher : Mrs Proceedings
Page : 576 pages
File Size : 45,5 Mb
Release : 2000-09-25
Category : Science
ISBN : UCSD:31822028476570
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Anonim
Publisher : Unknown
Page : 244 pages
File Size : 46,8 Mb
Release : 1998
Category : Dielectric films
ISBN : UOM:39015048109253
Author : British Library. Document Supply Centre
Publisher : Unknown
Page : 844 pages
File Size : 43,8 Mb
Release : 1999
Category : Conference proceedings
ISBN : STANFORD:36105024775129