Advanced Metallization And Interconnect Systems For Ulsi Applications In 1997

Author : Yoshio Nishi,Robert Doering
Publisher : CRC Press
Page : 1720 pages
File Size : 50,6 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781420017663

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Handbook of Semiconductor Manufacturing Technology by Yoshio Nishi,Robert Doering Pdf

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Author : Robin Cheung,Jeffrey Klein,Kazuo Tsubouchi,Masanori Murakami,Nobuyoshi Kobayashi
Publisher : Materials Research Society
Page : 765 pages
File Size : 45,9 Mb
Release : 2000-02-01
Category : Technology & Engineering
ISBN : 1558994122

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Advanced Metallization and Interconnect Systems for ULSI Applications in 1997: by Robin Cheung,Jeffrey Klein,Kazuo Tsubouchi,Masanori Murakami,Nobuyoshi Kobayashi Pdf

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Author : Russell C. Ellwanger,Shi-Qing Wang
Publisher : Materials Research Society
Page : 767 pages
File Size : 48,8 Mb
Release : 2000-02-01
Category : Technology & Engineering
ISBN : 155899341X

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Advanced Metallization and Interconnect Systems for ULSI Applications in 1995: by Russell C. Ellwanger,Shi-Qing Wang Pdf

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Author : Anonim
Publisher : Academic Press
Page : 307 pages
File Size : 44,6 Mb
Release : 1999-10-29
Category : Technology & Engineering
ISBN : 9780080864617

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Chemical Mechanical Polishing in Silicon Processing by Anonim Pdf

Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry.

Author : G. S. Mathad
Publisher : The Electrochemical Society
Page : 262 pages
File Size : 47,5 Mb
Release : 2001
Category : Science
ISBN : 156677294X

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Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics by G. S. Mathad Pdf

Author : Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
Publisher : John Wiley & Sons
Page : 616 pages
File Size : 44,9 Mb
Release : 2012-02-17
Category : Technology & Engineering
ISBN : 9781119966869

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Advanced Interconnects for ULSI Technology by Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech Pdf

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Author : Paul S. Ho,Jihperng Leu,Wei William Lee
Publisher : Springer Science & Business Media
Page : 310 pages
File Size : 48,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9783642559082

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Low Dielectric Constant Materials for IC Applications by Paul S. Ho,Jihperng Leu,Wei William Lee Pdf

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for

Author : Krishna Seshan
Publisher : CRC Press
Page : 72 pages
File Size : 43,9 Mb
Release : 2002-02-01
Category : Science
ISBN : 9781482269680

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Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon by Krishna Seshan Pdf

The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition tec

Author : Daniel C. Edelstein
Publisher : Unknown
Page : 606 pages
File Size : 52,5 Mb
Release : 1999-10-07
Category : Technology & Engineering
ISBN : UOM:39015042090459

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Advanced Interconnects and Contacts: Volume 564 by Daniel C. Edelstein Pdf

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Author : Krishna Seshan
Publisher : William Andrew
Page : 430 pages
File Size : 47,6 Mb
Release : 2001-02-01
Category : Technology & Engineering
ISBN : 9780815517788

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Handbook of Thin Film Deposition Processes and Techniques by Krishna Seshan Pdf

New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques. Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

Author : Anonim
Publisher : Unknown
Page : 724 pages
File Size : 54,7 Mb
Release : 2000
Category : Crystal growth
ISBN : UOM:39015047910636

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High Purity Silicon by Anonim Pdf

Author : Electrochemical Society. Meeting
Publisher : The Electrochemical Society
Page : 720 pages
File Size : 42,8 Mb
Release : 2000
Category : Science
ISBN : 1566772842

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High Purity Silicon VI by Electrochemical Society. Meeting Pdf

"... papers that were presented at the Sixth Symposium on High Purity Silicon held in Phoenix, Arizona at the 198th Meeting of the Electrochemical Society, October 22-27, 2000."--Preface.

Author : Christopher Lyle Borst,William N. Gill,Ronald J. Gutmann
Publisher : Springer Science & Business Media
Page : 235 pages
File Size : 53,7 Mb
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 9781461511656

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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses by Christopher Lyle Borst,William N. Gill,Ronald J. Gutmann Pdf

As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.

Author : M.R. Oliver
Publisher : Springer Science & Business Media
Page : 432 pages
File Size : 54,7 Mb
Release : 2013-03-14
Category : Technology & Engineering
ISBN : 9783662062340

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Chemical-Mechanical Planarization of Semiconductor Materials by M.R. Oliver Pdf

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Author : C. Claeys
Publisher : The Electrochemical Society
Page : 547 pages
File Size : 53,9 Mb
Release : 2009-09
Category : Integrated circuits
ISBN : 9781566777445

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ULSI Process Integration 6 by C. Claeys Pdf

ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).