Istfa 2009

Author : Anonim
Publisher : ASM International
Page : 371 pages
File Size : 45,7 Mb
Release : 2009-01-01
Category : Technology & Engineering
ISBN : 9781615030927

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ISTFA 2009 by Anonim Pdf

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.

Author : ASM International,EDFAS Organizing Committee, editors
Publisher : ASM International
Page : 643 pages
File Size : 43,5 Mb
Release : 2012
Category : Technology & Engineering
ISBN : 9781615039951

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ISTFA 2012 by ASM International,EDFAS Organizing Committee, editors Pdf

Author : Anonim
Publisher : ASM International
Page : 487 pages
File Size : 43,6 Mb
Release : 2010-01-01
Category : Technology & Engineering
ISBN : 9781615037278

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ISTFA 2010 by Anonim Pdf

Author : A. S. M. International
Publisher : ASM International
Page : 634 pages
File Size : 40,5 Mb
Release : 2013-01-01
Category : Technology & Engineering
ISBN : 9781627080224

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ISTFA 2013 by A. S. M. International Pdf

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.

Author : Anonim
Publisher : ASM International
Page : 479 pages
File Size : 45,8 Mb
Release : 2011
Category : Technology & Engineering
ISBN : 9781615038503

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ISTFA 2011 by Anonim Pdf

Author : Anonim
Publisher : ASM International
Page : 128 pages
File Size : 49,7 Mb
Release : 2017-12-01
Category : Technology & Engineering
ISBN : 9781627081511

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ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis by Anonim Pdf

The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.

Author : Tejinder Gandhi
Publisher : ASM International
Page : 750 pages
File Size : 47,7 Mb
Release : 2019-11-01
Category : Technology & Engineering
ISBN : 9781627082464

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Microelectronics Fialure Analysis Desk Reference, Seventh Edition by Tejinder Gandhi Pdf

The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.

Author : ASM International
Publisher : ASM International
Page : 551 pages
File Size : 55,7 Mb
Release : 2008-01-01
Category : Electronic apparatus and appliances
ISBN : 9781615030910

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Thirty-fourth International Symposium for Testing and Failure Analysis by ASM International Pdf

Author : Jun Dai,Michael M. Ohadi,Diganta Das,Michael G. Pecht
Publisher : Springer Science & Business Media
Page : 196 pages
File Size : 52,5 Mb
Release : 2013-11-20
Category : Technology & Engineering
ISBN : 9781461456025

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Optimum Cooling of Data Centers by Jun Dai,Michael M. Ohadi,Diganta Das,Michael G. Pecht Pdf

This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the people designing and manufacturing key parts of communication networks. This book provides an introduction to current cooling methods used for energy reduction, and also compares present cooling methods in use in the field. The qualification methods and standard reliability assessments are reviewed, and their inability to assess the risks of free air cooling is discussed. The method of identifying the risks associated with free air cooling on equipment performance and reliability is introduced. A novel method of assessment for free air cooling is also proposed that utilizes prognostics and health management (PHM). This book also: Describes how the implementation of free air cooling can save energy for cooling within the telecommunications infrastructure. Analyzes the potential risks and failures of mechanisms possible in the implementation of free air cooling, which benefits manufacturers and equipment designers. Presents prognostics-based assessments to identify and mitigate the risks of telecommunications equipment under free air cooling conditions, which can provide the early warning of equipment failures at operation stage without disturbing the data centers' service. Optimum Cooling for Data Centers is an ideal book for researchers and engineers interested in designing and manufacturing equipment for use in telecom infrastructures.

Author : EDFAS Desk Reference Committee
Publisher : ASM International
Page : 673 pages
File Size : 45,5 Mb
Release : 2011
Category : Technology & Engineering
ISBN : 9781615037261

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Microelectronics Failure Analysis by EDFAS Desk Reference Committee Pdf

Includes bibliographical references and index.

Author : ASM. International
Publisher : Unknown
Page : 128 pages
File Size : 43,7 Mb
Release : 2009
Category : Electronic book
ISBN : OCLC:1065017364

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ISTFA 2009 Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, November 14-19, 2009, San Jose McEnery Convention Center, San Jose, California, USA by ASM. International Pdf

Author : Anonim
Publisher : ASM International
Page : 0 pages
File Size : 54,6 Mb
Release : 2009
Category : Technology & Engineering
ISBN : 1615030085

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ISTFA 2009 by Anonim Pdf

Features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.

Author : Anonim
Publisher : Unknown
Page : 594 pages
File Size : 41,7 Mb
Release : 1989
Category : Electronic apparatus and appliances
ISBN : PSU:000016336599

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Conference Proceedings by Anonim Pdf

Author : Manjul Bhushan,Mark B. Ketchen
Publisher : Springer Science & Business Media
Page : 401 pages
File Size : 44,8 Mb
Release : 2011-08-26
Category : Technology & Engineering
ISBN : 9781441993779

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Microelectronic Test Structures for CMOS Technology by Manjul Bhushan,Mark B. Ketchen Pdf

Microelectronic Test Structures for CMOS Technology and Products addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance and characteristics of MOSFETs and other circuit elements. Detailed examples are presented throughout, many of which are equally applicable to other microelectronic technologies as well. The authors’ overarching goal is to provide students and technology practitioners alike a practical guide to the disciplined design and use of test structures that give unambiguous information on the parametrics and performance of digital CMOS technology.

Author : Yan Li,Deepak Goyal
Publisher : Springer
Page : 463 pages
File Size : 43,9 Mb
Release : 2017-01-20
Category : Technology & Engineering
ISBN : 9783319445861

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3D Microelectronic Packaging by Yan Li,Deepak Goyal Pdf

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.