Author : Anonim
Publisher : ASM International
Page : 487 pages
File Size : 54,9 Mb
Release : 2010-01-01
Category : Technology & Engineering
ISBN : 9781615037278
ISTFA 2010
Anonim
Istfa 2010
Istfa 2010 Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of Istfa 2010 book. This book definitely worth reading, it is an incredibly well-written.
ISTFA 2009
Anonim
Author : Anonim
Publisher : ASM International
Page : 371 pages
File Size : 46,5 Mb
Release : 2009-01-01
Category : Technology & Engineering
ISBN : 9781615030927
ISTFA 2009 by Anonim Pdf
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
ISTFA 2011
Anonim
Author : Anonim
Publisher : ASM International
Page : 479 pages
File Size : 43,8 Mb
Release : 2011
Category : Technology & Engineering
ISBN : 9781615038503
ISTFA 2011 by Anonim Pdf
ISTFA 2012
ASM International,EDFAS Organizing Committee, editors
Author : ASM International,EDFAS Organizing Committee, editors
Publisher : ASM International
Page : 643 pages
File Size : 51,7 Mb
Release : 2012
Category : Technology & Engineering
ISBN : 9781615039951
ISTFA 2012 by ASM International,EDFAS Organizing Committee, editors Pdf
ISTFA 2014
A. S. M. International,International Symposium for Testing and Failure Analysis
Author : A. S. M. International,International Symposium for Testing and Failure Analysis
Publisher : ASM International
Page : 561 pages
File Size : 42,5 Mb
Release : 2014-11-01
Category : Technology & Engineering
ISBN : 9781627080743
ISTFA 2014 by A. S. M. International,International Symposium for Testing and Failure Analysis Pdf
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
ISTFA 2013
A. S. M. International
Author : A. S. M. International
Publisher : ASM International
Page : 634 pages
File Size : 52,7 Mb
Release : 2013-01-01
Category : Technology & Engineering
ISBN : 9781627080224
ISTFA 2013 by A. S. M. International Pdf
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Anonim
Author : Anonim
Publisher : ASM International
Page : 128 pages
File Size : 49,9 Mb
Release : 2018-12-01
Category : Electronic
ISBN : 9781627080996
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis by Anonim Pdf
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis
Anonim
Author : Anonim
Publisher : ASM International
Page : 128 pages
File Size : 55,5 Mb
Release : 2017-12-01
Category : Technology & Engineering
ISBN : 9781627081511
ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis by Anonim Pdf
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Anonim
Author : Anonim
Publisher : ASM International
Page : 540 pages
File Size : 46,8 Mb
Release : 2019-12-01
Category : Technology & Engineering
ISBN : 9781627082730
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis by Anonim Pdf
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Microelectronics Fialure Analysis Desk Reference, Seventh Edition
Tejinder Gandhi
Author : Tejinder Gandhi
Publisher : ASM International
Page : 750 pages
File Size : 50,9 Mb
Release : 2019-11-01
Category : Technology & Engineering
ISBN : 9781627082464
Microelectronics Fialure Analysis Desk Reference, Seventh Edition by Tejinder Gandhi Pdf
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
ISTFA 2010
Anonim
Author : Anonim
Publisher : Unknown
Page : 464 pages
File Size : 43,7 Mb
Release : 2010
Category : Electronic apparatus and appliances
ISBN : 1680155105
ISTFA 2010 by Anonim Pdf
3D Microelectronic Packaging
Yan Li,Deepak Goyal
Author : Yan Li,Deepak Goyal
Publisher : Springer Nature
Page : 629 pages
File Size : 47,9 Mb
Release : 2020-11-23
Category : Technology & Engineering
ISBN : 9789811570902
3D Microelectronic Packaging by Yan Li,Deepak Goyal Pdf
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
ISTFA 2010
Anonim
Author : Anonim
Publisher : Unknown
Page : 464 pages
File Size : 50,7 Mb
Release : 2010
Category : Electronic apparatus and appliances
ISBN : 0615030416
ISTFA 2010 by Anonim Pdf
Conference Proceedings
Anonim
Author : Anonim
Publisher : Unknown
Page : 594 pages
File Size : 52,6 Mb
Release : 1989
Category : Electronic apparatus and appliances
ISBN : PSU:000016336599
Conference Proceedings by Anonim Pdf
ISTFA 2000
ASM International
Author : ASM International
Publisher : Unknown
Page : 610 pages
File Size : 46,6 Mb
Release : 2000
Category : Technology & Engineering
ISBN : CORNELL:31924090787650
ISTFA 2000 by ASM International Pdf
Proceedings of the 2000 International Symposium for Testing and Failure Analysis, held 12th-16th November, 2000, at Meydenbauer Convention Center, Belvue, Washington. These proceedings present in-depth coverage of the latest developments and the most advanced techniques for testing and failure analysis of microelectronic components. The book covers the full spectrum of failure analysis topics, but with special emphasis on backside (flipchip) failure analysis and the diagnosis of high-end microchip failures, by analyzing the silicon. Contents: Advanced Techniques; Packaging; Testing and Yield Enhancement; Backside Analysis; New Techniques; Case Histories; Focused Ion Beam Analysis; Scanning Probe Microscopy Analysis. The CD-ROMAs PDF-file format can be accessed using Adobe Acrobat Reader 4.0 or higher.
