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Author : Anonim
Publisher : Unknown
Page : 440 pages
File Size : 54,9 Mb
Release : 2004
Category : Dielectric films
ISBN : UOM:39015058889430
Author : G. S. Oehrlein,K. Maex,Y. -C. Joo,S. Ogawa,J. T. Wetzel
Publisher : Cambridge University Press
Page : 614 pages
File Size : 53,5 Mb
Release : 2014-06-05
Category : Technology & Engineering
ISBN : 110741315X
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Author : R. J. Carter
Publisher : Unknown
Page : 432 pages
File Size : 53,7 Mb
Release : 2004-09
Category : Technology & Engineering
ISBN : UCSD:31822032306177
The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Author : Materials Research Society. Meeting
Publisher : Unknown
Page : 544 pages
File Size : 47,5 Mb
Release : 2003
Category : Dielectric films
ISBN : UCSD:31822032330201
Author : Anonim
Publisher : Unknown
Page : 107 pages
File Size : 43,7 Mb
Release : 2001
Category : Dielectric films
ISBN : 1558996508
Author : Paul R. Besser
Publisher : Unknown
Page : 450 pages
File Size : 53,7 Mb
Release : 2005-08-26
Category : Technology & Engineering
ISBN : UOM:39015062432136
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2005.
Author : Tapan Gupta
Publisher : Springer Science & Business Media
Page : 423 pages
File Size : 55,9 Mb
Release : 2010-01-22
Category : Technology & Engineering
ISBN : 9781441900760
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Author : Anonim
Publisher : Unknown
Page : 624 pages
File Size : 45,7 Mb
Release : 2001
Category : Dielectric films
ISBN : UCSD:31822030019509
Author : Paul S. Ho,Jihperng Leu,Wei William Lee
Publisher : Springer Science & Business Media
Page : 310 pages
File Size : 53,7 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9783642559082
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for
Author : Anonim
Publisher : The Electrochemical Society
Page : 508 pages
File Size : 43,7 Mb
Release : 2004
Category : Dielectrics
ISBN : 1566774179
Author : Ting Y. Tsui
Publisher : Unknown
Page : 498 pages
File Size : 52,9 Mb
Release : 2006
Category : Technology & Engineering
ISBN : UOM:39015064810438
Author : Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
Publisher : John Wiley & Sons
Page : 616 pages
File Size : 52,9 Mb
Release : 2012-02-17
Category : Technology & Engineering
ISBN : 9781119966869
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author : Mikhail Baklanov,Karen Maex,Martin Green
Publisher : John Wiley & Sons
Page : 508 pages
File Size : 46,9 Mb
Release : 2007-04-04
Category : Technology & Engineering
ISBN : 9780470065419
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Author : G. S. Mathad
Publisher : The Electrochemical Society
Page : 262 pages
File Size : 49,8 Mb
Release : 2001
Category : Science
ISBN : 156677294X
Author : Krishna Seshan,Dominic Schepis
Publisher : William Andrew
Page : 470 pages
File Size : 46,7 Mb
Release : 2018-02-23
Category : Technology & Engineering
ISBN : 9780128123126
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics