Materials Technology And Reliability For Advanced Interconnects And Low K Dielectrics 2004

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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004

R. J. Carter
Materials Technology and Reliability for Advanced Interconnects and Low K Dielectrics 2004 Book PDF

Author : R. J. Carter
Publisher : Unknown
Page : 432 pages
File Size : 46,6 Mb
Release : 2004-09
Category : Technology & Engineering
ISBN : UCSD:31822032306177

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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004 by R. J. Carter Pdf

The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.

Copper Interconnect Technology

Tapan Gupta
Copper Interconnect Technology Book PDF

Author : Tapan Gupta
Publisher : Springer Science & Business Media
Page : 423 pages
File Size : 48,5 Mb
Release : 2010-01-22
Category : Technology & Engineering
ISBN : 9781441900760

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Copper Interconnect Technology by Tapan Gupta Pdf

Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.

Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics:

G. S. Oehrlein,K. Maex,Y. -C. Joo,S. Ogawa,J. T. Wetzel
Materials Technology and Reliability for Advanced Interconnects and Low K Dielectrics Book PDF

Author : G. S. Oehrlein,K. Maex,Y. -C. Joo,S. Ogawa,J. T. Wetzel
Publisher : Cambridge University Press
Page : 614 pages
File Size : 49,8 Mb
Release : 2014-06-05
Category : Technology & Engineering
ISBN : 110741315X

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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: by G. S. Oehrlein,K. Maex,Y. -C. Joo,S. Ogawa,J. T. Wetzel Pdf

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.

Dielectrics for Nanosystems

Anonim
Dielectrics for Nanosystems Book PDF

Author : Anonim
Publisher : The Electrochemical Society
Page : 508 pages
File Size : 55,6 Mb
Release : 2004
Category : Dielectrics
ISBN : 1566774179

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Dielectrics for Nanosystems by Anonim Pdf

Computational Finite Element Methods in Nanotechnology

Sarhan M. Musa
Computational Finite Element Methods in Nanotechnology Book PDF

Author : Sarhan M. Musa
Publisher : CRC Press
Page : 647 pages
File Size : 41,6 Mb
Release : 2017-12-19
Category : Science
ISBN : 9781351832595

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Computational Finite Element Methods in Nanotechnology by Sarhan M. Musa Pdf

Computational Finite Element Methods in Nanotechnology demonstrates the capabilities of finite element methods in nanotechnology for a range of fields. Bringing together contributions from researchers around the world, it covers key concepts as well as cutting-edge research and applications to inspire new developments and future interdisciplinary research. In particular, it emphasizes the importance of finite element methods (FEMs) for computational tools in the development of efficient nanoscale systems. The book explores a variety of topics, including: A novel FE-based thermo-electrical-mechanical-coupled model to study mechanical stress, temperature, and electric fields in nano- and microelectronics The integration of distributed element, lumped element, and system-level methods for the design, modeling, and simulation of nano- and micro-electromechanical systems (N/MEMS) Challenges in the simulation of nanorobotic systems and macro-dimensions The simulation of structures and processes such as dislocations, growth of epitaxial films, and precipitation Modeling of self-positioning nanostructures, nanocomposites, and carbon nanotubes and their composites Progress in using FEM to analyze the electric field formed in needleless electrospinning How molecular dynamic (MD) simulations can be integrated into the FEM Applications of finite element analysis in nanomaterials and systems used in medicine, dentistry, biotechnology, and other areas The book includes numerous examples and case studies, as well as recent applications of microscale and nanoscale modeling systems with FEMs using COMSOL Multiphysics® and MATLAB®. A one-stop reference for professionals, researchers, and students, this is also an accessible introduction to computational FEMs in nanotechnology for those new to the field.

Handbook of Thin Film Deposition

Krishna Seshan,Dominic Schepis
Handbook of Thin Film Deposition Book PDF

Author : Krishna Seshan,Dominic Schepis
Publisher : William Andrew
Page : 470 pages
File Size : 42,7 Mb
Release : 2018-02-23
Category : Technology & Engineering
ISBN : 9780128123126

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Handbook of Thin Film Deposition by Krishna Seshan,Dominic Schepis Pdf

Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics

Advanced Interconnects for ULSI Technology

Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
Advanced Interconnects for ULSI Technology Book PDF

Author : Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
Publisher : John Wiley & Sons
Page : 616 pages
File Size : 53,9 Mb
Release : 2012-02-17
Category : Technology & Engineering
ISBN : 9781119966869

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Advanced Interconnects for ULSI Technology by Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech Pdf

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Materials, Technology and Reliability for Advanced Interconnects 2005: Volume 863

Paul R. Besser
Materials Technology and Reliability for Advanced Interconnects 2005 Volume 863 Book PDF

Author : Paul R. Besser
Publisher : Unknown
Page : 450 pages
File Size : 55,8 Mb
Release : 2005-08-26
Category : Technology & Engineering
ISBN : UOM:39015062432136

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Materials, Technology and Reliability for Advanced Interconnects 2005: Volume 863 by Paul R. Besser Pdf

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2005.

Electromigration in ULSI Interconnections

Cher Ming Tan
Electromigration in ULSI Interconnections Book PDF

Author : Cher Ming Tan
Publisher : World Scientific
Page : 312 pages
File Size : 42,8 Mb
Release : 2010
Category : Computers
ISBN : 9789814273336

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Electromigration in ULSI Interconnections by Cher Ming Tan Pdf

Electromigration in ULSI Interconnections provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electro migration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electro migration are presented in a concise and rigorous manner.Methods of numerical modeling for the interconnect electro migration and their applications to the understanding of electro migration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electro migration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electro migration are outlined and discussed.

Handbook of Silicon Wafer Cleaning Technology, 2nd Edition

Karen Reinhardt,Werner Kern
Handbook of Silicon Wafer Cleaning Technology 2nd Edition Book PDF

Author : Karen Reinhardt,Werner Kern
Publisher : William Andrew
Page : 660 pages
File Size : 54,6 Mb
Release : 2008-12-10
Category : Technology & Engineering
ISBN : 9780815517733

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Handbook of Silicon Wafer Cleaning Technology, 2nd Edition by Karen Reinhardt,Werner Kern Pdf

The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process Editors are two of the top names in the field and are both extensively published Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol

Handbook of Semiconductor Manufacturing Technology

Yoshio Nishi,Robert Doering
Handbook of Semiconductor Manufacturing Technology Book PDF

Author : Yoshio Nishi,Robert Doering
Publisher : CRC Press
Page : 1720 pages
File Size : 55,7 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781420017663

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Handbook of Semiconductor Manufacturing Technology by Yoshio Nishi,Robert Doering Pdf

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.