Microelectronic Packaging

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Microelectronic Packaging

M. Datta,Tetsuya Osaka,J. Walter Schultze
Microelectronic Packaging Book PDF

Author : M. Datta,Tetsuya Osaka,J. Walter Schultze
Publisher : CRC Press
Page : 564 pages
File Size : 53,9 Mb
Release : 2004-12-20
Category : Technology & Engineering
ISBN : 9780203473689

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Microelectronic Packaging by M. Datta,Tetsuya Osaka,J. Walter Schultze Pdf

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Microelectronics Packaging Handbook

R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Microelectronics Packaging Handbook Book PDF

Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 1060 pages
File Size : 45,9 Mb
Release : 2013-11-27
Category : Computers
ISBN : 9781461560371

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Microelectronics Packaging Handbook by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Modeling and Simulation for Microelectronic Packaging Assembly

Shen Liu,Yong Liu
Modeling and Simulation for Microelectronic Packaging Assembly Book PDF

Author : Shen Liu,Yong Liu
Publisher : John Wiley & Sons
Page : 586 pages
File Size : 54,8 Mb
Release : 2011-08-24
Category : Technology & Engineering
ISBN : 9780470828410

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Modeling and Simulation for Microelectronic Packaging Assembly by Shen Liu,Yong Liu Pdf

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

3D Microelectronic Packaging

Yan Li,Deepak Goyal
3D Microelectronic Packaging Book PDF

Author : Yan Li,Deepak Goyal
Publisher : Springer Nature
Page : 629 pages
File Size : 49,9 Mb
Release : 2020-11-23
Category : Technology & Engineering
ISBN : 9789811570902

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3D Microelectronic Packaging by Yan Li,Deepak Goyal Pdf

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Force Sensors for Microelectronic Packaging Applications

Jürg Schwizer,Michael Mayer,Oliver Brand
Force Sensors for Microelectronic Packaging Applications Book PDF

Author : Jürg Schwizer,Michael Mayer,Oliver Brand
Publisher : Springer Science & Business Media
Page : 184 pages
File Size : 54,8 Mb
Release : 2005-12-11
Category : Technology & Engineering
ISBN : 9783540269458

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Force Sensors for Microelectronic Packaging Applications by Jürg Schwizer,Michael Mayer,Oliver Brand Pdf

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Microelectronics Packaging Handbook

R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Microelectronics Packaging Handbook Book PDF

Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 742 pages
File Size : 51,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461540861

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Microelectronics Packaging Handbook by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

3D Microelectronic Packaging

Yan Li,Deepak Goyal
3D Microelectronic Packaging Book PDF

Author : Yan Li,Deepak Goyal
Publisher : Springer
Page : 560 pages
File Size : 44,8 Mb
Release : 2016-10-29
Category : Technology & Engineering
ISBN : 3319445847

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3D Microelectronic Packaging by Yan Li,Deepak Goyal Pdf

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

RF and Microwave Microelectronics Packaging

Ken Kuang,Franklin Kim,Sean S. Cahill
RF and Microwave Microelectronics Packaging Book PDF

Author : Ken Kuang,Franklin Kim,Sean S. Cahill
Publisher : Springer Science & Business Media
Page : 295 pages
File Size : 51,9 Mb
Release : 2009-12-01
Category : Technology & Engineering
ISBN : 9781441909848

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RF and Microwave Microelectronics Packaging by Ken Kuang,Franklin Kim,Sean S. Cahill Pdf

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Kim S. Siow
Die Attach Materials for High Temperature Applications in Microelectronics Packaging Book PDF

Author : Kim S. Siow
Publisher : Springer
Page : 279 pages
File Size : 44,6 Mb
Release : 2019-01-29
Category : Technology & Engineering
ISBN : 9783319992563

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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging by Kim S. Siow Pdf

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Advanced Electronic Packaging

Richard K. Ulrich,William D. Brown
Advanced Electronic Packaging Book PDF

Author : Richard K. Ulrich,William D. Brown
Publisher : John Wiley & Sons
Page : 852 pages
File Size : 50,9 Mb
Release : 2006-02-24
Category : Technology & Engineering
ISBN : 9780471466093

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Advanced Electronic Packaging by Richard K. Ulrich,William D. Brown Pdf

As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Hermeticity Testing of MEMS and Microelectronic Packages

Suzanne Costello,Marc P.Y. Desmulliez
Hermeticity Testing of MEMS and Microelectronic Packages Book PDF

Author : Suzanne Costello,Marc P.Y. Desmulliez
Publisher : Artech House
Page : 197 pages
File Size : 47,7 Mb
Release : 2013-10-01
Category : Technology & Engineering
ISBN : 9781608075270

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Hermeticity Testing of MEMS and Microelectronic Packages by Suzanne Costello,Marc P.Y. Desmulliez Pdf

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today’s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.

Thermal Stress and Strain in Microelectronics Packaging

John Lau
Thermal Stress and Strain in Microelectronics Packaging Book PDF

Author : John Lau
Publisher : Springer Science & Business Media
Page : 904 pages
File Size : 45,9 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781468477672

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Thermal Stress and Strain in Microelectronics Packaging by John Lau Pdf

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

Quality Conformance and Qualification of Microelectronic Packages and Interconnects

Michael Pecht,Abhijit Dasgupta,John W. Evans,Jillian Y. Evans
Quality Conformance and Qualification of Microelectronic Packages and Interconnects Book PDF

Author : Michael Pecht,Abhijit Dasgupta,John W. Evans,Jillian Y. Evans
Publisher : John Wiley & Sons
Page : 498 pages
File Size : 54,7 Mb
Release : 1994-12-13
Category : Technology & Engineering
ISBN : 0471594369

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Quality Conformance and Qualification of Microelectronic Packages and Interconnects by Michael Pecht,Abhijit Dasgupta,John W. Evans,Jillian Y. Evans Pdf

All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.

RF and Microwave Microelectronics Packaging II

Ken Kuang,Rick Sturdivant
RF and Microwave Microelectronics Packaging II Book PDF

Author : Ken Kuang,Rick Sturdivant
Publisher : Springer
Page : 172 pages
File Size : 54,9 Mb
Release : 2017-03-09
Category : Technology & Engineering
ISBN : 9783319516974

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RF and Microwave Microelectronics Packaging II by Ken Kuang,Rick Sturdivant Pdf

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Thermal Management of Microelectronic Equipment

Lian-Tuu Yeh,Richard C. Chu
Thermal Management of Microelectronic Equipment Book PDF

Author : Lian-Tuu Yeh,Richard C. Chu
Publisher : American Society of Mechanical Engineers
Page : 456 pages
File Size : 53,9 Mb
Release : 2002
Category : Science
ISBN : UOM:39015055457355

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Thermal Management of Microelectronic Equipment by Lian-Tuu Yeh,Richard C. Chu Pdf

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.