Modeling And Simulation For Microelectronic Packaging Assembly

Author : Shen Liu,Yong Liu
Publisher : John Wiley & Sons
Page : 586 pages
File Size : 42,5 Mb
Release : 2011-08-24
Category : Technology & Engineering
ISBN : 9780470828410

Get Book

Modeling and Simulation for Microelectronic Packaging Assembly by Shen Liu,Yong Liu Pdf

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Author : Anonim
Publisher : Unknown
Page : 576 pages
File Size : 48,5 Mb
Release : 2011
Category : Electronic
ISBN : OCLC:756356493

Get Book

Modeling and Simulation for Microelectronic Packaging Assembly by Anonim Pdf

Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
Publisher : Woodhead Publishing
Page : 436 pages
File Size : 52,5 Mb
Release : 2019-11-14
Category : Technology & Engineering
ISBN : 9780081025338

Get Book

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore by Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao Pdf

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

Author : Pietro Salvo,Miguel Hernandez-Silveira
Publisher : CRC Press
Page : 243 pages
File Size : 53,6 Mb
Release : 2017-11-22
Category : Technology & Engineering
ISBN : 9781351830232

Get Book

Wireless Medical Systems and Algorithms by Pietro Salvo,Miguel Hernandez-Silveira Pdf

Wireless Medical Systems and Algorithms: Design and Applications provides a state-of-the-art overview of the key steps in the development of wireless medical systems, from biochips to brain–computer interfaces and beyond. The book also examines some of the most advanced algorithms and data processing in the field. Addressing the latest challenges and solutions related to the medical needs, electronic design, advanced materials chemistry, wireless body sensor networks, and technologies suitable for wireless medical devices, the text: Investigates the technological and manufacturing issues associated with the development of wireless medical devices Introduces the techniques and strategies that can optimize the performances of algorithms for medical applications and provide robust results in terms of data reliability Includes a variety of practical examples and case studies relevant to engineers, medical doctors, chemists, and biologists Wireless Medical Systems and Algorithms: Design and Applications not only highlights new technologies for the continuous surveillance of patient health conditions, but also shows how disciplines such as chemistry, biology, engineering, and medicine are merging to produce a new class of smart devices capable of managing and monitoring a wide range of cognitive and physical disabilities.

Author : Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 662 pages
File Size : 50,9 Mb
Release : 1997-01-31
Category : Computers
ISBN : 0412084511

Get Book

Microelectronics Packaging Handbook by Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Author : Shichun Qu,Yong Liu
Publisher : Springer
Page : 336 pages
File Size : 41,8 Mb
Release : 2014-09-10
Category : Technology & Engineering
ISBN : 9781493915569

Get Book

Wafer-Level Chip-Scale Packaging by Shichun Qu,Yong Liu Pdf

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Author : Yan Li,Deepak Goyal
Publisher : Springer
Page : 463 pages
File Size : 49,5 Mb
Release : 2017-01-20
Category : Technology & Engineering
ISBN : 9783319445861

Get Book

3D Microelectronic Packaging by Yan Li,Deepak Goyal Pdf

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Author : Yong Liu
Publisher : Springer Science & Business Media
Page : 606 pages
File Size : 51,9 Mb
Release : 2012-02-15
Category : Technology & Engineering
ISBN : 9781461410522

Get Book

Power Electronic Packaging by Yong Liu Pdf

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Author : E-H Wong,Y.-W. Mai
Publisher : Woodhead Publishing
Page : 482 pages
File Size : 53,7 Mb
Release : 2015-05-23
Category : Technology & Engineering
ISBN : 9780857099112

Get Book

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture by E-H Wong,Y.-W. Mai Pdf

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Author : Rao R. Tummala,Eugene J. Raymaszewski
Publisher : Unknown
Page : 128 pages
File Size : 48,7 Mb
Release : 1997
Category : Electronic
ISBN : 0412844311

Get Book

Microelectronics Packaging Handbook by Rao R. Tummala,Eugene J. Raymaszewski Pdf

Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 1060 pages
File Size : 51,8 Mb
Release : 2013-11-27
Category : Computers
ISBN : 9781461560371

Get Book

Microelectronics Packaging Handbook by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Author : Tai-Ran Hsu
Publisher : John Wiley & Sons
Page : 576 pages
File Size : 49,7 Mb
Release : 2008-03-17
Category : Technology & Engineering
ISBN : 9780470083017

Get Book

MEMS and Microsystems by Tai-Ran Hsu Pdf

Technology/Engineering/Mechanical A bestselling MEMS text...now better than ever. An engineering design approach to Microelectromechanical Systems, MEMS and Microsystems remains the only available text to cover both the electrical and the mechanical aspects of the technology. In the five years since the publication of the first edition, there have been significant changes in the science and technology of miniaturization, including microsystems technology and nanotechnology. In response to the increasing needs of engineers to acquire basic knowledge and experience in these areas, this popular text has been carefully updated, including an entirely new section on the introduction of nanoscale engineering. Following a brief introduction to the history and evolution of nanotechnology, the author covers the fundamentals in the engineering design of nanostructures, including fabrication techniques for producing nanoproducts, engineering design principles in molecular dynamics, and fluid flows and heat transmission in nanoscale substances. Other highlights of the Second Edition include: * Expanded coverage of microfabrication plus assembly and packaging technologies * The introduction of microgyroscopes, miniature microphones, and heat pipes * Design methodologies for thermally actuated multilayered device components * The use of popular SU-8 polymer material Supported by numerous examples, case studies, and applied problems to facilitate understanding and real-world application, the Second Edition will be of significant value for both professionals and senior-level mechanical or electrical engineering students.

Author : Charles Ume,Chao-pin Yeh
Publisher : Unknown
Page : 142 pages
File Size : 55,6 Mb
Release : 1996
Category : Technology & Engineering
ISBN : UOM:39015050162000

Get Book

Sensing, Modeling, and Simulation in Emerging Electronic Packaging by Charles Ume,Chao-pin Yeh Pdf

Presents 15 papers from the November 1996 congress reflecting the state-of-the-art modeling, simulation, and sensing technologies used in emerging electronic packaging applications, especially flip chip and ball grid array (BGA). Subjects include curing analysis of a flip- chip-on-board electronic p

Author : Gerard Kelly
Publisher : Springer Science & Business Media
Page : 143 pages
File Size : 47,7 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461550112

Get Book

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages by Gerard Kelly Pdf

One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done? Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and behaviour of parts before manufacture, whilst minimising the amount of time and money invested in undertaking costly experimental trials. In a high volume production environment, any design improvement that increases yield and reliability can be of immense benefit to the manufacturer. Components and systems need to be packaged to protect the IC from its environment. Encapsulating devices in plastic is very cheap and has the advantage of allowing them to be produced in high volume on an assembly line. Currently 95% of all ICs are encapsulated in plastic. Plastic packages are robust, light weight, and suitable for automated assembly onto printed circuit boards. They have developed from low pincount (14-28 pins) dual-in-line (DIP) packages in the 1970s, to fine pitch PQFPs (plastic quad flat pack) and TQFPs (thin quad flat pack) in the 1980s-1990s, with leadcounts as high as 256. The demand for PQFPs in 1997 was estimated to be 15 billion and this figure is expected to grow to 20 billion by the year 2000.

Author : Mohd N. Tamin,Norhashimah M. Shaffiar
Publisher : Springer Science & Business
Page : 179 pages
File Size : 41,6 Mb
Release : 2014-04-26
Category : Technology & Engineering
ISBN : 9783319000923

Get Book

Solder Joint Reliability Assessment by Mohd N. Tamin,Norhashimah M. Shaffiar Pdf

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.