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Author : Anonim
Publisher : Unknown
Page : 224 pages
File Size : 44,9 Mb
Release : 1997
Category : Electronic packaging
ISBN : CORNELL:31924079773507
Author : Anonim
Publisher : Unknown
Page : 182 pages
File Size : 45,8 Mb
Release : 1997
Category : Electronic packaging
ISBN : OCLC:959741296
Author : Anonim
Publisher : Unknown
Page : 322 pages
File Size : 46,8 Mb
Release : 2005
Category : Electronic packaging
ISBN : UOM:39015064359949
Author : Anonim
Publisher : Unknown
Page : 183 pages
File Size : 42,5 Mb
Release : 1997
Category : Electronic packaging
ISBN : OCLC:36632724
Author : Anonim
Publisher : International Society of Hybrid
Page : 349 pages
File Size : 44,5 Mb
Release : 2000
Category : Technology & Engineering
ISBN : 0930815599
These conference proceedings cover such topics as: high density packaging materials; automotive electronics; system level packaging; chip scale packaging; optoelectronics; power packaging; sensors; actuators, and MEMS; flex circuits; and thermal management.
Author : Anonim
Publisher : IEEE Computer Society Press
Page : 281 pages
File Size : 50,8 Mb
Release : 2004-01-01
Category : Electronic packaging
ISBN : 0780384369
Author : Components, Packaging, and Manufacturing Technology Society,Semiconductor Equipment and Materials International,Components, Packaging & Manufacturing Technology Society. Santa Clara Valley Chapter,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 132 pages
File Size : 43,5 Mb
Release : 2007
Category : Electronic packaging
ISBN : 1424413389
Author : Anonim
Publisher : Unknown
Page : 488 pages
File Size : 41,6 Mb
Release : 2011
Category : Electronic packaging
ISBN : OCLC:775357733
Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 53,6 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 43,8 Mb
Release : 1999
Category : Electronic
ISBN : 0930815564
Author : Ho-Ming Tong,Yi-Shao Lai,C.P. Wong
Publisher : Springer Science & Business Media
Page : 562 pages
File Size : 50,5 Mb
Release : 2013-03-20
Category : Technology & Engineering
ISBN : 9781441957689
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author : Components, Packaging & Manufacturing Technology Society,IEEE Electrical Insulation Society Staff,Yixiong Huang,ieee,Institute of Electrical and Electronics Engineers
Publisher : Unknown
Page : 488 pages
File Size : 45,5 Mb
Release : 2011-11
Category : Electronic
ISBN : 1467301485
Author : John D. Cressler,H. Alan Mantooth
Publisher : CRC Press
Page : 1041 pages
File Size : 41,7 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781439874318
Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Author : Avram Bar-Cohen,Jeffrey C. Suhling,Andrew A. O. Tay
Publisher : World Scientific
Page : 1079 pages
File Size : 54,7 Mb
Release : 2019
Category : Packaging
ISBN : 9789811209635
"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website
Author : M O Alam,C Bailey
Publisher : Elsevier
Page : 279 pages
File Size : 42,8 Mb
Release : 2011-05-25
Category : Technology & Engineering
ISBN : 9780857092892
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
